Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)最新文献_第3页

Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system 电动VLSI芯片冷却系统的两相微通道散热片

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915168

Linan Jiang, J. Koo, Shulin Zeng, J. Mikkelsen, Lianpei Zhang, Pengcheng Zhou, J. Santiago, T. Kenny, K. Goodson, J. Maveety, Q. A. Tran

引用次数: 28

The study of micro-fin heat sinks for electronic cooling applications 电子冷却用微翅片散热器的研究

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915181

H. Chien, Ming-Hsi Tseng, Chih-Yao Wang, Chu Chun-Hsun

引用次数: 8

Characterization of laminar jet impingement cooling in portable computer application 层流射流冲击冷却在便携式计算机中的应用

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915133

John R. Guarino, Vincent P. Manno

{"title":"Characterization of laminar jet impingement cooling in portable computer application","authors":"John R. Guarino, Vincent P. Manno","doi":"10.1109/STHERM.2001.915133","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915133","url":null,"abstract":"A thermal characterization study of laminar air jet impingement cooling of electronic components within a geometry representative of the CPU compartment of a typical portable computer is reported. A finite control volume technique was used to solve for the velocity and temperature fields. Convection, conduction and radiation effects were included in the simulations. The range of jet Reynolds numbers considered was 63 to 1500; the applied compartment heat load ranged from 5-15 W. Radiation effects were significant over the range of Reynolds numbers and heat loads considered, while the effect of natural convection was only noticeable for configurations when the ratio Gr/Re/sup 2/ exceeded 5. The predicted importance of Re rather than jet size was confirmed with test data. Proof of concept was demonstrated with a numerical model representative of a full laptop computer. Both simulations and laboratory tests showed that low flow rate JI cooling schemes can provide cooling comparable to a high volume flow rate configuration, while using only a fraction of the air flow. Furthermore, under the conservative assumption of steady state, fully powered components, a hybrid cooling scheme utilizing a heat pipe and laminar JI was capable of cooling the processor chip to within 11/spl deg/C of the vendor specified maximum temperature for a system with a total power dissipation of over 21 W.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121840670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Thermal comparison of plate, extrusion heat sink, and skive heat sink 板式、挤压式散热器和剥皮式散热器的热比较

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915156

M.C. Yang

{"title":"Thermal comparison of plate, extrusion heat sink, and skive heat sink","authors":"M.C. Yang","doi":"10.1109/STHERM.2001.915156","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915156","url":null,"abstract":"Due to the high power dissipation values of power amplifiers, large temperature gradients exist, resulting in localized hot spots around the devices. These hot spots cause high device junction temperatures. Generally speaking, the higher junction temperature increases, the lower reliability will be. Thus, improving the heat spreading is very important. Several methods can be used to improve heat spreading. Skiving is a process of cutting off in thin layers or paring. Skiving is a high throughput manufacturing process that produces high surface area heat sinks at low cost. The entire extruded material is skived and then the heat sinks are cut to the desired length. The high process throughput results in low cost. In quantities of 1000 units, a 100 mm/spl times/70 mm/spl times/25 mm heat sink costs approximately $3.50. A detailed comparison demonstrates the heat absorption capability of using aluminum plate, aluminum plate with skive heat sink, and extrusion heat sink under laminar flow (free convection) and turbulent flow (forced convection) environments. Two CFD thermal analysis software packages (Icepak and Flotherm) are used to compare experimental results.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128152010","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal characterization of fan-heat sink systems in miniature axial fan and micro blower airflow 微型轴流风机和微型鼓风机气流中风扇-散热器系统的热特性

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915158

C. K. Loh, D. Nelson, D. Chou

引用次数: 13

The conceivable accuracy of experimental and numerical thermal analyses of electronic systems 电子系统的实验和数值热分析的可想象的精度

