在没有完整软件堆栈的情况下预测集成电路软失效敏感性的测量技术

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI:10.1109/ISEMC.2016.7571597

Suyu Yang, Benjamin J. Orr, Yuangdong Guo, Yilong Zhang, D. Pommerenke, H. Shumiya, J. Maeshima, Taketoshi Sekine, Y. Takita, K. Araki

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引用次数: 11

摘要

在本文中，几种方法概述了检测功能的变化，在一个集成电路由于外部干扰，如ESD或EMI。目标是在没有任何复杂软件的帮助下，在硬件设计阶段提供检测复杂系统潜在软故障敏感性的诊断工具。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack

In this paper, several methods are outlined for detecting functional changes in an IC due to external interference such as ESD or EMI. The goal is to provide diagnostic tools for detection of potential soft failure susceptibilities of complex systems during the hardware design stage without the aid of any complex software.

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2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)

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