Revising the goals and means for the base-to-air cooling stage for semiconductor heat-removal-experiments and their results

V. Travkin, K. Hu, M. Rizzi, M. Canino, I. Catton
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引用次数: 3

Abstract

The development of simulation methods and data reduction for heat sink experiments are the purpose of this work. The study dealt with an experimental investigation of semiconductor heat sink performance characteristics. The heat sinks were constructed of aluminum and consisted of an array of staggered pin fins and longitudinal fins. The cooling fluid was air and the experiments were conducted with a porous medium Reynolds number ranging from 400 to 17000. A number of data reduction parameters and procedures were developed using a scaling heterogeneous formulation by volume averaging theory (VAT). We analysed the basic homogeneous heat transfer performance features and have shown the insolvency of using conventional Nusselt numbers, homogeneous heat transfer rate and effectiveness parameters. We introduced and analysed heterogeneous upper scale heat transfer characteristics, and provided comparisons with other studies.
修正了半导体散热实验中基底到空气冷却阶段的目标和方法及其结果
本研究的目的是发展热沉实验的模拟方法和数据简化。对半导体散热器的性能特性进行了实验研究。散热器由铝制成,由一组交错的销鳍和纵鳍组成。冷却流体为空气,实验采用雷诺数为400 ~ 17000的多孔介质。使用体积平均理论(VAT)的缩放异质公式开发了许多数据缩减参数和程序。我们分析了基本的均匀传热性能特征,并表明了使用传统的努塞尔数,均匀传热率和有效性参数的不足。介绍和分析了非均匀上尺度传热特性,并与其他研究进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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