Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)最新文献

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Multi-objective placement optimization of power electronic devices on liquid cooled heat sinks 电力电子器件在液冷散热器上的多目标布局优化
D. Gopinath, Y. Joshi, S. Azarm
{"title":"Multi-objective placement optimization of power electronic devices on liquid cooled heat sinks","authors":"D. Gopinath, Y. Joshi, S. Azarm","doi":"10.1109/STHERM.2001.915159","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915159","url":null,"abstract":"The widespread use of power semiconductors has given rise to a host of thermal design issues. Traditional cooling techniques, such as natural or forced convection air-cooling, are inadequate at such power levels. Liquid cooled heat sinks or cold plates are increasingly used. Along with the development of novel thermal management techniques, there is also a growing interest in thermal design methodologies. One key issue facing the packaging designer is the selection of an appropriate cold plate and optimal placement of components on it. This study investigates the multi-objective placement optimization of power electronic components on liquid cooled heat sinks. The two main components involved are an optimization algorithm and a heat transfer solver. A multi objective genetic algorithm (MOGA) (Narayanan and Azarm, 1999) is chosen as the optimizer. The actual heat transfer in the system is usually complex due to the presence of multiple materials and coupled thermal paths and may require time intensive 3D heat transfer solvers which are inefficient and impractical in this optimization framework. We are concerned with the primary heat transfer path from the device junction and extending to the system ambient. Reduced thermal models, or compact models, are thus more suited for accurately but inexpensively capturing the multimode nature of the heat transfer in this rapid calculation framework and are thus implemented as the heat transfer solvers. Two methodologies for developing reduced thermal models capable of handling coupled convection and conduction, and their implementation within an optimization framework are discussed.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134108185","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Thermal-mechanical measurements and analysis of an advanced thermal interface material construction 一种先进热界面材料结构的热力学测量与分析
F. Raiszadeh, E. Derian
{"title":"Thermal-mechanical measurements and analysis of an advanced thermal interface material construction","authors":"F. Raiszadeh, E. Derian","doi":"10.1109/STHERM.2001.915147","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915147","url":null,"abstract":"A high performance thermal-mechanical thermal interface material (TIM) construction for advanced electronic cooling applications was developed. Additionally, the thermal performance of this TIM construction was experimentally evaluated. The mechanical and thermal performance of the construction was also computationally analyzed. Superior performance of this construction as compared with other material in a fixed reference application was shown. The advantage of this construction in applications with nonuniform heat flux was also demonstrated. The results of the measurements and analysis illustrate that the performance of this TIM construction is superior as compared to the current state of the art in TIM materials.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125806167","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Thermal analysis of power cycling effects on high power IGBT modules by the boundary element method 用边界元法分析大功率IGBT模块的功率循环效应
Z. Khatir, S. Lefebvre
{"title":"Thermal analysis of power cycling effects on high power IGBT modules by the boundary element method","authors":"Z. Khatir, S. Lefebvre","doi":"10.1109/STHERM.2001.915141","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915141","url":null,"abstract":"The technology of high power IGBT modules has been significantly improved in the last few years against thermal fatigue. The most frequently observed failure mode, due to thermal fatigue, is solder cracks between the copper base plate and the DCB (direct copper bonding) substrate. Specific simulation tools are needed to carry out reliability research and to develop device lifetime models. In other respects, accurate temperature and flux distributions are essential when computing thermomechanical stresses in order to assess the lifetime of high power modules in real operating conditions. This study presents an analysis method based on the boundary element method (BEM) to investigate thermal behavior of high power semiconductor packages submitted to power cycling constraints. The paper describes the boundary integral equation which has been solved using the BEM and applied to the case of a high power IGBT module package (3.3 kV-1.2 kA). A validation of the numerical tool is presented by comparison with experimental measurements. Finally, the paper shows the effect of the IGBT silicon chip position on the DCB substrate on the thermal constraints. In particular, a slight shifting of the silicon chips may be sufficient to delay significantly the initiation and propagation of the cracks, allowing a higher device lifetime for the module.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133576803","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 24
