{"title":"Thermal design of a desktop computer system using CFD analysis","authors":"C. Yu, R. Webb","doi":"10.1109/STHERM.2001.915139","DOIUrl":null,"url":null,"abstract":"This paper uses CFD (Icepak) to identify a cooling solution for a desktop computer, which uses an 80 W CPU. The design is based on a total chassis power dissipation of 313 W (40 W PCI cards). This represents significant power dissipation for the chassis components (memory, chipset, AGP and PCI cards, and peripherals). The analysis is also extended to 100 W PCI power. Of key interest is minimization of the chassis air flow requirements. The design is able to cool the chassis with one case fan and the power supply fan. A ducted 80/spl times/60 mm CPU heat sink is able to meet the CPU temperature specification. System level design improvements were made to provide better cooling for AGP and PCI cards.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"36","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2001.915139","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 36
Abstract
This paper uses CFD (Icepak) to identify a cooling solution for a desktop computer, which uses an 80 W CPU. The design is based on a total chassis power dissipation of 313 W (40 W PCI cards). This represents significant power dissipation for the chassis components (memory, chipset, AGP and PCI cards, and peripherals). The analysis is also extended to 100 W PCI power. Of key interest is minimization of the chassis air flow requirements. The design is able to cool the chassis with one case fan and the power supply fan. A ducted 80/spl times/60 mm CPU heat sink is able to meet the CPU temperature specification. System level design improvements were made to provide better cooling for AGP and PCI cards.