Nitin Salodkar, Subramanian Rajagopalan, S. Bhattacharya, S. Batterywala
{"title":"Automatic design rule correction in presence of multiple grids and track patterns","authors":"Nitin Salodkar, Subramanian Rajagopalan, S. Bhattacharya, S. Batterywala","doi":"10.1145/2463209.2488766","DOIUrl":"https://doi.org/10.1145/2463209.2488766","url":null,"abstract":"Traditionally, automatic design rule correction (DRC) problem is modeled as a Linear Program (LP) with design rules as difference constraints under minimum perturbation objective. This yields Totally Uni-Modular (TUM) constraint matrices thereby guaranteeing integral grid-compliant solutions with LP solvers. However, advanced technology nodes introduce per-layer grids or discrete tracks that result into non-TUM constraint matrices for the DRC problem. Consequently, LP solvers do not guarantee integral solutions. In this work, we propose a novel formulation using an 'unrolling' technique. Our formulation guarantees TUM constraint matrices and hence integral multiple grid/track compliant solutions. We demonstrate its efficacy on layouts at advanced nodes.","PeriodicalId":320207,"journal":{"name":"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115309333","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
G. Agosta, Alessandro Barenghi, Massimo Maggi, Gerardo Pelosi
{"title":"Compiler-based side channel vulnerability analysis and optimized countermeasures application","authors":"G. Agosta, Alessandro Barenghi, Massimo Maggi, Gerardo Pelosi","doi":"10.1145/2463209.2488833","DOIUrl":"https://doi.org/10.1145/2463209.2488833","url":null,"abstract":"Modern embedded systems manage sensitive data increasingly often through cryptographic primitives. In this context, side-channel attacks, such as power analysis, represent a concrete threat, regardless of the mathematical strength of a cipher. Evaluating the resistance against power analysis of cryptographic implementations and preventing it, are tasks usually ascribed to the expertise of the system designer. This paper introduces a new security-oriented data-flow analysis assessing the vulnerability level of a cipher with bit-level accuracy. A general and extensible compiler-based tool was implemented to assess the instruction resistance against power-based side-channels. The tool automatically instantiates the essential masking countermeasures, yielding a ×2.5 performance speedup w.r.t. protecting the entire code.","PeriodicalId":320207,"journal":{"name":"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)","volume":"122 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123023820","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"An accurate semi-analytical framework for full-chip TSV-induced stress modeling","authors":"Yang Li, D. Pan","doi":"10.1145/2463209.2488957","DOIUrl":"https://doi.org/10.1145/2463209.2488957","url":null,"abstract":"TSV-induced stress is an important issue in 3D IC design since it leads to serious reliability problems and influences device performance. Existing finite element method can provide accurate analysis for the stress of simple TSV placement, but is not scalable to larger designs due to its expensive memory consumption and high run time. On the contrary, linear superposition method is efficient to analyze stress in full-chip scale, but sometimes it fails to provide an accurate estimation since it neglects the stress induced by interactions between TSVs. In this paper we propose an accurate two-stage semi-analytical framework for fullchip TSV-induced stress modeling. In addition to the linear superposition, we characterize the stress induced by interactions between TSVs to provide more accurate full-chip modeling. Experimental results demonstrate that the proposed framework can significantly improve the accuracy of linear superposition method with reasonable overhead in run time.","PeriodicalId":320207,"journal":{"name":"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114951243","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Shiliang Liu, G. Csaba, X. Hu, E. Varga, M. Niemier, G. Bernstein, W. Porod
{"title":"Minimum-energy state guided physical design for Nanomagnet Logic","authors":"Shiliang Liu, G. Csaba, X. Hu, E. Varga, M. Niemier, G. Bernstein, W. Porod","doi":"10.1145/2463209.2488865","DOIUrl":"https://doi.org/10.1145/2463209.2488865","url":null,"abstract":"Nanomagnet Logic (NML) accomplishes computation through magnetic dipole-dipole interactions. It has the potential for low-power dissipation, radiation hardness and non-volatility. NML circuits have been designed to process and move information via nearest neighbor, device-to-device coupling. However, the resultant layouts often fail to function correctly. This paper reveals an important cause of such failures showing that a robust NML layout must take into account not only nearest neighbor, but also the next nearest neighbor couplings. A new