Thermal-mechanical measurements and analysis of an advanced thermal interface material construction

Abstract

A high performance thermal-mechanical thermal interface material (TIM) construction for advanced electronic cooling applications was developed. Additionally, the thermal performance of this TIM construction was experimentally evaluated. The mechanical and thermal performance of the construction was also computationally analyzed. Superior performance of this construction as compared with other material in a fixed reference application was shown. The advantage of this construction in applications with nonuniform heat flux was also demonstrated. The results of the measurements and analysis illustrate that the performance of this TIM construction is superior as compared to the current state of the art in TIM materials.