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2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)最新文献

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Time domain measurement of shielded cables with connectors 带连接器的屏蔽电缆的时域测量
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571634
E. Savage, W. Radasky, Rick Willliamson
{"title":"Time domain measurement of shielded cables with connectors","authors":"E. Savage, W. Radasky, Rick Willliamson","doi":"10.1109/ISEMC.2016.7571634","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571634","url":null,"abstract":"For an IEMI/HEMP hardened building, external cabling should be enclosed in shield to protect against coupling of high-level transients. The US military standard requires solid conduits, with welded end connections. This paper discusses the use of time domain (transient pulses) laboratory measurements of the protection provided by the cable and connector shielding. Sample results are shown for shielded cables that use non-welded end connections.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123710463","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Resonant EBG-based common mode filter for LTCC substrates LTCC基板谐振型ebg共模滤波器
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571700
C. Olivieri, F. de Paulis, A. Orlandi, S. Connor, B. Archambeault, D. Pommerenke
{"title":"Resonant EBG-based common mode filter for LTCC substrates","authors":"C. Olivieri, F. de Paulis, A. Orlandi, S. Connor, B. Archambeault, D. Pommerenke","doi":"10.1109/ISEMC.2016.7571700","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571700","url":null,"abstract":"To develop usable EBG-based common mode fliters miniaturization is required. In this paper is introduced a quarter-wavelength resonant EBG-based common mode filter on LTCC substrate whose dimensions are miniaturized according a systematic stepped procedure. Results in terms of common mode attenuation and differential mode transmission are presented. Consideration is also given to the decreasing of the direct radiation.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"394 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128578326","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Field levels in the vicinity of wearable radio transmitters worn by uniformed personnel 穿制服人员佩戴的可穿戴无线电发射机附近的现场水平
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571616
K. Y. Sze
{"title":"Field levels in the vicinity of wearable radio transmitters worn by uniformed personnel","authors":"K. Y. Sze","doi":"10.1109/ISEMC.2016.7571616","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571616","url":null,"abstract":"This is a computational electromagnetic study on excessive electric field levels in the vicinity of wearable radio transmitters worn by uniformed personnel. It involves the calculations of theoretical near-field levels at points confined within the zone in-between personnel individual. This analysis is performed using limited computational hardware resources, which is thus reflected in the modelling procedure used.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129394797","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Via pattern design and optimization for differential signaling 25Gbps and above 通过模式设计和优化差分信号25Gbps及以上
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571665
C. Ye, X. Ye, Enrique Lopez Miralrio
{"title":"Via pattern design and optimization for differential signaling 25Gbps and above","authors":"C. Ye, X. Ye, Enrique Lopez Miralrio","doi":"10.1109/ISEMC.2016.7571665","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571665","url":null,"abstract":"Ground via design rules may need to be re-visited to support high-speed signaling for 25Gbps and above, according to our experience. In this paper, the study begins with some basic via patterns with different ground via placement to investigate loss, crosstalk, common mode, and electromagnetic field distribution to help understand the underlying physics. The benefit of joint anti-pad is also analyzed for signaling at 25Gbps and above. Impact of adjacent vias to the modeled via pair of interest is studied and it is found that the adjacent vias should be properly terminated and included in the modeling. Finally crosstalk study is performed for the given via patterns.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128821920","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
An adaptive singular value decomposition-based method to enhance correlation electromagnetic analysis 基于自适应奇异值分解增强相关电磁分析的方法
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571638
Xinping Zhou, Degang Sun, Zhu Wang, Changhai Ou, J. Ai, V. DeBrunner, Chonghua Wang
{"title":"An adaptive singular value decomposition-based method to enhance correlation electromagnetic analysis","authors":"Xinping Zhou, Degang Sun, Zhu Wang, Changhai Ou, J. Ai, V. DeBrunner, Chonghua Wang","doi":"10.1109/ISEMC.2016.7571638","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571638","url":null,"abstract":"Electromagnetic analysis in side channel attack exploits the information of electromagnetic radiation that leaks from the cryptographic devices when they are running. It's no-table because of its efficiency and easiness to perform. Correlation electromagnetic analysis (CEMA) is of the most effective means in electromagnetic analysis. However, the efficiency of traditional CEMA is limited by some insignificant' electromagnetic traces. It is necessary to select the helpful subset of the electromagnetic traces for analysis rather than using the whole electromagnetic traces set to improve the efficiency. In this paper, we first give an proposition about the CEMA and prove it by mathematical theory. This proposition illustrates the feasibility of selecting electromagnetic traces. Then we propose a method that is based on Singular Value Decomposition to select electromagnetic traces. This method is adaptive and doesn't need any external parameter. Besides, this method is useful for analyzing both unprotected implementation and masked implementation. We carry out the practical experiments by our SVD-CEMA and CEMA in the same scenario. The experimental results verify that the key-recovery efficiency of our method is higher than CEMA.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124809787","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Differential probe characterization 差分探针特性
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571748
Qian Wang, Yuanci Gao, J. Fan, J. Drewniak, Richard Zai