design method is then introduced to address this issue that leverages the minimum-energy states of an NML circuit to guide the layout process. Case studies show that the new method is efficient and effective in arriving at correct NML layouts.","PeriodicalId":320207,"journal":{"name":"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114075494","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Efficient moment estimation with extremely small sample size via bayesian inference for analog/mixed-signal validation","authors":"Chenjie Gu, E. Chiprout, Xin Li","doi":"10.1145/2463209.2488813","DOIUrl":"https://doi.org/10.1145/2463209.2488813","url":null,"abstract":"A critical problem in pre-Silicon and post-Silicon validation of analog/mixed-signal circuits is to estimate the distribution of circuit performances, from which the probability of failure and parametric yield can be estimated at all circuit configurations and corners. With extremely small sample size, traditional estimators are only capable of achieving a very low confidence level, leading to either over-validation or under-validation. In this paper, we propose a multi-population moment estimation method that significantly improves estimation accuracy under small sample size. In fact, the proposed estimator is theoretically guaranteed to outperform usual moment estimators. The key idea is to exploit the fact that simulation and measurement data collected under different circuit configurations and corners can be correlated, and are conditionally independent. We exploit such correlation among different populations by employing a Bayesian framework, i.e., by learning a prior distribution and applying maximum a posteriori estimation using the prior. We apply the proposed method to several datasets including post-silicon measurements of a commercial highspeed I/O link, and demonstrate an average error reduction of up to 2×, which can be equivalently translated to significant reduction of validation time and cost.","PeriodicalId":320207,"journal":{"name":"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130119245","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"VAWOM: Temperature and process variation aware WearOut Management in 3D multicore architecture","authors":"H. Tajik, H. Homayoun, N. Dutt","doi":"10.1145/2463209.2488953","DOIUrl":"https://doi.org/10.1145/2463209.2488953","url":null,"abstract":"Three dimensional (3D) integration attempts to address challenges and limitations of new technologies such as interconnect delay and power consumption. However, high power density and increased temperature in 3D architectures accelerate wearout failure mechanisms such as Negative Bias Temperature Instability (NBTI). In this paper we present VAWOM (Variation Aware WearOut Management), an approach that reduces the NBTI effect by exploiting temperature and process variation in 3D architectures. We demonstrate the efficacy of VAWOM on a two-layer 3D architecture with 4x4 cores on the first layer and 4x4 last level caches on the second layer, and show that VAWOM reduces NBTI induced threshold voltage degradation by 30% with only a small degradation in performance.","PeriodicalId":320207,"journal":{"name":"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)","volume":"151 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129657240","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The ITRS design technology and system drivers roadmap: Process and status","authors":"A. Kahng","doi":"10.1145/2463209.2488776","DOIUrl":"https://doi.org/10.1145/2463209.2488776","url":null,"abstract":"The Design technology working group (TWG) is one of 16 working groups in the International Technology Roadmap for Semiconductors (ITRS) effort. It is responsible for the ITRS' Design Chapter, which roadmaps design technology requirements and potential solutions for elements of the semiconductor supply chain that are produced by the electronic design automation (EDA) industry. The Design TWG is also responsible for the ITRS' System Drivers Chapter, which roadmaps the key product classes that drive the leading-edge requirements for process and design technologies. Through these activities, the Design TWG sets a number of fundamental parameters in the overall ITRS: layout density, die size, maximum on-chip clock frequency, total chip power, SOC and MPU architecture models, etc. This paper reviews the process by which the Design TWG evolves its roadmap content, and some of the key modeling and roadmapping questions that the semiconductor and EDA industries will face in the near term.","PeriodicalId":320207,"journal":{"name":"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130188802","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
X. Chen, Zheng Xu, Hyungjun Kim, Paul V. Gratz, Jiang Hu, M. Kishinevsky, Ümit Y. Ogras, R. Ayoub
