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The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems最新文献

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Mechanical properties of piezoelectric PVDF/MWCNT fibers prepared by flat/hollow cylindrical near-field electrospinning process 扁平/空心圆柱近场静电纺丝法制备PVDF/MWCNT压电纤维的力学性能
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems Pub Date : 2013-04-07 DOI: 10.1109/NEMS.2013.6559827
Z. H. Liu, C. Pan, L. W. Lin, H. W. Li, C. Ke, J. Huang, P. Wang
{"title":"Mechanical properties of piezoelectric PVDF/MWCNT fibers prepared by flat/hollow cylindrical near-field electrospinning process","authors":"Z. H. Liu, C. Pan, L. W. Lin, H. W. Li, C. Ke, J. Huang, P. Wang","doi":"10.1109/NEMS.2013.6559827","DOIUrl":"https://doi.org/10.1109/NEMS.2013.6559827","url":null,"abstract":"The existing study focused more on one-dimensional nanostructures such as nanotubes and nanofibers for various potential applications, but less on evaluation of their mechanical properties. Therefore, this study mainly concentrates on near-field electrospinning (NFES) and hollow cylindrical near-field electrospining (HCNFES) process to fabricate permanent piezoelectricity of polyvinylidene fluoride (PVDF)/multi-walled carbon nanotube (MWCNT) nanofibers. Comparing NFES and HCNFES, it can be seen that HCNFES was fabricated under high electrical field with in-situ strong mechanical stretching for possible alignment of dipoles along the longitudinal direction of PVDF nanofiber. Therefore, PVDF nanofibers fabricated using HCNFES can be of smaller diameters and higher contents of β-phase with excellent piezoelectricity. In addition, the crystallization and mechanical behaviors of PVDF nanofibers were influenced by the PVDF solution concentration and addition of MWCNT. The tensile test shows that the yield strength increases with increasing 0.03% MWCNT and 16% PVDF solution.","PeriodicalId":308928,"journal":{"name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130231365","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Fabrication and analysis of three-dimensional object using layerwise manufacturing technology 利用分层制造技术制造和分析三维物体
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems Pub Date : 2013-04-07 DOI: 10.1109/NEMS.2013.6559840
S. Lin, C. C. Lin, D. Lin, C. Chuang
{"title":"Fabrication and analysis of three-dimensional object using layerwise manufacturing technology","authors":"S. Lin, C. C. Lin, D. Lin, C. Chuang","doi":"10.1109/NEMS.2013.6559840","DOIUrl":"https://doi.org/10.1109/NEMS.2013.6559840","url":null,"abstract":"Layerwise manufacturing technology exhibits a high potential in the field of rapid manufacturing, due to its capability to directly build up three-dimensional metallic components. In this research, we established a layerwise manufacturing platform having YLR 500 AC fiber laser and an enclosed chamber vacuumed and infused trace argon gas to minimize oxidation powdered material. From relationship of laser power and scanning speed can observe the variation of weld width. It assists to find the suitable laser parameters for laser additive manufacturing at blue region. The morphology of titanium specimen was analyzed by SEM image examined, and some porous structure formed due to the surface tension and oxide effect. The result of mechanical strength of 366.16 MPa was proved to be smaller than common bulk material. The X-ray diffraction patterns of titanium specimen has higher crystallization from R(110), R(101) and R(200). We have successfully fabrication a three-dimensional object and analysis its material properties.","PeriodicalId":308928,"journal":{"name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127851772","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An electrostatically-driven and capacitively-sensed differential lateral resonant pressure microsensor 一种静电驱动和电容感应的横向差分谐振压力微传感器
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems Pub Date : 2013-04-07 DOI: 10.1109/NEMS.2013.6559949
B. Xie, Hailong Jiao, Junbo Wang, Deyong Chen, Jian Chen
{"title":"An electrostatically-driven and capacitively-sensed differential lateral resonant pressure microsensor","authors":"B. Xie, Hailong Jiao, Junbo Wang, Deyong Chen, Jian Chen","doi":"10.1109/NEMS.2013.6559949","DOIUrl":"https://doi.org/10.1109/NEMS.2013.6559949","url":null,"abstract":"This paper presents an electrostatically-driven and capacitively-sensed resonant pressure micro sensor. The device was fabricated based on a SOI wafer requesting only 2 masks and simplified micro-fabrication steps including DRIE, sputter and wet etching. The sensor was quantified by an open loop system, producing a Q-factor higher than 10430 in vacuum (less than 0.5 Pa). The resonant frequency was shown to change linearly in response to applied pressure ranging from 50 kPa to 110 kPa. Experimental data analysis confirmed a sensitivity of 214 Hz/kPa with a linear correlativity of 0.99997.","PeriodicalId":308928,"journal":{"name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131693551","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
