{"title":"Creating compact models using standard spreadsheet software","authors":"G. Noebauer","doi":"10.1109/STHERM.2001.915161","DOIUrl":null,"url":null,"abstract":"Methods are proposed for the determination of boundary conditions independent (BCI) compact thermal models. These flexible techniques can be utilized in combination with the input/output capabilities and standard functions of common spreadsheet programs, which are particularly useful in the process of error minimization. First, the steady-state is considered where resistor models are applicable. On a fast time scale, one-dimensional Cauer resistor-capacitor networks are sufficient to model transient behavior. This paper presents a way to obtain analytical solutions for RC ladders of arbitrary size. The method also eases network conversion. The steady-state and short-time behavior is used as basis information for derivation of BCI transient models. A numerical integration technique applicable to any network is outlined. The proposed techniques are used within the process of development of a transient BCI model for Infineon's BTS840S2 dual chip device, assembled in a P-DSO-20-10 package, which predicts the junction temperatures for any switching state.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"26","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2001.915161","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 26
Abstract
Methods are proposed for the determination of boundary conditions independent (BCI) compact thermal models. These flexible techniques can be utilized in combination with the input/output capabilities and standard functions of common spreadsheet programs, which are particularly useful in the process of error minimization. First, the steady-state is considered where resistor models are applicable. On a fast time scale, one-dimensional Cauer resistor-capacitor networks are sufficient to model transient behavior. This paper presents a way to obtain analytical solutions for RC ladders of arbitrary size. The method also eases network conversion. The steady-state and short-time behavior is used as basis information for derivation of BCI transient models. A numerical integration technique applicable to any network is outlined. The proposed techniques are used within the process of development of a transient BCI model for Infineon's BTS840S2 dual chip device, assembled in a P-DSO-20-10 package, which predicts the junction temperatures for any switching state.