2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)最新文献_第2页

Stable simulation of nonlinearly loaded lossy transmission lines with time marching approach 时间推进法非线性负载损耗输电线路的稳定仿真

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571655

Juan Becerra, A. Tatematsu, F. Vega, F. Rachidi

引用次数: 4

Impact of dynamic power supply noise induced by clock networks on clock jitter and timing margin 时钟网络引起的动态电源噪声对时钟抖动和时间裕度的影响

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571608

Yujeong Shim, D. Oh

{"title":"Impact of dynamic power supply noise induced by clock networks on clock jitter and timing margin","authors":"Yujeong Shim, D. Oh","doi":"10.1109/ISEMC.2016.7571608","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571608","url":null,"abstract":"Timing closure on on-chip critical paths becomes more challenging as both data and clock jitter increase due to a large power supply noise. There have been intensive studies to model timing impact of power supply noise on the logic timing. Unlike the flip flops and combinational logics placed and routed randomly, the global networks including the clock buffers are usually custom design based so that they are placed regularly and densely. In the FPGAs, the multiple global networks up to 32 are routed in parallel as the chip size grows and number of transistors increase enormously. Since the clock buffers are placed very closely, a voltage drop of the power supply by the adjacent clock buffers switching makes the clock edge slow, when the clock edges of the victim and aggressors are aligned. This slowed down clock eats away setup the timing margin loss. The behavior of this noise impact is similar with signal to signal cross talk. In this paper, the supply noise impact due to the switching noise by the adjacent clock buffers is demonstrated by simulation and measurement. And it is described how to implement timing impact into STA (Static Timing Analysis) flow.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114352718","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Full-wave modeling of bulk current injection probe coupling to multi-conductor cable bundles 多导体电缆束大电流注入探头耦合的全波建模

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571746

Patrick DeRoy, Scott Piper

引用次数: 7

Extension of the IEC 61000-4-20 Annex C to the use of arbitrary transient signals IEC 61000-4-20附录C扩展到任意暂态信号的使用

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571757

Niklas Briest, H. Garbe, D. Hamann, S. Potthast

{"title":"Extension of the IEC 61000-4-20 Annex C to the use of arbitrary transient signals","authors":"Niklas Briest, H. Garbe, D. Hamann, S. Potthast","doi":"10.1109/ISEMC.2016.7571757","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571757","url":null,"abstract":"Transverse electromagnetic (TEM) waveguides, especially gigahertz TEM (GTEM) cells, are predominantly used for emission and immunity tests. General requirements for such a GTEM cell are given by the IEC 61000-4-20. Annex C of the IEC 61000-4-20 specifies immunity tests based on high-altitude electromagnetic pulses (HEMP) with a double exponential waveform. This waveform's shape is sufficiently defined by rise time and pulse width. The quality of its transmission within a waveguide can be expressed by the variation of these parameters. However, other arbitrary signals cannot be reduced to just these characteristic parameters. In this paper a method is described that offers the possibility to characterize the transmission quality of a GTEM cell for arbitrary transient waveforms. It is based on the Pearson Correlation Coefficient (PCC) of a so-called reference signal and the signals being measured within the test volume of a GTEM cell. Both signals are measured simultaneously with identical field probes in order to be independent from the reproducibility of the signal generator. The signals are windowed and limited to include only the defining reflections and distortions. By means of this signal dedicated validation procedure, the transmission quality of a TEM waveguide can be validated for an arbitrary transient waveform.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130436603","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Analytical and numerical sensitivity analyses of fixtures de-embedding 夹具去埋的解析和数值敏感性分析

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571688

Bichen Chen, M. Tsiklauri, Chunyu Wu, Shuai Jin, J. Fan, X. Ye, Bill Samaras

引用次数: 28

Modeling and optimization of TSV for crosstalk mitigation in 3D neuromorphic system 三维神经形态系统串扰抑制的TSV建模与优化

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571720

M. Ehsan, Zhen Zhou, Yang Yi

{"title":"Modeling and optimization of TSV for crosstalk mitigation in 3D neuromorphic system","authors":"M. Ehsan, Zhen Zhou, Yang Yi","doi":"10.1109/ISEMC.2016.7571720","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571720","url":null,"abstract":"Neuromorphic computing is an emerging technology that describes the biological neural systems and implementation of its electrical model in complementary metal-oxide-semiconductor (CMOS) VLSI system. Three dimensional (3D) integration can be applied in hardware implementation of neuromorphic computing that provides high device interconnection density using fast and energy efficient links with excellent distribution and communication among the neuron layers. In this work, we studied the necessities of neuromorphic computing based on 3D integration technology, design challenges, and a possible solution to overcome the effect of huge parallelism of well-connected synaptic system. Using the force directed optimization algorithm, an optimal interconnect array pattern is identified for a proposed structure that could mitigate significant amount of crosstalk. For the analysis of crosstalk, an electrical model of the optimal array structure is proposed and it has been validated by comparing its simulation results with those extracted from commercial tools. This work can be used as a basis study for successful implementation of next generation 3D neuromorphic computation for high performance application.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132076643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

An indirect measurement method for multiport S-parameters with reduced number of measurements 一种减少测量次数的多端口s参数间接测量方法

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571626

N. Maeda, S. Fukui, T. Sekine, Yasuhiro Takahashi

引用次数: 3

Novel characterization technique with short and open standards 短标准、开放标准的新型表征技术

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571702

Shaowu Huang, X. Ye, Kai Xiao

引用次数: 0

5G wireless communications (60 GHz band) for smart grid — An EMC perspective 面向智能电网的5G无线通信(60ghz频段)——EMC视角

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571732

D. Moongilan

引用次数: 20

Parameter for near end crosstalk prediction in twisted pair cables 双绞线电缆近端串扰预测参数

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571696

Olusegun Ogundapo, A. Duffy, C. Nche

引用次数: 6