Multi-objective placement optimization of power electronic devices on liquid cooled heat sinks

D. Gopinath, Y. Joshi, S. Azarm
{"title":"Multi-objective placement optimization of power electronic devices on liquid cooled heat sinks","authors":"D. Gopinath, Y. Joshi, S. Azarm","doi":"10.1109/STHERM.2001.915159","DOIUrl":null,"url":null,"abstract":"The widespread use of power semiconductors has given rise to a host of thermal design issues. Traditional cooling techniques, such as natural or forced convection air-cooling, are inadequate at such power levels. Liquid cooled heat sinks or cold plates are increasingly used. Along with the development of novel thermal management techniques, there is also a growing interest in thermal design methodologies. One key issue facing the packaging designer is the selection of an appropriate cold plate and optimal placement of components on it. This study investigates the multi-objective placement optimization of power electronic components on liquid cooled heat sinks. The two main components involved are an optimization algorithm and a heat transfer solver. A multi objective genetic algorithm (MOGA) (Narayanan and Azarm, 1999) is chosen as the optimizer. The actual heat transfer in the system is usually complex due to the presence of multiple materials and coupled thermal paths and may require time intensive 3D heat transfer solvers which are inefficient and impractical in this optimization framework. We are concerned with the primary heat transfer path from the device junction and extending to the system ambient. Reduced thermal models, or compact models, are thus more suited for accurately but inexpensively capturing the multimode nature of the heat transfer in this rapid calculation framework and are thus implemented as the heat transfer solvers. Two methodologies for developing reduced thermal models capable of handling coupled convection and conduction, and their implementation within an optimization framework are discussed.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2001.915159","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

The widespread use of power semiconductors has given rise to a host of thermal design issues. Traditional cooling techniques, such as natural or forced convection air-cooling, are inadequate at such power levels. Liquid cooled heat sinks or cold plates are increasingly used. Along with the development of novel thermal management techniques, there is also a growing interest in thermal design methodologies. One key issue facing the packaging designer is the selection of an appropriate cold plate and optimal placement of components on it. This study investigates the multi-objective placement optimization of power electronic components on liquid cooled heat sinks. The two main components involved are an optimization algorithm and a heat transfer solver. A multi objective genetic algorithm (MOGA) (Narayanan and Azarm, 1999) is chosen as the optimizer. The actual heat transfer in the system is usually complex due to the presence of multiple materials and coupled thermal paths and may require time intensive 3D heat transfer solvers which are inefficient and impractical in this optimization framework. We are concerned with the primary heat transfer path from the device junction and extending to the system ambient. Reduced thermal models, or compact models, are thus more suited for accurately but inexpensively capturing the multimode nature of the heat transfer in this rapid calculation framework and are thus implemented as the heat transfer solvers. Two methodologies for developing reduced thermal models capable of handling coupled convection and conduction, and their implementation within an optimization framework are discussed.
电力电子器件在液冷散热器上的多目标布局优化
功率半导体的广泛应用带来了许多热设计问题。传统的冷却技术,如自然或强制对流空气冷却,在这样的功率水平下是不够的。越来越多地使用液冷散热器或冷板。随着新型热管理技术的发展,人们对热设计方法的兴趣也越来越大。包装设计师面临的一个关键问题是选择合适的冷板和组件的最佳位置。研究了电力电子元件在液冷散热器上的多目标布局优化问题。涉及的两个主要组件是优化算法和传热求解器。选择多目标遗传算法(MOGA) (Narayanan and Azarm, 1999)作为优化器。由于存在多种材料和耦合热路径,系统中的实际传热通常是复杂的,并且可能需要时间密集的3D传热求解器,这在这种优化框架中是低效和不切实际的。我们关注的是从器件连接处延伸到系统环境的主要传热路径。因此,简化的热模型或紧凑的模型更适合于准确而廉价地捕捉这种快速计算框架中传热的多模态性质,因此可以作为传热求解器来实现。讨论了两种开发简化热模型的方法,它们能够处理耦合对流和传导,并在优化框架内实现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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