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2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)最新文献

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Microwave Transmission Line Design Across Split Reference Planes 跨分割参考平面的微波传输线设计
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193233
L. Berge, M. Doyle, T. Timpane, J. Bjorgaard
{"title":"Microwave Transmission Line Design Across Split Reference Planes","authors":"L. Berge, M. Doyle, T. Timpane, J. Bjorgaard","doi":"10.1109/EPEPS47316.2019.193233","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193233","url":null,"abstract":"The design for high-speed channels within electronic packaging traditionally focuses on interconnect and packaging solutions pertaining primarily to the signal conductor portion of a transmission line. However, the overall construct and path between driver and receiver includes not only the signal, but also the image return path, requiring the Signal Integrity engineer to pay close attention to the round-trip current path. Traditionally, this means that discontinuities in the ground return path are avoided at all cost. This paper will investigate deviations from this traditional mode of operation by exploring an application requiring intentionally designed traces over ground discontinuities. Additionally, the authors explore modeled and measured results obtained from constructs posed as alternatives to discontinuous ground transmission lines.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"161 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132901697","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Improved System Identification Modeling for High-speed Receiver 改进的高速接收机系统辨识模型
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193212
Bowen Li, Brandon Jiao, Min Huang, Romi Mayder, P. Franzon
{"title":"Improved System Identification Modeling for High-speed Receiver","authors":"Bowen Li, Brandon Jiao, Min Huang, Romi Mayder, P. Franzon","doi":"10.1109/EPEPS47316.2019.193212","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193212","url":null,"abstract":"It’s crucial to build the SerDes behavioral models with high simulation speed and good hardware correlation. In this research, we focus on building a high-speed SerDes receiver model, which has a fast simulation speed and excellent correlation. The proposed model doesn’t need any substantial domain knowledge and has a fast design process. Adaptive-ordered system identification models will be used to mimic the behavior of the high-speed receiver. The proposed modeling method shows high-correlation with the transient waveforms and eye diagrams measured from the on-die circuit.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131969306","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Broadband 3-D Boundary Integral Equation Characterization of Composite Conductors 复合导体宽带三维边界积分方程表征
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193207
Martijn Huynen, D. Zutter, D. Vande Ginste
{"title":"Broadband 3-D Boundary Integral Equation Characterization of Composite Conductors","authors":"Martijn Huynen, D. Zutter, D. Vande Ginste","doi":"10.1109/EPEPS47316.2019.193207","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193207","url":null,"abstract":"In this contribution, an improved 3-D differential surface admittance operator is employed in the simulation of composite conductors. By utilizing closed sums of infinite series that are present in the discretized operator, increased accuracy is achieved, especially for materials with a well-developed skin effect. The performance of this method is shown through the study of examples with coated and layered interconnects over a broad frequency range.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122496328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Design and measurement for high-speed interconnects between chip package, connector and PCB board 芯片封装、连接器与PCB板之间高速互连的设计与测量
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193206
Kaisheng Hu
{"title":"Design and measurement for high-speed interconnects between chip package, connector and PCB board","authors":"Kaisheng Hu","doi":"10.1109/EPEPS47316.2019.193206","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193206","url":null,"abstract":"Several calibration and de-embedding methods (TRL, ISD and AFR) are checked for both single-ended and differential structures on one test PCB board. The board is also used to evaluated transmission line, PCB parameter extraction and RF transition between package, connector and PCB.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115772197","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy 高精度纳米喷射系统与新型打印策略相结合的3d打印领结过滤器
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193232
M. Sippel, K. Lomakin, M. Ankenbrand, M. Petersen, J. Franke, K. Helmreich, M. Vossiek, G. Gold
{"title":"3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy","authors":"M. Sippel, K. Lomakin, M. Ankenbrand, M. Petersen, J. Franke, K. Helmreich, M. Vossiek, G. Gold","doi":"10.1109/EPEPS47316.2019.193232","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193232","url":null,"abstract":"This paper focuses on the latest aerosol based printing system in conjunction with a newly developed manufacturing method. The presented novel method is successfully demonstrated on a Bowtie Filter in comparison to the same pho-tolithographically produced structure.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122691486","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Fast Yield Analysis for Power Delivery Networks 输电网快速产量分析
