Millimeter-wave broadband transition of stripline and CPWG on thin-to-thick substrates

N. Ghassemi, H. Tournier
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引用次数: 1

Abstract

In many applications such as chip (or package) to PCB transition, due to the small pitch size of the chip (or package), very narrow 50 Ω; stripline or grounded coplanar waveguide (CPWG) is required. In order to reduce the line width, stripline or CPWG should be fabricated on thin substrate (in case of CPWG because minimum manufacturable gap is limited in normal low cost PCB technology). On the other hand using thin substrate increases metallic loss of CPWG and stripline, which is important especially at millimeter wave, and long channels, then it, is preferred to use thick substrate to reduce metallic loss. Also for many applications such as printed circuit antenna, thick substrate is preferred because it can increase the bandwidth and gain of the antenna. Then a broadband transition from stripline (or CPWG) on thin to thick substrate is needed. This paper presents a low-loss, broadband transition of stripline (and CPWG) on thin-to-thick substrates. Measurement results show that the proposed transitions have less than 0.1 dB insertion loss up to 40 GHz. Several TRL kits are used to de-embed the effect of connectors and probes.
薄到厚基板上带状线和CPWG的毫米波宽带跃迁
在许多应用中如芯片(或封装)向PCB过渡,由于芯片(或封装)的间距尺寸很小,很窄的50 Ω;带状线或接地共面波导(CPWG)是必需的。为了减小线宽,带状线或CPWG应在薄基板上制造(在CPWG的情况下,因为在正常的低成本PCB技术中,最小可制造间隙是有限的)。另一方面,使用薄衬底会增加CPWG和带状线的金属损耗,这在毫米波和长通道下尤为重要,因此,使用厚衬底可以减少金属损耗。此外,对于许多应用,如印刷电路天线,厚衬底是首选的,因为它可以增加天线的带宽和增益。然后需要从薄基板上的带状线(或CPWG)宽带过渡到厚基板。本文提出了一种低损耗、宽频带线(和CPWG)在薄到厚基板上的转换。测量结果表明,所提出的转换在40ghz下的插入损耗小于0.1 dB。几个TRL套件用于去除连接器和探头的嵌入效果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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