2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)最新文献_第10页

High bandwidth low power interposer interconnect challenge, design, and validation in 3D silicon stacked interconnect (SSI) technology 3D硅堆叠互连(SSI)技术中的高带宽低功耗中间体互连挑战、设计和验证

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571687

Anna Wong, Gordon Tsui, Boon-Kai Soo, Chong-Ling Khoo, Yong Wang

引用次数: 3

Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack 在没有完整软件堆栈的情况下预测集成电路软失效敏感性的测量技术

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571597

Suyu Yang, Benjamin J. Orr, Yuangdong Guo, Yilong Zhang, D. Pommerenke, H. Shumiya, J. Maeshima, Taketoshi Sekine, Y. Takita, K. Araki

引用次数: 11

High-speed bus signal integrity compliance using a frequency-domain model 高速总线信号完整性符合性使用频域模型

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571594

Si T. Win, J. Hejase, W. Becker, Glen A. Wiedemeier, D. Dreps, J. Myers, K. Willis, John Horner, A. Varma

{"title":"High-speed bus signal integrity compliance using a frequency-domain model","authors":"Si T. Win, J. Hejase, W. Becker, Glen A. Wiedemeier, D. Dreps, J. Myers, K. Willis, John Horner, A. Varma","doi":"10.1109/ISEMC.2016.7571594","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571594","url":null,"abstract":"A new technique for frequency-domain compliance testing of high-speed differential interfaces is implemented in a signal integrity simulation tool that can accurately predict a channel's bit-error rate (BER) from seven frequency-domain parameters. This greatly increases the speed and efficiency of designing the number of computer systems required for custom configurations in scale-out data centers. The compliance method is tested with three example case studies in channel printed circuit board (PCB) design. These three studies are: finding maximum loss due to routable trace length as a function of wiring depth layer (which affects crosstalk), finding the maximum routable length when introducing reflections and crosstalk due to adding a connector in the channel, and finding what amount of skew introduced by asymmetry in a differential pair for reasons such as the glass weave or different copper lengths under which a channel can still operate. The pass/fail frequency compliance results are discussed and compared with the time-domain simulation results of the channels tested.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"2 1-2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115313736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Research on digital video signal electromagnetic information leakage based on DVI 基于DVI的数字视频信号电磁信息泄漏研究

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571715

Sen Wang, Y. Qiu, Jin Tian, Qinglin Xu

引用次数: 1

Radiated immunity of the Gigabit Ethernet Switch embedded in an industrial programmable logic controller 嵌入工业可编程逻辑控制器的千兆以太网交换机的辐射抗扰度

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571709

Massiva Zouaoui, E. Sicard, G. Jacquemod, Ghislain Rudelou, Emmanuel Marsy, H. Braquet

引用次数: 0

Millimeter-wave broadband transition of stripline and CPWG on thin-to-thick substrates 薄到厚基板上带状线和CPWG的毫米波宽带跃迁

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571705

N. Ghassemi, H. Tournier

{"title":"Millimeter-wave broadband transition of stripline and CPWG on thin-to-thick substrates","authors":"N. Ghassemi, H. Tournier","doi":"10.1109/ISEMC.2016.7571705","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571705","url":null,"abstract":"In many applications such as chip (or package) to PCB transition, due to the small pitch size of the chip (or package), very narrow 50 Ω; stripline or grounded coplanar waveguide (CPWG) is required. In order to reduce the line width, stripline or CPWG should be fabricated on thin substrate (in case of CPWG because minimum manufacturable gap is limited in normal low cost PCB technology). On the other hand using thin substrate increases metallic loss of CPWG and stripline, which is important especially at millimeter wave, and long channels, then it, is preferred to use thick substrate to reduce metallic loss. Also for many applications such as printed circuit antenna, thick substrate is preferred because it can increase the bandwidth and gain of the antenna. Then a broadband transition from stripline (or CPWG) on thin to thick substrate is needed. This paper presents a low-loss, broadband transition of stripline (and CPWG) on thin-to-thick substrates. Measurement results show that the proposed transitions have less than 0.1 dB insertion loss up to 40 GHz. Several TRL kits are used to de-embed the effect of connectors and probes.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116344104","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

A new method to calculate phase center locations for arbitrary antenna systems and scenarios 一种计算任意天线系统和场景下相位中心位置的新方法

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571729

D. Harke, H. Garbe, Prashant Chakravarty

{"title":"A new method to calculate phase center locations for arbitrary antenna systems and scenarios","authors":"D. Harke, H. Garbe, Prashant Chakravarty","doi":"10.1109/ISEMC.2016.7571729","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571729","url":null,"abstract":"Accurately setting up antenna measurement procedures and maintaining good performance of radar navigation systems are two examples of tasks relying on precise knowledge of the phase center (PC) location. Currently this problem is discussed particularly in 3 m-electromagnetic compatibility (EMC) field emission measurement, when an exact distance between test antenna and the equipment under test (EUT) is needed. If, in an electromagnetic scenario, a point can be found behaving like an isotropic radiator emitting spherical waves, this point is called the PC. Since many methods to find the PC are prone to various limitations, this paper proposes an algorithm able to handle discretionary systems. Directions of multiple far field Poynting vectors are evaluated in order to backtrack the location from where electromagnetic energy seems to emanate. Simulations with the electromagnetics software FEKO generate input data for the evaluation process. Fast convergence and repeatable, reasonable results are achieved. As a small amount of data is sufficient to calculate reliable PC locations and this reduces the required measurement effort, practical applicability is ensured.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121100217","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Compact inductors deembedded with asymmetric through-only structures 紧凑型电感去嵌不对称的仅通结构

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571689

John Yan, Arash Zargaran-Yazd

引用次数: 1

Simulation of ESD coupling into cables based on ISO 10605 standard using method of moments 基于ISO 10605标准的电缆ESD耦合仿真

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571734

I. Oganezova, G. Shen, S. Yang, D. Pommerenke, V. Khilkevich, R. Jobava

引用次数: 4

A new efficient interesting points enhanced electromagnetic attack on AT89S52 在AT89S52上实现了一种新的高效点增强电磁攻击

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571639

Changhai Ou, Zhu Wang, Degang Sun, Xinping Zhou, J. Ai

引用次数: 1