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193219
J. Pingenot, D. de Araujo
{"title":"Fast Yield Analysis for Power Delivery Networks","authors":"J. Pingenot, D. de Araujo","doi":"10.1109/EPEPS47316.2019.193219","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193219","url":null,"abstract":"Power delivery networks (PDNs) are designed to meet a target impedance requirement over a range of frequencies. The requirement is typically met by adding decoupling capacitors between power and ground along with careful layout. Component tolerances in these capacitors may result in sub-optimal results that fail in system use. This paper presents a fast and accurate method for predicting the yield of a PDN using Monte Carlo simulation of a surrogate model and then applying the variance to a more detailed analysis.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125320439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EPEPS 2019 Technical Program Committee (TPC) EPEPS 2019技术计划委员会(TPC)
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/epeps47316.2019.9073258
{"title":"EPEPS 2019 Technical Program Committee (TPC)","authors":"","doi":"10.1109/epeps47316.2019.9073258","DOIUrl":"https://doi.org/10.1109/epeps47316.2019.9073258","url":null,"abstract":"","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"217 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133535446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EPEPS 2019 Keynote Address EPEPS 2019主题演讲
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/epeps47316.2019.9073249
{"title":"EPEPS 2019 Keynote Address","authors":"","doi":"10.1109/epeps47316.2019.9073249","DOIUrl":"https://doi.org/10.1109/epeps47316.2019.9073249","url":null,"abstract":"","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132481009","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Impact of On-Chip Interconnection in a Large-Scale Memristor Crossbar Array for Neural Network Accelerator and Neuromorphic Chip 神经网络加速器和神经形态芯片中大规模忆阻交叉栅阵列片上互连的影响
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193227
Taein Shin, Kyungjune Son, Seongguk Kim, Kyungjun Cho, Shinyoung Park, Subin Kim, Gapyeol Park, Boogyo Sim, Joungho Kim
{"title":"Impact of On-Chip Interconnection in a Large-Scale Memristor Crossbar Array for Neural Network Accelerator and Neuromorphic Chip","authors":"Taein Shin, Kyungjune Son, Seongguk Kim, Kyungjun Cho, Shinyoung Park, Subin Kim, Gapyeol Park, Boogyo Sim, Joungho Kim","doi":"10.1109/EPEPS47316.2019.193227","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193227","url":null,"abstract":"A crossbar array that combines computation and storage functions in non-volatile resistive memory is a promising artificial intelligence (AI) computing architecture. It is because it can largely save a significant energy from interconnection between a processor and a memory. However, the parasitic components from its dense interconnection can affect the electrical performance of noise-sensitive analog-computing and small read voltage margin of the memristor. In this paper, we designed a large-scale memristor crossbar array, and modeled it into equivalent circuit models and analyzed its signal integrity considering IR drop, crosstalk and ripple. These factors were compared depending on the physical dimension of on-chip interconnection and operating frequency. Based on the eye-diagram simulation, we could successfully demonstrate the voltage margin and timing margin for memristor operations.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127541639","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Iterative Loewner Matrix Macromodeling using CUR Decomposition for Noisy Frequency Responses 利用CUR分解进行噪声频率响应的迭代lower - ner矩阵宏建模
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193223
Mohamed Sahouli, A. Dounavis
{"title":"Iterative Loewner Matrix Macromodeling using CUR Decomposition for Noisy Frequency Responses","authors":"Mohamed Sahouli, A. Dounavis","doi":"10.1109/EPEPS47316.2019.193223","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193223","url":null,"abstract":"This paper presents an efficient macromodeling technique for modeling distributed circuits characterized by noisy frequency-domain data. The proposed method is based on an iterative Loewner matrix (LM) approach. Using the LM approximation of previous iterations, state space matrices of the system are made to be more accurate. This approach is shown to minimize the biasing effect of the noisy data resulting in more accurate poles and residues while reducing the computation time by taking advantage of CUR decomposition instead of using the usual singular value decomposition (SVD) decomposition. A numerical example is presented to illustrate the efficiency of the proposed method.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125248240","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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