{"title":"Evolution of directed ion beams from doping to materials engineering","authors":"A. Renau","doi":"10.1109/IEDM.2014.7047157","DOIUrl":"https://doi.org/10.1109/IEDM.2014.7047157","url":null,"abstract":"We review recent changes to implanter processing capabilities, including the adoption of cryogenic implants to reduce leakage and contact resistance as well as high temperature implants for finFETs. We discuss some specific 3D challenges and introduce a new process technology for 3D that uses directed ion beams for material modification including implant, etch and deposition.","PeriodicalId":309325,"journal":{"name":"2014 IEEE International Electron Devices Meeting","volume":"55 Suppl 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126107221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"9.74-THz electronic Far-Infrared detection using Schottky barrier diodes in CMOS","authors":"Z. Ahmad, A. Lisauskas, H. Roskos, K. O. Kenneth","doi":"10.1109/IEDM.2014.7046982","DOIUrl":"https://doi.org/10.1109/IEDM.2014.7046982","url":null,"abstract":"9.74-THz fundamental electronic detection of Far-Infrared (FIR) radiation is demonstrated. The detection along with that at 4.92THz was realized using Schottky-barrier diode detection structures formed without any process modifications in CMOS. Peak optical responsivity (Rv) of 383 and ~14V/W at 4.92 and 9.74THz have been measured. The Rv at 9.74THz is 14X of that for the previously reported highest frequency electronic detection. The shot noise limited NEP at 4.92 and 9.74THz is ~0.43 and ~2nW/√Hz, respectively.","PeriodicalId":309325,"journal":{"name":"2014 IEEE International Electron Devices Meeting","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122256543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Shu Yang, Sheng-gen Liu, Cheng Liu, Zhikai Tang, Yunyou Lu, K. J. Chen
{"title":"Thermally induced threshold voltage instability of III-Nitride MIS-HEMTs and MOSC-HEMTs: Underlying mechanisms and optimization schemes","authors":"Shu Yang, Sheng-gen Liu, Cheng Liu, Zhikai Tang, Yunyou Lu, K. J. Chen","doi":"10.1109/IEDM.2014.7047069","DOIUrl":"https://doi.org/10.1109/IEDM.2014.7047069","url":null,"abstract":"The mechanisms of divergent VTH-thermal-stabilities of III-nitride (III-N) MIS-HEMT and MOS-Channel-HEMT are revealed in this work. The more significant VTH-thermal-instability of MIS-HEMT is attributed to the polarized III-N barrier layer that spatially separates the critical gate-dielectric/III-N interface from the channel and allows “deeper” interface trap levels emerging above the Fermi level at pinch-off. We also reveal the influences of the barrier layer's thickness and the fixed charges (e.g. F-) in the barrier layer on VTH-thermal-stability and attempt to provide guidelines for the optimization of insulated-gate III-N power switching devices. A tailor-made normally-off MIS-HEMT with optimal tradeoff between performance and stability is thereby demonstrated, by conjunctively utilizing partially recessed gate and fluorine plasma implantation techniques.","PeriodicalId":309325,"journal":{"name":"2014 IEEE International Electron Devices Meeting","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127095931","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Silicon carbide power device development for industrial markets","authors":"J. Palmour","doi":"10.1109/IEDM.2014.7046960","DOIUrl":"https://doi.org/10.1109/IEDM.2014.7046960","url":null,"abstract":"SiC power devices have the ability to greatly outperform their Silicon counterparts. SiC material quality and cost issues have largely been overcome, allowing SiC to start competing directly with more traditional Si devices. 