Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems最新文献

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X-radiation response of SIMOX buried oxides: influence of the fabrication process SIMOX埋置氧化物的x射线响应:制备工艺的影响
P. Paillet, J. Autran, O. Flament, J. Leray, B. Aspar, A. Auberton-Herve
{"title":"X-radiation response of SIMOX buried oxides: influence of the fabrication process","authors":"P. Paillet, J. Autran, O. Flament, J. Leray, B. Aspar, A. Auberton-Herve","doi":"10.1109/RADECS.1995.509768","DOIUrl":"https://doi.org/10.1109/RADECS.1995.509768","url":null,"abstract":"X-ray induced electron and hole trapping properties have been investigated in SIMOX buried oxides of different processes, including standard and supplemental implantation oxides, as well as new thin and ultra-thin oxides. The effect of the substrate bias applied during irradiation is studied, and then used to extract both hole and electron trapping parameters. The results demonstrate that varying the oxygen implantation conditions has very little effect on the radiation induced behavior of the material. They show that the charge trapping properties of the buried oxide are related to the ultra high temperature anneal performed on the confined oxide layer, and confirm that the post implantation anneal is the most critical part of the SIMOX process.","PeriodicalId":310087,"journal":{"name":"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125096319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
Single event effect characteristics of CMOS devices employing various epi-layer thicknesses 不同外延层厚度CMOS器件的单事件效应特性
K. Label, D. Hawkins, J. A. Kinnison, W.P. Stapor, P. Marshall
{"title":"Single event effect characteristics of CMOS devices employing various epi-layer thicknesses","authors":"K. Label, D. Hawkins, J. A. Kinnison, W.P. Stapor, P. Marshall","doi":"10.1109/RADECS.1995.509787","DOIUrl":"https://doi.org/10.1109/RADECS.1995.509787","url":null,"abstract":"Latchup resistant process, combined with SEU mitigation circuitry, may provide sufficient protection for many satellite applications. We report proton and heavy ion cross section measurements to illustrate the epitaxial layer thickness dependence on a First-in, First-out (FIFO) memory and microprocessor devices fabricated in a commercial CMOS/EPI process.","PeriodicalId":310087,"journal":{"name":"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134140008","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
An experimental survey of heavy ion induced dielectric rupture in Actel field programmable gate arrays (FPGAs) Actel现场可编程门阵列(fpga)中重离子诱导介电破裂的实验研究
G. Swift, R. Katz
{"title":"An experimental survey of heavy ion induced dielectric rupture in Actel field programmable gate arrays (FPGAs)","authors":"G. Swift, R. Katz","doi":"10.1109/RADECS.1995.509814","DOIUrl":"https://doi.org/10.1109/RADECS.1995.509814","url":null,"abstract":"Irradiations and subsequent failure analyses were performed to investigate single event dielectric rupture (SEDR) in Actel FPGAs as a function of ion LET (linear energy transfer), angle, bias, temperature, feature size, and device type. The small cross sections imply acceptably low risk for most spacecraft uses.","PeriodicalId":310087,"journal":{"name":"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134609586","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 30
Behaviour of the future LHC magnet protection diodes irradiated in a nuclear reactor at 4.6 K with intermediate annealing 未来大型强子对撞机磁保护二极管在核反应堆4.6 K辐照下的中间退火行为
V. Berland, D. Hagedorn, H. Gerstenberg
{"title":"Behaviour of the future LHC magnet protection diodes irradiated in a nuclear reactor at 4.6 K with intermediate annealing","authors":"V. Berland, D. Hagedorn, H. Gerstenberg","doi":"10.1109/RADECS.1995.509761","DOIUrl":"https://doi.org/10.1109/RADECS.1995.509761","url":null,"abstract":"In the framework of the LHC project at CERN, the effects of radiation on the electrical characteristics of epitaxial diodes for superconducting magnet protection were studied. The diodes were exposed to an irradiation dose up to 50 kGy and a neutron fluence of 10/sup 15/ n/cm/sup 2/ with intermediate thermal annealing each 10 kGy dose steps in the TUM reactor at 4.6 K.","PeriodicalId":310087,"journal":{"name":"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134631784","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Electrical and optical response of a laser diode to transient ionizing radiation 激光二极管对瞬态电离辐射的电学和光学响应
J. Baggio, C. Brisset, J. L. Sommer, C. D'hose, P. Lalande, J. Leray, O. Musseau
{"title":"Electrical and optical response of a laser diode to transient ionizing radiation","authors":"J. Baggio, C. Brisset, J. L. Sommer, C. D'hose, P. Lalande, J. Leray, O. Musseau","doi":"10.1109/RADECS.1995.509834","DOIUrl":"https://doi.org/10.1109/RADECS.1995.509834","url":null,"abstract":"We have studied transient irradiation effects on the optical and electrical responses of a laser diode. The influence of dose rate, ranging from 10/sup 9/ to 10/sup 12/ rad(Si)/s, has been investigated through a complete experimental study. Dose rate vulnerability of the laser diode has been observed. Electrical and optical transient responses are determined by the dose rate, the diode structure, and its operating point.","PeriodicalId":310087,"journal":{"name":"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116718495","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Effects of reliability screens on MOS charge trapping 可靠性屏对MOS电荷俘获的影响
M. Shaneyfelt, P. Winokur, D. Fleetwood, J. Schwank, R. A. Reber
