X-radiation response of SIMOX buried oxides: influence of the fabrication process

P. Paillet, J. Autran, O. Flament, J. Leray, B. Aspar, A. Auberton-Herve
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引用次数: 16

Abstract

X-ray induced electron and hole trapping properties have been investigated in SIMOX buried oxides of different processes, including standard and supplemental implantation oxides, as well as new thin and ultra-thin oxides. The effect of the substrate bias applied during irradiation is studied, and then used to extract both hole and electron trapping parameters. The results demonstrate that varying the oxygen implantation conditions has very little effect on the radiation induced behavior of the material. They show that the charge trapping properties of the buried oxide are related to the ultra high temperature anneal performed on the confined oxide layer, and confirm that the post implantation anneal is the most critical part of the SIMOX process.
SIMOX埋置氧化物的x射线响应:制备工艺的影响
研究了不同工艺的SIMOX埋层氧化物的x射线诱导电子和空穴捕获特性,包括标准埋层氧化物和补充埋层氧化物,以及新型薄层和超薄层氧化物。研究了辐照过程中衬底偏压的影响,并将其用于提取空穴和电子捕获参数。结果表明,不同的氧注入条件对材料的辐射诱导行为影响很小。结果表明,埋藏氧化物的电荷捕获特性与在封闭氧化物层上进行的超高温退火有关,并证实了注入后退火是SIMOX过程中最关键的部分。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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