150 mm substrates and epitaxy are now commercially available. Commercially released 4H-SiC MOSFETs with a specific on-resistance (RON,SP) of 5 mΩcm2 for a 1200 V rating are now available, and research has further optimized the device design and fabrication processes to greatly expand the voltage ratings from 900 V up to 15 kV for a much wider range of high-power, high-frequency energy-conversion applications. Performance for voltage ratings from 900 V up to 15 kV have been achieved with a RON,SP as low as 2.3 mΩcm2 for a breakdown voltage (BV) of 1230 V and 900 V-rating, 2.7 mΩcm2 for a BV of 1620 V and 1200 V-rating, 10.6 mΩcm2 for a BV of 4160 V and 3300 V-rating, 123 mΩcm2 for a BV of 12 kV and 10 kV-rating, and 208 mΩcm2 for a BV of 15.5 kV and 15 kV-rating. All of these devices exhibit very high frequency switching performance over silicon IGBTs. For even higher voltages, bipolar devices in SiC have been demonstrated from 15 kV up to 27 kV. SiC GTOs have been shown up to 22 kV with 200 A capability. SiC n-IGBTs are reported up to 27 kV, with 20 A capability. This is the highest voltage semiconductor device reported to date.","PeriodicalId":309325,"journal":{"name":"2014 IEEE International Electron Devices Meeting","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129947953","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Pelloux-Prayer, M. Cassé, S. Barraud, P. Nguyen, M. Koyama, Y. Niquet, F. Triozon, I. Duchemin, A. Abisset, A. Idrissi-Eloudrhiri, S. Martinie, J. Rouviere, H. Iwai, G. Reimbold
{"title":"Study of the piezoresistive properties of NMOS and PMOS Ω-gate SOI nanowire transistors: Scalability effects and high stress level","authors":"J. Pelloux-Prayer, M. Cassé, S. Barraud, P. Nguyen, M. Koyama, Y. Niquet, F. Triozon, I. Duchemin, A. Abisset, A. Idrissi-Eloudrhiri, S. Martinie, J. Rouviere, H. Iwai, G. Reimbold","doi":"10.1109/IEDM.2014.7047090","DOIUrl":"https://doi.org/10.1109/IEDM.2014.7047090","url":null,"abstract":"We hereby present a comprehensive study of piezoresistive properties of aggressively scaled MOSFET devices. For the first time, the evolution of the piezoresistive coefficients with scaled dimensions is presented (gate length down to 20nm and channel width down to 8nm), and from the low to high stress regime (above 1GPa). We have shown that the downscaling of geometrical parameters doesn't allow the use of the conventional definition of piezoresistivity tensor elements. The obtained results give a comprehensive insight on strain engineering ability in aggressively scaled CMOS technology.","PeriodicalId":309325,"journal":{"name":"2014 IEEE International Electron Devices Meeting","volume":"140 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121417033","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Detecting elementary particles using hybrid pixel detectors at the lhc and beyond","authors":"M. Campbell","doi":"10.1109/IEDM.2014.7047028","DOIUrl":"https://doi.org/10.1109/IEDM.2014.7047028","url":null,"abstract":"At the CERN Large Hadron Collider bunches of high energy protons (and ions) collide at the heart of 4 massive experiments. Hybrid pixel detectors identify and tag individual particle tracks helping physicists to select the handful of interesting events from the millions created per second. Applications beyond LHC will also be described.","PeriodicalId":309325,"journal":{"name":"2014 IEEE International Electron Devices Meeting","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124014260","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Deleonibus, O. Faynot, Thomas Ernst, M. Vinet, P. Batude, F. Andrieu, O. Weber, David K. C. Cooper, François Bertin, Hubert Moriceau, L. Dicioccio, T. Signamarcheix, M. Sanquer, X. Jehl, O. Cueto, H. Fanet, F. Martin, H. Okuno, F. Nemouchi, Gilles Poupon, Y. Lamy, D. Gasparutto, X. Baillin, L. Duraffourg, J. Arcamone, L. Perniola, B. D. Salvo, E. Vianello, L. Hutin, C. Poulain, Edith Beigne, R. Tiron, L. Pain, S. Tedesco, S. Barnola, N. Possémé, C. L. Royer, A. Villalon, R. Salot
{"title":"Future challenges and opportunities for heterogeneous process technology. Towards the thin films, Zero Intrinsic Variability devices, Zero Power era","authors":"S. Deleonibus, O. Faynot, Thomas Ernst, M. Vinet, P. Batude, F. Andrieu, O. Weber, David K. C. Cooper, François Bertin, Hubert Moriceau, L. Dicioccio, T. Signamarcheix, M. Sanquer, X. Jehl, O. Cueto, H. Fanet, F. Martin, H. Okuno, F. Nemouchi, Gilles Poupon, Y. Lamy, D. Gasparutto, X. Baillin, L. Duraffourg, J. Arcamone, L. Perniola, B. D. Salvo, E. Vianello, L. Hutin, C. Poulain, Edith Beigne, R. Tiron, L. Pain, S. Tedesco, S. Barnola, N. Possémé, C. L. Royer, A. Villalon, R. Salot","doi":"10.1109/IEDM.2014.7047015","DOIUrl":"https://doi.org/10.1109/IEDM.2014.7047015","url":null,"abstract":"Linear