An electrochemical microsensor based on molybdophosphate complex for fast determination of total phosphorus in water 基于磷酸钼配合物的电化学微传感器快速测定水中总磷
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems Pub Date : 2013-04-07 DOI: 10.1109/NEMS.2013.6559678
Yin Bai, J. Tong, C. Bian, S. Xia
{"title":"An electrochemical microsensor based on molybdophosphate complex for fast determination of total phosphorus in water","authors":"Yin Bai, J. Tong, C. Bian, S. Xia","doi":"10.1109/NEMS.2013.6559678","DOIUrl":"https://doi.org/10.1109/NEMS.2013.6559678","url":null,"abstract":"This work mainly describes an electrochemical microsensor based on the reduction of molybdophosphate complex for fast determination of total phosphorus (TP) in water. Compared with the traditional methods for phosphate detection reported previously that used bulk electrodes, this microsensor responds faster, and can be applied to TP detection rather than merely phosphate. Calibration of phosphate has been performed with standard solutions prepared with KH2PO4 with pH adjusted to 1.0. The limit of detection (LOD) is 0.66 μmol/L, and linear range is 1~500 μmol/L. The sensitivity is -0.657 nA per μmol/L (R2=0.994). Detection of TP was also carried out in digested TP standard solutions, and the results were consistent with the nominal value of phosphorus concentration.","PeriodicalId":308928,"journal":{"name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125397750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Parametric research of MEMS safety and arming system MEMS安全报警系统参数化研究
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems Pub Date : 2013-04-07 DOI: 10.1109/NEMS.2013.6559841
Wang Fufu, Lou Wenzhong, Fu Yue, Wang Ying
{"title":"Parametric research of MEMS safety and arming system","authors":"Wang Fufu, Lou Wenzhong, Fu Yue, Wang Ying","doi":"10.1109/NEMS.2013.6559841","DOIUrl":"https://doi.org/10.1109/NEMS.2013.6559841","url":null,"abstract":"In this paper, a planar-zigzag-type multi-slot S&A system has been proposed. The system consists of the MEMS W-type micro-spring, slider and zigzag slot. Through simulating and analyzing the micro-spring by applying ANSYS, establishing the mathematical model of the motion for the slider and simulating the physical model by the non-linear dynamic mechanics, appropriate Micro-spring, slider and zigzag slot are designed to meet two items, one item is the micro-spring doesn't have plastic deflection under the drop overload conditions to ensure safety of the system; the other item is the slider slides to the bottom under the launch overload conditions to ensure arming of the system. Through the experiment, the feasibility of the above research is confirmed.","PeriodicalId":308928,"journal":{"name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126845938","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Micromachined catalytic combustion hydrogen gas sensor 微机械催化燃烧氢气传感器
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems Pub Date : 2013-04-07 DOI: 10.1109/NEMS.2013.6559732
Xifeng Liu, Hanpeng Dong, S. Xia
{"title":"Micromachined catalytic combustion hydrogen gas sensor","authors":"Xifeng Liu, Hanpeng Dong, S. Xia","doi":"10.1109/NEMS.2013.6559732","DOIUrl":"https://doi.org/10.1109/NEMS.2013.6559732","url":null,"abstract":"A catalytic combustion H2 sensor has been fabricated by using MEMS technology. The application of hafnium oxide thin films as insulating layer has been deposited by electron beam evaporation. The semiconductor combustion catalyst tin oxide (SnO2) layer was prepared by chemical vapor deposition (CVD).It is a novel application of semiconductor material to catalytic combustion gas sensor. The resistivity of HfO2 thin film is about 2.4×1012 Ω·cm at 900°C. Both the sensing elements and the reference elements could be connected in a suitable circuit such as a Wheatstone configuration with low power consumption. The catalytic combustion sensor shows high response to H2 at operating voltage of 4V and has a higher relative sensitivity and a good linearity for the concentrations of H2 ranging from 0 to 4% in volume. Good consistency and high accuracy of the micro machined catalytic combustion gas sensor were achieved.","PeriodicalId":308928,"journal":{"name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123287498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Parylene-based fold-and-bond wireless pressure sensor 基于聚苯乙烯的折叠键合无线压力传感器
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems Pub Date : 2013-04-07 DOI: 10.1109/NEMS.2013.6559926
