{"title":"短标准、开放标准的新型表征技术","authors":"Shaowu Huang, X. Ye, Kai Xiao","doi":"10.1109/ISEMC.2016.7571702","DOIUrl":null,"url":null,"abstract":"In this paper, through introducing the short and open standards and excluding the match (termination) standard, a technique is proposed to simplify the measurement of symmetric device under test (DUT). Because the short and open standards are usually easier to obtain than the match (termination) standard in terms of cost and/or feasibility, this technique provides more cost-effective and more flexible solution for characterization of symmetric systems and interconnects.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel characterization technique with short and open standards\",\"authors\":\"Shaowu Huang, X. Ye, Kai Xiao\",\"doi\":\"10.1109/ISEMC.2016.7571702\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, through introducing the short and open standards and excluding the match (termination) standard, a technique is proposed to simplify the measurement of symmetric device under test (DUT). Because the short and open standards are usually easier to obtain than the match (termination) standard in terms of cost and/or feasibility, this technique provides more cost-effective and more flexible solution for characterization of symmetric systems and interconnects.\",\"PeriodicalId\":326016,\"journal\":{\"name\":\"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2016.7571702\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2016.7571702","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Novel characterization technique with short and open standards
In this paper, through introducing the short and open standards and excluding the match (termination) standard, a technique is proposed to simplify the measurement of symmetric device under test (DUT). Because the short and open standards are usually easier to obtain than the match (termination) standard in terms of cost and/or feasibility, this technique provides more cost-effective and more flexible solution for characterization of symmetric systems and interconnects.