scaling CMOS has encountered many hurdles which request new process modules, driven mainly by the maximization of energy efficiency. Fabrication at the sub 10nm node level will request Intrinsic Variability approaching to zero. The rapid growth of mobile, multifunctional and autonomous systems is hardly demanding to reach Zero Power consumption. The solutions to integrate Thin Film based devices, architectures and systems in order to face these challenges are described.","PeriodicalId":309325,"journal":{"name":"2014 IEEE International Electron Devices Meeting","volume":"152 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124247854","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Y. Sung, P. Lin, Jim Chen, Tzong-Sheng Chang, Y. King, C. Lin
{"title":"A new saw-like self-recovery of interface states in nitride-based memory cell","authors":"Y. Sung, P. Lin, Jim Chen, Tzong-Sheng Chang, Y. King, C. Lin","doi":"10.1109/IEDM.2014.7047084","DOIUrl":"https://doi.org/10.1109/IEDM.2014.7047084","url":null,"abstract":"A new saw-like self-recovery Self-Aligned Nitride (SAN) memory cell is proposed and fabricated in 28nm high-k metal gate (HKMG) CMOS process for high-density logic NVM applications. The cell is operated with Source-Side Injection (SSI) for programming and band-to-band hot holes (BBHH) for erasing. Two effective self-heating recovery mechanisms are proposed and performed to maintain a stable On/Off read window after cycling stresses. Besides, the characteristic and reliability comparison of the SAN cell in other technology nodes, 90nm/45nm/32nm, are characterized to further verify the saw-like self-detrapping and self-recovery operation. The new 28nm HKMG SAN memory cell with the self-detrapping recovery results excellent and superior endurance performance and can provide a very promising solution for logic NVM in advanced technologies.","PeriodicalId":309325,"journal":{"name":"2014 IEEE International Electron Devices Meeting","volume":"217 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120865696","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Multiple breakdown phenomena and modeling for non-uniform dielectric systems","authors":"E. Wu, Baozhen Li, J. Stathis, R. Achanta","doi":"10.1109/IEDM.2014.7047171","DOIUrl":"https://doi.org/10.1109/IEDM.2014.7047171","url":null,"abstract":"We report a wide range of experimental observations of multiple breakdown (BD) phenomena in BEOL/FEOL/MOL dielectric systems with large variability (non-uniformity). Newly developed successive breakdown theory of time-dependent clustering model can well capture these multiple BD events with and without correlation. The understanding of these effects can potentially lead to much improved and realistic projection for future technology nodes.","PeriodicalId":309325,"journal":{"name":"2014 IEEE International Electron Devices Meeting","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132559194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Raju, Xing Li, Yan Lu, C. Tsui, Ki Wing-Hung, M. Chan, C. Yue
{"title":"Efficient wireless power transmission technology based on above-CMOS integrated (ACI) high quality inductors","authors":"S. Raju, Xing Li, Yan Lu, C. Tsui, Ki Wing-Hung, M. Chan, C. Yue","doi":"10.1109/IEDM.2014.7047038","DOIUrl":"https://doi.org/10.1109/IEDM.2014.7047038","url":null,"abstract":"Fully-integrated on-chip inductors with up to 200 nH/mm2 inductance density and a peak qualify factor of 25 are demonstrated based on above-CMOS integration (ACI) post processing techniques. Utilizing a 380-nH ACI inductor, a 2.5×2.5 mm2 wireless energy harvesting antenna was implemented. Measurement results show that it can receive 27 mW from a 250-mW transmitting power source at a distance of 5.3 mm. This represents a 7-fold increase in wireless power transfer efficiency compared to other reported technologies.","PeriodicalId":309325,"journal":{"name":"2014 IEEE International Electron Devices Meeting","volume":"136 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132348128","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}