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915178

C. Lasance

{"title":"The conceivable accuracy of experimental and numerical thermal analyses of electronic systems","authors":"C. Lasance","doi":"10.1109/STHERM.2001.915178","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915178","url":null,"abstract":"The past decade has seen significantly increased use of computational codes to calculate the thermal behaviour of electronic systems. The benefits of these virtual prototyping tools are undisputed when performing parametric studies in early design phases. However, when the objective of the calculation is accuracy, as required for reliability and performance assessments, discussion about the level of accuracy to expect in practice becomes far from trivial. A natural question is how accurate numerical simulations are when compared to well-designed experiments in prototypes or final products. Many studies show amazing agreement, the conclusion often being that 'validation of the numerical model' has been proven. These conclusions are subject to serious doubt. This paper discusses 'every' topic associated with a comparison between numerical and experimental results that is based on first principles, not on fitting parameters until the two results match. The final conclusion is inevitable: the situation when all computations at system level can be used for accurate temperature prediction is still a long way off. There are two reasons for this. The first is the lack of sufficiently accurate input parameters and boundary conditions. The second is the fact that several complex physical phenomena that rule the heat transfer behaviour of electronic systems concur with complex geometries. From a practical point of view, detailed analysis of reality cannot and will not be performed for a long time to come. Several suggestions of how to solve these problems are presented.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114367709","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 62

Microprocessor-based adaptive thermal control for an air-cooled computer CPU module 基于微处理器的气冷计算机CPU模块自适应热控制

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915174

C. Lundquist, V. Carey

{"title":"Microprocessor-based adaptive thermal control for an air-cooled computer CPU module","authors":"C. Lundquist, V. Carey","doi":"10.1109/STHERM.2001.915174","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915174","url":null,"abstract":"This paper summarizes an exploration of design strategies for a microprocessor-based adaptive thermal control system for heat-dissipating computer CPU modules. The thermal control system contains a cold plate with an air-cooled base mode and a thermo-electric heat pump element that can boost cooling performance when needed. The microprocessor programming includes models of the heat transfer in the cold plate and the thermal performance of the thermo-electric heat pump and the fan coolers. The microprocessor is programmed to compare the thermal control system model predictions to the existing operating conditions. The results of this comparison are used to facilitate control of the cooling system and to provide fault detection during its operation. This paper reports the progress of an ongoing study that will explore different ways that the computational capability of the processor can be used to minimize power consumption while maintaining adequate processor temperature control over broadly varying operating conditions. The investigation also explores the merits of different strategies for incorporating fault detection features into the microprocessor programming to enhance the reliability and robustness of the system.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122994150","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

Thermoreflectance imaging of superlattice micro refrigerators 超晶格微型冰箱的热反射成像

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915145

J. Christofferson, D. Vashaee, A. Shakouri, P. Mélèse, Xiaofeng Fan, G. Zeng, C. Labounty, J. Bowers, E. Croke

引用次数: 26

Analysis of manifold fluid flow networks for air and liquid flow-through modular electronics 通过模块化电子元件分析空气和液体流动的流形流体流动网络

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI: 10.1109/STHERM.2001.915184

S. T. Johnson

引用次数: 5

Optimization of thermal resistance in quasi monolithic integration technology (QMIT) structure 准单片集成技术(QMIT)结构的热阻优化

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-19 DOI: 10.1109/STHERM.2001.915136

M. Joodaki, G. Kompa, H. Hillmer, R. Kassing

{"title":"Optimization of thermal resistance in quasi monolithic integration technology (QMIT) structure","authors":"M. Joodaki, G. Kompa, H. Hillmer, R. Kassing","doi":"10.1109/STHERM.2001.915136","DOIUrl":"https://doi.org/10.1109/STHERM.2001.915136","url":null,"abstract":"Quasi-monolithic integration technology (QMIT) is a new alternative to monolithic circuit fabrication for microwave and millimeter wave integrated circuits. Static thermal analysis of the standard QMIT structure has already been performed and the effects of different factors and parameters such as epoxy thermal conductivity, distance between active device and Si substrate (W), front side substrate metallization and heat spreader on the back side have been described (Joodaki et al, 2000). In the first structure (or standard structure) of QMIT, the holes in which the active devices are placed have been created by using conventional wet etching of silicon in KOH. It is well known that by using dry etching, the hole dimensions on the front side of the Si-wafer are more uniform, accurate and reproducible. There are two other possible structures, by using full dry etching, and through a combination of wet etching and dry etching. In this paper, a 2D finite element (FE) static heat transfer simulation has been used to find the best structure among these three structures and optimise its geometry and all its physical properties for lower thermal resistance, which makes it possible to use QMIT for high power microwave circuit applications. The results show that a combination of dry etching and wet etching gives a lower thermal resistance than the other two and with backside plating of 275 /spl mu/m gold as a heat spreader, epoxy thermal conductivity of 4 W/m.K and W of 5 /spl mu/m, a thermal resistance of less than 10/spl deg/C/W is possible.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115920838","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5