Design and measurement for high-speed interconnects between chip package, connector and PCB board

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI:10.1109/EPEPS47316.2019.193206

Kaisheng Hu

引用次数: 2

Abstract

Several calibration and de-embedding methods (TRL, ISD and AFR) are checked for both single-ended and differential structures on one test PCB board. The board is also used to evaluated transmission line, PCB parameter extraction and RF transition between package, connector and PCB.

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芯片封装、连接器与PCB板之间高速互连的设计与测量

在一个测试PCB板上检查单端和差分结构的几种校准和去嵌入方法(TRL, ISD和AFR)。该板还用于评估传输线、PCB参数提取以及封装、连接器和PCB之间的射频转换。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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