基于CFD分析的台式计算机系统热设计

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) Pub Date : 2001-03-20 DOI:10.1109/STHERM.2001.915139

C. Yu, R. Webb

{"title":"基于CFD分析的台式计算机系统热设计","authors":"C. Yu, R. Webb","doi":"10.1109/STHERM.2001.915139","DOIUrl":null,"url":null,"abstract":"This paper uses CFD (Icepak) to identify a cooling solution for a desktop computer, which uses an 80 W CPU. The design is based on a total chassis power dissipation of 313 W (40 W PCI cards). This represents significant power dissipation for the chassis components (memory, chipset, AGP and PCI cards, and peripherals). The analysis is also extended to 100 W PCI power. Of key interest is minimization of the chassis air flow requirements. The design is able to cool the chassis with one case fan and the power supply fan. A ducted 80/spl times/60 mm CPU heat sink is able to meet the CPU temperature specification. System level design improvements were made to provide better cooling for AGP and PCI cards.","PeriodicalId":307079,"journal":{"name":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"36","resultStr":"{\"title\":\"Thermal design of a desktop computer system using CFD analysis\",\"authors\":\"C. Yu, R. Webb\",\"doi\":\"10.1109/STHERM.2001.915139\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper uses CFD (Icepak) to identify a cooling solution for a desktop computer, which uses an 80 W CPU. The design is based on a total chassis power dissipation of 313 W (40 W PCI cards). This represents significant power dissipation for the chassis components (memory, chipset, AGP and PCI cards, and peripherals). The analysis is also extended to 100 W PCI power. Of key interest is minimization of the chassis air flow requirements. The design is able to cool the chassis with one case fan and the power supply fan. A ducted 80/spl times/60 mm CPU heat sink is able to meet the CPU temperature specification. System level design improvements were made to provide better cooling for AGP and PCI cards.\",\"PeriodicalId\":307079,\"journal\":{\"name\":\"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)\",\"volume\":\"81 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-03-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"36\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2001.915139\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2001.915139","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 36

摘要

本文采用CFD (Icepak)方法，确定了一台使用80w CPU的台式计算机的冷却方案。该设计基于机箱总功耗313w (40w PCI卡)。这表示机箱组件(内存、芯片组、AGP和PCI卡以及外设)的显著功耗。该分析还扩展到100w PCI功率。关键的兴趣是最小化底盘空气流动的要求。本设计通过一个机箱风扇和一个电源风扇对机箱进行散热。CPU散热器采用80/spl倍/ 60mm风管散热，满足CPU温度要求。系统级设计改进为AGP和PCI卡提供更好的冷却。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Thermal design of a desktop computer system using CFD analysis

This paper uses CFD (Icepak) to identify a cooling solution for a desktop computer, which uses an 80 W CPU. The design is based on a total chassis power dissipation of 313 W (40 W PCI cards). This represents significant power dissipation for the chassis components (memory, chipset, AGP and PCI cards, and peripherals). The analysis is also extended to 100 W PCI power. Of key interest is minimization of the chassis air flow requirements. The design is able to cool the chassis with one case fan and the power supply fan. A ducted 80/spl times/60 mm CPU heat sink is able to meet the CPU temperature specification. System level design improvements were made to provide better cooling for AGP and PCI cards.

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Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)

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