{"title":"集成电路故障诊断中的温度传感器放置策略","authors":"P. Bratek, A. Kos","doi":"10.1109/STHERM.2001.915185","DOIUrl":null,"url":null,"abstract":"In this paper, we present a new temperature sensor placement strategy. This placement method is proposed for fault diagnosis in integrated circuits (ICs). Simulation results of the new concept sensor placement strategy are presented. Statistical analyses of the yield of this testing method are shown.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Temperature sensors placement strategy for fault diagnosis in integrated circuits\",\"authors\":\"P. Bratek, A. Kos\",\"doi\":\"10.1109/STHERM.2001.915185\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we present a new temperature sensor placement strategy. This placement method is proposed for fault diagnosis in integrated circuits (ICs). Simulation results of the new concept sensor placement strategy are presented. Statistical analyses of the yield of this testing method are shown.\",\"PeriodicalId\":307079,\"journal\":{\"name\":\"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-03-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2001.915185\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2001.915185","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Temperature sensors placement strategy for fault diagnosis in integrated circuits
In this paper, we present a new temperature sensor placement strategy. This placement method is proposed for fault diagnosis in integrated circuits (ICs). Simulation results of the new concept sensor placement strategy are presented. Statistical analyses of the yield of this testing method are shown.