A generic method for thermal multiport model generation of IC packages 集成电路封装热多端口模型生成的通用方法
M. Rencz, V. Székely
{"title":"A generic method for thermal multiport model generation of IC packages","authors":"M. Rencz, V. Székely","doi":"10.1109/STHERM.2001.915164","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915164","url":null,"abstract":"The dynamic thermal behaviour of electronic subsystems is characterised by their dynamic compact models. These models must be similar to the steady state models in describing the fact that the heat is usually leaving from different locations (ports), necessitating multi-port description of the thermal behaviour. In this paper, we present a method suitable for direct generation of multi-port dynamic compact thermal models from a series of thermal transient simulations or measurements. The generated RC electrical equivalent circuit model exercised with a network simulator program provided the same transient functions as the simulated ones for various boundary conditions, proving the accuracy of the method. Measurement results are also suitable for compact model generation.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134115978","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
The development of a natural graphite heat-spreader 天然石墨导热片的研制
J. Norley, J. Tzeng, G. Getz, J. Klug, B. Fedor
{"title":"The development of a natural graphite heat-spreader","authors":"J. Norley, J. Tzeng, G. Getz, J. Klug, B. Fedor","doi":"10.1109/STHERM.2001.915157","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915157","url":null,"abstract":"Thermal management systems consist of external cooling mechanisms, heat dissipaters, and thermal interfaces. The primary function of heat dissipaters, e.g. heat sinks, is to create the maximum effective surface area where heat is transferred into and removed by the external cooling medium. Heat dissipater performance is characterized by its intrinsic thermal conductivity, physical surface area, and pressure drop (or drag) coefficient (Kraus and Bar-Cohen, 1995). Another variable, the heat spreading coefficient, introduced by Tzeng et al (PCIM, 2000), must be considered when the heat dissipater is a thermally anisotropic material. A high degree of thermal anisotropy reduces the temperature gradient in the component plane and increases effective heat transfer area, characteristics that are most desirable for electronics with high heat-intensity components. The ability to direct heat in a preferred direction is a further advantage of anisotropic heat-spreader materials. Carbon and graphite-based materials are attracting interest as anisotropic heat-spreaders, with another advantage being their low density. Most carbon and graphite-based materials used to date are based around carbon fibers. These are high cost due to the need for high temperature graphitization processes to develop the required fiber thermal properties. A new form of graphite heat-spreader material is described in this paper, based around naturally occurring graphite. Since this material has been graphitized by nature, anisotropic heat-spreaders with high thermal conductivity can be manufactured without carbon fiber-based additives.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123663744","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 28
Revising the goals and means for the base-to-air cooling stage for semiconductor heat-removal-experiments and their results 修正了半导体散热实验中基底到空气冷却阶段的目标和方法及其结果
V. Travkin, K. Hu, M. Rizzi, M. Canino, I. Catton
{"title":"Revising the goals and means for the base-to-air cooling stage for semiconductor heat-removal-experiments and their results","authors":"V. Travkin, K. Hu, M. Rizzi, M. Canino, I. Catton","doi":"10.1109/STHERM.2001.915152","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915152","url":null,"abstract":"The development of simulation methods and data reduction for heat sink experiments are the purpose of this work. The study dealt with an experimental investigation of semiconductor heat sink performance characteristics. The heat sinks were constructed of aluminum and consisted of an array of staggered pin fins and longitudinal fins. The cooling fluid was air and the experiments were conducted with a porous medium Reynolds number ranging from 400 to 17000. A number of data reduction parameters and procedures were developed using a scaling heterogeneous formulation by volume averaging theory (VAT). We analysed the basic homogeneous heat transfer performance features and have shown the insolvency of using conventional Nusselt numbers, homogeneous heat transfer rate and effectiveness parameters. We introduced and analysed heterogeneous upper scale heat transfer characteristics, and provided comparisons with other studies.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121730503","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Creating compact models using standard spreadsheet software 使用标准的电子表格软件创建紧凑的模型
G. Noebauer
