Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)最新文献_第2页

A high-speed thermal imaging system for semiconductor device analysis 用于半导体器件分析的高速热成像系统

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915143

A. Hefner, D. Berning, D. Blackburn, C. Chapuy, S. Bouche

引用次数: 18

Tool for fast modelling active heat sinks 工具快速建模主动散热器

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915175

P. Dziurdzia, A. Kos

引用次数: 8

Thermal management for high performance integrated circuits with non-uniform chip power considerations 考虑非均匀芯片功率的高性能集成电路的热管理

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915154

T. Yuan, B. Z. Hong, H.H. Chen, Li-Kong Wang

引用次数: 10

Thermal design of a desktop computer system using CFD analysis 基于CFD分析的台式计算机系统热设计

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915139

C. Yu, R. Webb

引用次数: 36

Temperature sensors placement strategy for fault diagnosis in integrated circuits 集成电路故障诊断中的温度传感器放置策略

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915185

P. Bratek, A. Kos

引用次数: 11

Current and future miniature refrigeration cooling technologies for high power microelectronics 大功率微电子的当前和未来微型制冷冷却技术

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915172

Patrick E. Phelan, V. Chiriac, T. Lee

{"title":"Current and future miniature refrigeration cooling technologies for high power microelectronics","authors":"Patrick E. Phelan, V. Chiriac, T. Lee","doi":"10.1109/STHERM.2001.915172","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915172","url":null,"abstract":"Utilizing refrigeration may provide the only means by which future high-performance electronic chips can be maintained below predicted maximum temperature limits. Widespread application of refrigeration in electronic packaging will remain limited until the refrigerators can be made sufficiently small so that they can be easily incorporated within the packaging. A review of existing microscale and mesoscale refrigeration systems revealed that only thermoelectric coolers (TECs) are now commercially available in small sizes. However, existing TECs are limited by their maximum cooling power and low efficiencies. A simple model was constructed to analyze the performance of both existing and predicted future TECs in an electronic packaging environment. Comparison with the cooling provided by an existing high-performance fan shows that they are most effective for heat loads less than approximately 100 W, but that for higher heat loads, fan air cooling actually yields a lower junction temperature. If the efficiency of future TECs, as characterized by ZT/sub room/, where Z is the figure of merit and T/sub room/ is room temperature, can be increased from the present value of /spl sim/0.8 to 2 or even 3, TEC performance improves dramatically, thus making them competitive for many electronic applications. Finally, one unanticipated result of the model was the realization that the thermal resistance between the refrigerator and the chip is not as critical as the thermal resistance between the refrigerator and the ambient air.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129603497","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 173

Effect of flag design on thermal performance of PBGA packages 标志设计对PBGA封装热性能的影响

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915182

B. Joiner

引用次数: 2

Dynamic electro-thermal physically based compact models of the power devices for device and circuit simulations 基于动态电热物理的功率器件紧凑模型，用于器件和电路仿真

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915142

P. Igić, P. Mawby, M. Towers, S. Batcup

引用次数: 31

Wiring statistics and printed wiring board thermal conductivity 线路板统计及印制线路板导热系数

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915186

R. D. Nelson

{"title":"Wiring statistics and printed wiring board thermal conductivity","authors":"R. D. Nelson","doi":"10.1109/STHERM.2001.915186","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915186","url":null,"abstract":"The thermal conductivity of printed wiring boards depends strongly upon the copper content of the signal and power planes. For boards with continuous power and ground planes, it is adequate to use simple lumped conductivities based on the volume percentage of copper. However, nearly order of magnitude errors can occur when this approach is used with boards with discontinuous or significantly perforated power and ground planes. We describe a statistical approach to modeling the copper connectivity in wired signal planes, based on the probability distribution of wire lengths in the X and Y directions. Using this approach, we have constructed finite element models of six-layer printed wiring boards which approximate functional boards with a wide range of wiring density, via density, and power/ground plane perforations. The finite element results show that the connectivity of the wiring, vias, and power/ground planes plays an important role in establishing the board's average thermal conductivity. Although there is some scatter in the results, due to wiring details, we find that the percentage of copper in the printed wiring board can still be used as an initial indicator of thermal conductivity. We present an empirical fit to the models suitable for design applications.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129386359","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

The study of micro-fin heat sinks for electronic cooling applications 电子冷却用微翅片散热器的研究

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915181

H. Chien, Ming-Hsi Tseng, Chih-Yao Wang, Chu Chun-Hsun

引用次数: 8