Via pattern design and optimization for differential signaling 25Gbps and above

C. Ye, X. Ye, Enrique Lopez Miralrio
{"title":"Via pattern design and optimization for differential signaling 25Gbps and above","authors":"C. Ye, X. Ye, Enrique Lopez Miralrio","doi":"10.1109/ISEMC.2016.7571665","DOIUrl":null,"url":null,"abstract":"Ground via design rules may need to be re-visited to support high-speed signaling for 25Gbps and above, according to our experience. In this paper, the study begins with some basic via patterns with different ground via placement to investigate loss, crosstalk, common mode, and electromagnetic field distribution to help understand the underlying physics. The benefit of joint anti-pad is also analyzed for signaling at 25Gbps and above. Impact of adjacent vias to the modeled via pair of interest is studied and it is found that the adjacent vias should be properly terminated and included in the modeling. Finally crosstalk study is performed for the given via patterns.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2016.7571665","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

Abstract

Ground via design rules may need to be re-visited to support high-speed signaling for 25Gbps and above, according to our experience. In this paper, the study begins with some basic via patterns with different ground via placement to investigate loss, crosstalk, common mode, and electromagnetic field distribution to help understand the underlying physics. The benefit of joint anti-pad is also analyzed for signaling at 25Gbps and above. Impact of adjacent vias to the modeled via pair of interest is studied and it is found that the adjacent vias should be properly terminated and included in the modeling. Finally crosstalk study is performed for the given via patterns.
通过模式设计和优化差分信号25Gbps及以上
根据我们的经验,接地设计规则可能需要重新考虑,以支持25Gbps及以上的高速信号。在本文中,研究从一些具有不同地通孔位置的基本通孔模式开始,以研究损耗、串扰、共模和电磁场分布,以帮助理解潜在的物理特性。分析了联合反发射台在25Gbps及以上信号传输中的优势。研究了相邻通孔对模型感兴趣的通孔对的影响,发现相邻通孔应适当地终止并包含在建模中。最后对给定的通孔模式进行了串扰研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信