Brian P. Crum, Wen Li
{"title":"Parylene-based fold-and-bond wireless pressure sensor","authors":"Brian P. Crum, Wen Li","doi":"10.1109/NEMS.2013.6559926","DOIUrl":"https://doi.org/10.1109/NEMS.2013.6559926","url":null,"abstract":"This paper describes the design, fabrication, and characterization of a wireless, flexible, passive pressure sensor that is suitable for long-term intraocular pressure monitoring. The integrated planar MEMS coil and the variable capacitor were constructed using a fold-and-bond technique, which avoids multilayer processes and thus reduces fabrication complications. Parylene-C was the structural and packaging material, which ensures the flexibility and biocompatibility of the sensor. Devices were characterized in both air and liquid environments. A pressure sensitivity of 156 kHz/mmHg and a maximum detectable range of 28 mm were achieved in water.","PeriodicalId":308928,"journal":{"name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123371807","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
A microactuator for magnetic field control device with large shifting range 一种用于大位移范围磁场控制装置的微驱动器
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems Pub Date : 2013-04-07 DOI: 10.1109/NEMS.2013.6559785
Kun Liu, Yitong Cao, Huaiqiang Yu, Zhihong Li
{"title":"A microactuator for magnetic field control device with large shifting range","authors":"Kun Liu, Yitong Cao, Huaiqiang Yu, Zhihong Li","doi":"10.1109/NEMS.2013.6559785","DOIUrl":"https://doi.org/10.1109/NEMS.2013.6559785","url":null,"abstract":"A large tilting angle and zero static power consumption microactuator has been designed and fabricated in order to meet the requirement of low power consumption and remotely control systems. Analytical model and fabrication process flow of rotation actuator have been demonstrated, and static performance has been tested and compared to theoretical data. The results show the performance of our electrostatic driven device in good agreement with theoretical predicted model.","PeriodicalId":308928,"journal":{"name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126379985","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging 用于3D集成电路和M/NEMS封装的盲式tsv在线测试
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems Pub Date : 2013-04-07 DOI: 10.1109/NEMS.2013.6559722
Yichao Xu, Guanjiang Wang, Xin Sun, R. Fang, M. Miao, Yufeng Jin
{"title":"In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging","authors":"Yichao Xu, Guanjiang Wang, Xin Sun, R. Fang, M. Miao, Yufeng Jin","doi":"10.1109/NEMS.2013.6559722","DOIUrl":"https://doi.org/10.1109/NEMS.2013.6559722","url":null,"abstract":"An in-line testing procedure of blind TSVs is put forward in this study. Insulation integrity is chosen to determine the eligibility. It is to probe the upper end of two or more neighboring TSVs during the manufacturing right after the blind vias being formed. Finite element method simulation was used to illustrate the testing principle, and experimental test were carried out for validation. During the test, leakage current data between two blind vias is obtained and I-V characteristic curve is plotted. It can be determined whether or not the TSVs are qualified.","PeriodicalId":308928,"journal":{"name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126034322","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Discussion on the lapping and polishing process of 4H-SiC wafer 4H-SiC晶圆研磨抛光工艺探讨
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems Pub Date : 2013-04-07 DOI: 10.1109/NEMS.2013.6559856
W. Cheng, Yugang Yin, Yipan Li, H. Zhang, Shiming Zhang, Lingyun Wang, Daoheng Sun
{"title":"Discussion on the lapping and polishing process of 4H-SiC wafer","authors":"W. Cheng, Yugang Yin, Yipan Li, H. Zhang, Shiming Zhang, Lingyun Wang, Daoheng Sun","doi":"10.1109/NEMS.2013.6559856","DOIUrl":"https://doi.org/10.1109/NEMS.2013.6559856","url":null,"abstract":"In order to achieve a high quality silicon carbide (SiC) film, the lapping and polishing process scheme was introduced in this paper. The ductile iron was utilized as lapping disc material, which can quickly thin the SiC wafer to the film of uniform thickness. After three-step lapping process, the thickness of the SiC wafer was reduced to 35 ± 4μm. In the process of polishing, a rough polishing and a fine polishing were studied by selecting suitable polishing liquid, polishing pad and parameters. The results show that the lapping and polishing procedure can realize large area and high quality SiC films: the film thickness, 30 ± 2μm and the surface roughness RMS, 0.69 nm.","PeriodicalId":308928,"journal":{"name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126871623","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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