集成电路故障诊断中的温度传感器放置策略

P. Bratek, A. Kos
{"title":"集成电路故障诊断中的温度传感器放置策略","authors":"P. Bratek, A. Kos","doi":"10.1109/STHERM.2001.915185","DOIUrl":null,"url":null,"abstract":"In this paper, we present a new temperature sensor placement strategy. This placement method is proposed for fault diagnosis in integrated circuits (ICs). Simulation results of the new concept sensor placement strategy are presented. Statistical analyses of the yield of this testing method are shown.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Temperature sensors placement strategy for fault diagnosis in integrated circuits\",\"authors\":\"P. Bratek, A. Kos\",\"doi\":\"10.1109/STHERM.2001.915185\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we present a new temperature sensor placement strategy. This placement method is proposed for fault diagnosis in integrated circuits (ICs). Simulation results of the new concept sensor placement strategy are presented. Statistical analyses of the yield of this testing method are shown.\",\"PeriodicalId\":307079,\"journal\":{\"name\":\"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-03-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2001.915185\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2001.915185","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

摘要

本文提出了一种新的温度传感器放置策略。提出了一种集成电路故障诊断的定位方法。给出了新概念传感器放置策略的仿真结果。对该试验方法的成品率进行了统计分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Temperature sensors placement strategy for fault diagnosis in integrated circuits
In this paper, we present a new temperature sensor placement strategy. This placement method is proposed for fault diagnosis in integrated circuits (ICs). Simulation results of the new concept sensor placement strategy are presented. Statistical analyses of the yield of this testing method are shown.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信