{"title":"Creating compact models using standard spreadsheet software","authors":"G. Noebauer","doi":"10.1109/STHERM.2001.915161","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915161","url":null,"abstract":"Methods are proposed for the determination of boundary conditions independent (BCI) compact thermal models. These flexible techniques can be utilized in combination with the input/output capabilities and standard functions of common spreadsheet programs, which are particularly useful in the process of error minimization. First, the steady-state is considered where resistor models are applicable. On a fast time scale, one-dimensional Cauer resistor-capacitor networks are sufficient to model transient behavior. This paper presents a way to obtain analytical solutions for RC ladders of arbitrary size. The method also eases network conversion. The steady-state and short-time behavior is used as basis information for derivation of BCI transient models. A numerical integration technique applicable to any network is outlined. The proposed techniques are used within the process of development of a transient BCI model for Infineon's BTS840S2 dual chip device, assembled in a P-DSO-20-10 package, which predicts the junction temperatures for any switching state.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124242206","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 26
Linear models for temperature and power dependence of thermal resistance in Si, InP and GaAs substrate devices Si, InP和GaAs衬底器件中热阻温度和功率依赖的线性模型
D. Walkey, T. Smy, T. MacElwee, M. Maliepaard
{"title":"Linear models for temperature and power dependence of thermal resistance in Si, InP and GaAs substrate devices","authors":"D. Walkey, T. Smy, T. MacElwee, M. Maliepaard","doi":"10.1109/STHERM.2001.915183","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915183","url":null,"abstract":"Integrated high-power circuits are typically formed on Si, InP or GaAs substrates. Linear models are derived for the dependence of thermal resistance on temperature dependent thermal conductivity through backside temperature and self-heating. Applied to InP substrate devices, the model predictions are found to be within 5% of measurements for power levels to 3 mW//spl mu/m/sup 2/ and over a 165/spl deg/C substrate temperature range.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116902166","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
The European project PROFIT: prediction of temperature gradients influencing the quality of electronic products 欧洲项目PROFIT:预测影响电子产品质量的温度梯度
C. Lasance
{"title":"The European project PROFIT: prediction of temperature gradients influencing the quality of electronic products","authors":"C. Lasance","doi":"10.1109/STHERM.2001.915160","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915160","url":null,"abstract":"As the thermal community in Europe is relatively small compared to the US, research in this field is rather fragmented. Funding by the European Community (EC) makes a substantial impact in terms of helping to aggregate this fragmentation and build the critical mass necessary to realise a sound research program. On January 1, 2000, a new European project, called PROFIT, commenced as a kind of successor to the successfully finished EC-funded DELPHI, SEED and THERMINIC projects. PROFIT is aimed at creating methods and tools that enable sufficiently accurate measurement and prediction of temperature gradients in time and space, which is required for a more accurate and timely assessment of cost, performance, safety and reliability of electronic products in all stages of the product realisation process. This paper discusses its motivation, scope, objectives, advances over the state-of-the-art and the results achieved in 2000.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116017483","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 36
Biporous heat pipes for high power electronic device cooling 大功率电子器件冷却用双孔热管
Jinliang Wang, I. Catton
{"title":"Biporous heat pipes for high power electronic device cooling","authors":"Jinliang Wang, I. Catton","doi":"10.1109/STHERM.2001.915180","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915180","url":null,"abstract":"A biporous heat pipe is proposed to overcome heat transfer crises in the evaporator. The two levels of pore sizes of the biporous heat pipe result in high heat pipe performance. When vaporization phenomena occur in biporous wicks, bubbles formed in the near wall layer easily escape from the porous media and the possibility of vapor blanket layer formation on the heating surface decreases. Evaporation mostly occurs on the smaller surface pores. This not only increases the heat transfer performance by extended surface and smaller pore sizes, but also increases the capillary force which enables the liquid supply. The biporous structure improves the vapor and liquid distribution in the porous media when vaporization phenomena occur in it. Thermal analysis of a solid copper heat spreader and monoporous and biporous heat pipe modules are performed. Compression of the results shows the heat transfer performance of the monoporous and biporous heat pipes are better than the solid copper spreader and the biporous heat pipe has an advantage in the relatively high heat flux range. The biporous heat pipe is very attractive for high power electronic device cooling.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130702324","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 29
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