{"title":"Differential probe characterization","authors":"Qian Wang, Yuanci Gao, J. Fan, J. Drewniak, Richard Zai","doi":"10.1109/ISEMC.2016.7571748","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571748","url":null,"abstract":"In this paper, a novel probe without ground pins is proposed for differential signal measurement. An effective model for the differential probe is built in CST based on measured dimensions. To evaluate the electrical performance of the differential probe, a 4-port measurement is performed for a 1 inch differential pair using the probes. Simulation and measurement results match closely which further verifies the accuracy of the simulation model of both the differential probe and PCB under test. Guidance for launching footprint optimization of the differential probe can be extracted based on the sensitivity analysis results in terms of signal pad size, ground via size and ground pad size of the differential probes. Furthermore, loop inductance of the differential probe is evaluated from both 1-port measurement and simulation results.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131187227","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
A descriptor form implementation of PEEC models incorporating dispersive and lossy dielectrics 包含色散介质和损耗介质的PEEC模型的描述符形式实现
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571645
Andreas Hartman, J. Ekman, G. Antonini, D. Romano
{"title":"A descriptor form implementation of PEEC models incorporating dispersive and lossy dielectrics","authors":"Andreas Hartman, J. Ekman, G. Antonini, D. Romano","doi":"10.1109/ISEMC.2016.7571645","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571645","url":null,"abstract":"With rising frequencies involved in electronics, losses and dispersion exhibited by dielectrics become important to consider in electromagnetic modeling. The Partial Element Equivalent Circuit (PEEC) method is suitable for a mixed electromagnetic and circuit setting, forming equivalent circuits that can be interconnected with circuit elements. In this paper, a descriptor form representation of PEEC models incorporating dispersive and lossy dielectrics is developed. By representing the electrical permittivity with a Debye-Lorentz model equivalent circuits can be synthesized. The synthesized circuits for the permittivity are included in the PEEC equations by formulating the circuit equations for the additional circuit unknowns. This yields an input/output formulation that can handle an arbitrary number of finite dielectrics and be integrated by any kind of integration scheme. Furthermore, it offers a straightforward way to incorporate lossy and dispersive dielectrics into a PEEC solver compared to using recursive convolution. The proposed descriptor form representation is tested for a setup consisting of three microstrips over a ground plane, separated by a dielectric substrate. Both the ideal and the lossy and dispersive case are tested and compared. Furthermore, the proposed formulation is verified against an existing implementation in the frequency-domain. Good agreement between the proposed formulation and the existing frequency-domain PEEC formulation is obtained.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123615092","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Bursty jitter in high-speed I/O due to power-state transition and its impact on signal integrity 高速I/O中由于功率-状态转换引起的突发抖动及其对信号完整性的影响
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571697
A. Aydiner, Cheng Zhuo, W. Shih, Jason T. Kao, Raymond Law
{"title":"Bursty jitter in high-speed I/O due to power-state transition and its impact on signal integrity","authors":"A. Aydiner, Cheng Zhuo, W. Shih, Jason T. Kao, Raymond Law","doi":"10.1109/ISEMC.2016.7571697","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571697","url":null,"abstract":"Accurately predicting power supply noise (PSN) induced jitter is crucial to link signal integrity analysis. PSN induced jitter becomes more severe with a decreased supply level, or increased design density. It exhibits strong time dependence due to power management technique employed in low-power design. For the first time, the bursty nature of PSN-induced jitter during power-state transition is accurately accounted for in full-link signal-integrity analysis. We present that power state transition frequency has a major impact on I/O link total jitter. This phenomenon that will be demonstrated with jitter simulations can be utilized to prevent over-design provided architecture-level wake-up behavior is determined.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124941754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Conducted emission profile spectra analysis assessment of impulse transients 对脉冲瞬态进行发射轮廓光谱分析评估
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571761
L. Freeman, Thomas Wu
{"title":"Conducted emission profile spectra analysis assessment of impulse transients","authors":"L. Freeman, Thomas Wu","doi":"10.1109/ISEMC.2016.7571761","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571761","url":null,"abstract":"This paper discusses an approach to analyzing and assessing the frequency spectra of conducted emission profiles due to impulse transients caused by electrically fast transitions. The method discussed is to gauge such a transient's ability to create sufficient energy, high enough in frequency profile, to excite a circuit's resonance. This paper details aspects of the time to frequency domain transformation, key parameters of the circuit that influence this relationship as they relate to CE testing. Discussion of a novel approach is included to allow pre-compliance assessment using the impulse impedance for parallel and series capacitive coupled waveforms. Lastly detailed design considerations and guidelines are given.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123946313","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Preliminary application of machine-learning techniques for thermal-electrical parameter optimization in 3-D IC 机器学习技术在三维集成电路热电参数优化中的初步应用
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-09-22 DOI: 10.1109/ISEMC.2016.7571681
Sung Joo Park, Huan Yu, M. Swaminathan
{"title":"Preliminary application of machine-learning techniques for thermal-electrical parameter optimization in 3-D IC","authors":"Sung Joo Park, Huan Yu, M. Swaminathan","doi":"10.1109/ISEMC.2016.7571681","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571681","url":null,"abstract":"Three-dimensional (3-D) integration technique, a promising integration technique, can increase system density but at the cost of increased thermal and power density, leading to thermal-related problems. Design of three-dimensional integrated circuits and systems requires considerations of temperature and gradients observed across the die, because temperature gradients can vary the delay of clock paths. As we need to analyze a large number of parameters for thermal-electrical design, optimization of those parameters becomes important for achieving efficiency and accuracy. Machine learning methods have been applied in the past for artificial intelligence, data analysis, and for general optimization problems. In this paper we propose the application of machine learning methods for parameter optimization in 3-D systems.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130305904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
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