{"title":"Dynamic voltage and frequency scaling for shared resources in multicore processor designs","authors":"X. Chen, Zheng Xu, Hyungjun Kim, Paul V. Gratz, Jiang Hu, M. Kishinevsky, Ümit Y. Ogras, R. Ayoub","doi":"10.1145/2463209.2488874","DOIUrl":"https://doi.org/10.1145/2463209.2488874","url":null,"abstract":"As the core count in processor chips grows, so do the on-die, shared resources such as on-chip communication fabric and shared cache, which are of paramount importance for chip performance and power. This paper presents a method for dynamic voltage/frequency scaling of networks-on-chip and last level caches in multicore processor designs, where the shared resources form a single voltage/frequency domain. Several new techniques for monitoring and control are developed, and validated through full system simulations on the PARSEC benchmarks. These techniques reduce energy-delay product by 56% compared to a state-of-the-art prior work.","PeriodicalId":320207,"journal":{"name":"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)","volume":"372 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122389559","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Mohammad Fattah, M. Daneshtalab, P. Liljeberg, J. Plosila
{"title":"Smart hill climbing for agile dynamic mapping in many-core systems","authors":"Mohammad Fattah, M. Daneshtalab, P. Liljeberg, J. Plosila","doi":"10.1145/2463209.2488782","DOIUrl":"https://doi.org/10.1145/2463209.2488782","url":null,"abstract":"Stochastic hill climbing algorithm is adapted to rapidly find the appropriate start node in the application mapping of network-based many-core systems. Due to highly dynamic and unpredictable workload of such systems, an agile run-time task allocation scheme is required. The scheme is desired to map the tasks of an incoming application at run-time onto an optimum contiguous area of the available nodes. Contiguous and unfragmented area mapping is to settle the communicating tasks in close proximity. Hence, the power dissipation, the congestion between different applications, and the latency of the system will be significantly reduced. To find an optimum region, we first propose an approximate model that quickly estimates the available area around a given node. Then the stochastic hill climbing algorithm is used as a search heuristic to find a node that has the required number of available nodes around it. Presented agile climber takes the steps using an adapted version of hill climbing algorithm named Smart Hill Climbing, SHiC, which takes the runtime status of the system into account. Finally, the application mapping is performed starting from the selected first node. Experiments show significant gain in the mapping contiguousness which results in better network latency and power dissipation, compared to state-of-the-art works.","PeriodicalId":320207,"journal":{"name":"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121031773","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Distributed stable states for process networks - Algorithm, analysis, and experiments on intel SCC","authors":"Devendra Rai, Lars Schor, N. Stoimenov, L. Thiele","doi":"10.1145/2463209.2488941","DOIUrl":"https://doi.org/10.1145/2463209.2488941","url":null,"abstract":"Technology scaling is a common trend in current embedded systems. It has promoted the use of multi-core, multiprocessor, and distributed platforms. Such systems usually require run-time migration of distributed applications between the different nodes of the platform in order to balance the workload or to tolerate faults. Before an application can be migrated, it needs to be brought to a stable state such that restarting the application after migration does not violate its functional correctness. An application in a stable state does not change its context any further, and therefore, stabilization is a prerequisite for any application migration. Process networks are a common model of computation for specifying distributed applications. However, most results on the migration of process networks do not provide an algorithm to put a general process network into a stable state, suitable for migration. This paper proposes a technique which efficiently and correctly brings a process network executing on a distributed system to a known stable state. The correctness of the technique is independent of the temporal characteristics of the system and the topology of the process network. The required modifications of a process network are lightweight and preserve its original functionality. A model characterizing the timing properties of the technique is provided. The feasibility and efficiency of the proposed approach and the respective model are validated with experimental results on Intel's SCC platform.","PeriodicalId":320207,"journal":{"name":"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)","volume":"175 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116533548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}