{"title":"Effects of reliability screens on MOS charge trapping","authors":"M. Shaneyfelt, P. Winokur, D. Fleetwood, J. Schwank, R. A. Reber","doi":"10.1109/RADECS.1995.509777","DOIUrl":"https://doi.org/10.1109/RADECS.1995.509777","url":null,"abstract":"The effects of pre-irradiation elevated-temperature bias stresses on the radiation hardness of field-oxide transistors have been investigated as a function of stress temperature, time, and bias. Both the stress temperature and time are found to have a significant impact on radiation-induced charge buildup in these transistors. Specifically, an increase in either the stress temperature or time causes a much larger negative shift (towards depletion) in the I-V characteristics of the n-channel field-oxide transistors. This increased shift in the transistor I-V characteristics with stress temperature and time suggests that the mechanisms responsible for the stress effects are thermally activated. An activation energy of /spl sim/0.38 eV was measured. The stress bias was found to have no impact on radiation-induced charge buildup in these transistors. The observed stress temperature, time, and bias dependencies appears to be consistent with the diffusion of molecular hydrogen during a given stress period. These results have important implications for the development of hardness assurance test methods.","PeriodicalId":310087,"journal":{"name":"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129614500","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 36
A radiation tolerant 0.6 /spl mu/m CMOS technology 采用耐辐射0.6 /spl μ m CMOS技术
V. Lasserre, T. Corbiere, B. Thomas, K. Rodde
{"title":"A radiation tolerant 0.6 /spl mu/m CMOS technology","authors":"V. Lasserre, T. Corbiere, B. Thomas, K. Rodde","doi":"10.1109/RADECS.1995.509764","DOIUrl":"https://doi.org/10.1109/RADECS.1995.509764","url":null,"abstract":"Modifications of the standard fabrication techniques of the 0.6 /spl mu/m CMOS technology lead to a radiation tolerant process in terms of immunity to total dose effects (up to 500 Gy) and to latchup under heavy ions (LET up to 100 MeV/(mg/cm/sup 2/)). In this paper, the process development and the evolution of device parameters as a function of total dose are presented.","PeriodicalId":310087,"journal":{"name":"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124642391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Dynamic single event effects in a CMOS/thick SOI shift register CMOS/厚SOI移位寄存器中的动态单事件效应
F. Gardic, O. Flament, O. Musseau, C. Brisset, M. Martinez, J.P. Brunet, L. Blanquart
{"title":"Dynamic single event effects in a CMOS/thick SOI shift register","authors":"F. Gardic, O. Flament, O. Musseau, C. Brisset, M. Martinez, J.P. Brunet, L. Blanquart","doi":"10.1109/RADECS.1995.509799","DOIUrl":"https://doi.org/10.1109/RADECS.1995.509799","url":null,"abstract":"We describe transient effects induced by high energy protons in shift registers processed in a CMOS/thick SOI technology. Devices are tested in dynamic mode. The dependence of cross section on frequency, signal rise time, angle of incidence and proton energy is studied and interpreted.","PeriodicalId":310087,"journal":{"name":"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122273866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Forward and reverse characteristics of irradiated MOSFETs 辐照mosfet的正向和反向特性
A. Paccagnella, M. Ceschia, G. Verzellesi, G. Dalla Betta, P. Bellutti, P. Fuochi, G. Soncini
{"title":"Forward and reverse characteristics of irradiated MOSFETs","authors":"A. Paccagnella, M. Ceschia, G. Verzellesi, G. Dalla Betta, P. Bellutti, P. Fuochi, G. Soncini","doi":"10.1109/RADECS.1995.509746","DOIUrl":"https://doi.org/10.1109/RADECS.1995.509746","url":null,"abstract":"pMOSFETs biased with V/sub gs/<V/sub gd/ during Co/sup 60/ /spl gamma/ irradiation have shown substantial differences between the forward and reverse subthreshold characteristics, induced by a non-uniform charge distribution in the gate oxide. Correspondingly, modest differences have been observed in the over-threshold I-V characteristics. After irradiation, the forward subthreshold curves can shift at higher or lower gate voltages than the reverse ones. The former behaviour has been observed in long-channel devices, in agreement with the classical MOS theory and numerical simulations. The latter result has been obtained in short-channel devices, and it has been correlated to a parasitic punch-through conduction mechanism.","PeriodicalId":310087,"journal":{"name":"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130463057","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Impact ionization influence on the photocurrent of an irradiated junction 冲击电离对辐照结光电流的影响
C. Sudre, F. Pelanchon, Y. Moreau, J. Palau, J. Gasiot
{"title":"Impact ionization influence on the photocurrent of an irradiated junction","authors":"C. Sudre, F. Pelanchon, Y. Moreau, J. Palau, J. Gasiot","doi":"10.1109/RADECS.1995.509751","DOIUrl":"https://doi.org/10.1109/RADECS.1995.509751","url":null,"abstract":"2D simulations of an irradiated p-n junction shows the influence of the impact ionization phenomena. This influence increases with the dose rate and with the applied reverse bias. Photocurrent simulations must thus take into account the impact ionization.","PeriodicalId":310087,"journal":{"name":"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems","volume":"236 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131160398","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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