2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)最新文献_第9页

Millimeter-wave emissions measurement challenges for FCC intentional radiator compliance FCC有意散热器合规性的毫米波发射测量挑战

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571565

M. Terrien

引用次数: 0

Evaluation of 3D printing technology for corrugated horn antenna manufacturing 3D打印波纹喇叭天线制造技术评价

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571653

E. Decrossas, T. Reck, Choonsup Lee, C. Jung-Kubiak, I. Mehdi, G. Chattopadhyay

引用次数: 19

Wideband radar absorbing panels with lossy multilayer graphene and carbon nanofiber-based coating 有损耗的多层石墨烯和碳纳米纤维涂层的宽带雷达吸收板

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571651

A. Proietti, A. Rinaldi, A. Tamburrano, G. De Bellis, M. S. Sarto

引用次数: 3

IEC 61000-4-2 ESD test in display down configurationfor cell phones IEC 61000-4-2手机显示down配置中的ESD测试

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571736

Jianchi Zhou, Satyajeet Shinde, Yuandong Guo, A. Talebzadeh, Shubhankar Marathe, Y. Gan, Ki-Hyuk Kim, D. Pommerenke

{"title":"IEC 61000-4-2 ESD test in display down configurationfor cell phones","authors":"Jianchi Zhou, Satyajeet Shinde, Yuandong Guo, A. Talebzadeh, Shubhankar Marathe, Y. Gan, Ki-Hyuk Kim, D. Pommerenke","doi":"10.1109/ISEMC.2016.7571736","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571736","url":null,"abstract":"During the IEC 61000-4-2 test the DUT is placed on a 0.5 mm insulating sheet, which is on the horizontal coupling plane (HCP). For discharge points on the back side of the phone this leads to a situation in which the display is facing the HCP. The phone or tablet forms a capacitance between 50 pF and 300 pF to the HCP. The capacitance value depends on the size of the phone, its screen flatness, and the flatness of the insulator which may deteriorate over time. The discharges to the phone lead to a large displacement current flowing through the display. This current has multiple paths to the body of the phone: via the touch electronics, via the display electronics, and directly to the body of the phone. As these currents can reach 30 A (at 8 kV contact mode) they can lead to upset and damage of both the display and the touch layers. This paper provides analysis of the display down test situation in order to show reproducibility problems. The effect of the capacitance variation is shown by the measurement and the PSPICE model. Full-wave model was used to help understand how much of the total current flows through the body of the phone. The Lichtenberg dust figure method was used to show the contribution of the corona discharge.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126642075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Performance test of unmanned aerial systems communication links in a severe multipath environment 无人机系统通信链路在恶劣多径环境下的性能测试

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571763

Jacob N. Dixon, V. Rajamani, C. Bunting

引用次数: 6

Employment of microwave absorbers for EMI/RFI mitigations from high speed digital buses with signal integrity considerations 考虑信号完整性的高速数字总线的EMI/RFI缓解微波吸收器的使用

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571564

M. Khorrami, P. Dixon, Todd W. Steigerwald, Haris Chowdhry

{"title":"Employment of microwave absorbers for EMI/RFI mitigations from high speed digital buses with signal integrity considerations","authors":"M. Khorrami, P. Dixon, Todd W. Steigerwald, Haris Chowdhry","doi":"10.1109/ISEMC.2016.7571564","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571564","url":null,"abstract":"An analysis of electromagnetic radiation reduction achieved by placement of microwave absorbers over a serial high speed digital channel is performed. The study is performed on a second generation peripheral component interconnect express (PCIe Gen II) interface with 5.0 Gbps transfer rate. A set of full wave simulations are performed on a printed circuit board with the PCIe interface implemented in an embedded micro-strip line structure. Lossy material patches are applied onto the channel to reduce the electromagnetic radiations from differential pairs. This reduction might be required especially in compact mixed signal systems as noisy digital circuits are located close to radio-frequency receivers with stringent sensitivity limits. Using the numerical solver, it has been shown that the application of the absorber can reduce the magnitude of the received electromagnetic fields at the desired locations while unfortunately affecting the signal integrity performance of the bus. In order to reduce the unintentional discontinuity introduced along the differential pairs as applying the material on the PCB, the insertion of a dielectric spacer sheet between the absorber and the solder mask is investigated. It has been shown that the presence of a thin layer of the spacer (less than 0.2mm) can significantly decrease the introduced mismatch while still keeping the benefit of the EM reduction. Full wave simulation results are being confirmed by near field probing set-up and a PCIe compliance test board.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117164635","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Correlation of crosstalk and power noise induced ringback and jitter in an LPDDR interface LPDDR接口中串扰与功率噪声引起的环回和抖动的相关性

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571749

L. G. Romo, Scott Powers, T. Michalka, C. Chai, Denny Kurniawan

引用次数: 0

Estimating the near field coupling from SMPS circuits to a nearby antenna using dipole moments 利用偶极矩估计SMPS电路与附近天线的近场耦合

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571672

Chunyu Wu, Yansheng Wang, L. Li, Jingnan Pan, J. Fan, Lijuan Qu, J. Eriksson

引用次数: 17

Eye-diagram estimation and analysis of High-Bandwidth Memory (HBM) interposer channel with crosstalk reduction schemes on 2.5D and 3D IC 2.5D和3D集成电路上具有串扰抑制方案的HBM中间通道眼图估计与分析

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571685

Sumin Choi, Heegon Kim, D. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim

{"title":"Eye-diagram estimation and analysis of High-Bandwidth Memory (HBM) interposer channel with crosstalk reduction schemes on 2.5D and 3D IC","authors":"Sumin Choi, Heegon Kim, D. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim","doi":"10.1109/ISEMC.2016.7571685","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571685","url":null,"abstract":"In this paper, eye-diagrams of High-Bandwidth Memory (HBM) interposer channel with crosstalk reduction schemes on 2.5D / 3D IC are estimated and analyzed. As data rate increases and metal-to-metal space decreases to achieve higher system bandwidth, crosstalk effects degrade the signal integrity. Therefore, estimation and reduction of the crosstalk effects are essential on HBM interposer channel. In order to estimate crosstalk effects in short time with high accuracy, PDA-based estimation method is proposed. In addition to the proposed method, wide space and guard trace with ground vias structures are suggested and compared based on the estimated eye-diagrams. With the estimated eye-diagrams, voltage fluctuation on DC levels due to the crosstalk effects can be analyzed. Worst and statistical eye-diagrams of interposer channels including crosstalk effects are estimated. Since the proposed method needs only output and crosstalk response of the channel, the proposed method can be applied to multiple wide I/O channels.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130460291","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Sub-THz interconnect channel for planar chip-to-chip communication 用于平面芯片对芯片通信的亚太赫兹互连通道

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571770

Bo Yu, Y. Ye, X. Liu, Q. Gu

引用次数: 2