用SnPbAg和SnAgCu焊料制作的焊锡键之间的差异

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI:10.1109/ISSE.2004.1490858

L. Tersztyanszky

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引用次数: 0

摘要

由于立法和市场趋势，每个电子产品组装商都必须将含铅焊料改为无铅焊料。近年来，许多制造商只是在等待，他们对无铅焊料的行为知之甚少或一无所知。然而，现在有必要使用无铅焊料，因为RoHS和WEEE指令将于2006年7月生效。为了揭示广泛使用的工业SnPbAg和SnAgCu钎料之间的特殊差异，设计了用于传统SMT器件的测试PCB，并使用IR回流技术对这两种合金进行了实验焊接。

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Differences between solder bonds made with SnPbAg and SnAgCu solders

Due to legislation and market trends, every electronic appliance assembler has to change leaded solders to lead free. In recent years, a number of manufacturers were simply waiting, and they know little or nothing about the behavior of lead free solders. However, there is now a necessity for lead free solders because the RoHS and WEEE directives are coming into effect by July 2006. To bring to light the particular differences between widely used industrial SnPbAg and SnAgCu solders, a test PCB for conventional SMT devices was designed and experimental soldering was done by IR reflow technology with both alloys.

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27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.

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