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Proceedings IEEE Micro Electro Mechanical Systems. 1995最新文献

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An ultrasonic motor using bending cylindrical transducer based on PZT thin film 基于压电陶瓷薄膜的弯曲圆柱形换能器超声电机
Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472555
T. Morita, M. Kurosawa, T. Higuchi
{"title":"An ultrasonic motor using bending cylindrical transducer based on PZT thin film","authors":"T. Morita, M. Kurosawa, T. Higuchi","doi":"10.1109/MEMSYS.1995.472555","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472555","url":null,"abstract":"Ultrasonic motors have a distinguished performance of high torque. Especially, it seems that cylinder type ultrasonic motors are superior to disk or ring type ultrasonic motors in sense of high torque application. For miniaturization of a motor size, simple construction of an ultrasonic transducer become effective. In this work, we propose an ultrasonic motor using bending cylindrical transducer based on PZT thin film on side wall of a small tube. The transducer of the ultrasonic motor is composed of short cylindrical titanium pipe, PZT thin film and electrodes. The titanium pipe is introduced for a base material to deposit PZT thin film by hydrothermal method. The thickness of film is about from 7 to 9 pm. The electrodes are divided into 4 parts in circumferential direction to excite degenerated bending vibration mode with two RF driving electrical sources. A rotor loaded on the transducer turned around in the intended direction.The maximum revolution speed was 295 rpm.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127493901","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
A bidirectional silicon micropump 双向硅微泵
Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472560
R. Zengerle, J. Ulrich, S. Kluge, M. Richter, Axel Richter
{"title":"A bidirectional silicon micropump","authors":"R. Zengerle, J. Ulrich, S. Kluge, M. Richter, Axel Richter","doi":"10.1109/MEMSYS.1995.472560","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472560","url":null,"abstract":"Abstract In this paper we present a bidirectional silicon micropump. It consists of an electrostatically actuated diaphragm and two passive check valves. It differs from other well-known diaphragm pumps, generally referred to as unidirectional pumps, in the layout of the valves. We have designed a flap valve with a first mechanical resonance frequency between 1 and 2 kHz (in the fluid environment). At low actuation frequencies (0.1–800 Hz), the pump works in the forward mode. At higher frequencies (2–6 kHz) the pump operates in the reverse direction. This is due to a phase shift between the response of the valves and the pressure difference that drives the fluid. Investigating different pump layouts, we achieve maximum pump rates of 250 and 850 μl min -1 in the forward direction as well as 400 and 200 μl min -1 in the reverse direction. The maximum back pressure is 31 000 Pa (3.1 m H 2 O) in the forward and 7000 Pa (0.7 m H 2 O) in the reverse direction.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126857933","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 391
Measurements of physical parameters with ultrasound and microdiaphragms 用超声波和微隔膜测量物理参数
Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472539
W. Schomburg, M. Vitt, W. Bacher, M.W. Borner, W. Menz
{"title":"Measurements of physical parameters with ultrasound and microdiaphragms","authors":"W. Schomburg, M. Vitt, W. Bacher, M.W. Borner, W. Menz","doi":"10.1109/MEMSYS.1995.472539","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472539","url":null,"abstract":"Ultrasonic investigations normally provide information about the position, geometry and size of a body without direct access to it. The use of microdiaphragms allows the measurement of physical parameters, such as temperature, strain, density and viscosity, by means of ultrasound. Measurement is based on the influence of the measured quantity on the mechanical vibrations of microdiaphragms stimulated by an ultrasonic pulse [l-31. Microdiaphragm vibrations are detected by the ultrasound they emit. Various applications of this measuring concept are possible. The technique is particularly useful where no direct wire connections can be made to the measuring point, The sensing element is fabricated with mass production techniques which allow a cost effective production. This kind of measurement is expected to add to the ability to make contactless measurements of temperature and strain by implanted sensors and determine the density and viscosity in totally sealed containers, e .g . , to control the quality of canned food or paint.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131548671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
The fine patterning of diamond thin film 金刚石薄膜的精细图案
Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472565
M. Mao, T. P. Wang, Jin Xie, W. Y. Wang
{"title":"The fine patterning of diamond thin film","authors":"M. Mao, T. P. Wang, Jin Xie, W. Y. Wang","doi":"10.1109/MEMSYS.1995.472565","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472565","url":null,"abstract":"Due to its unique properties (high nicchanical strength, low friction coeficicnt, high wear rcsistance and cheniical incrtncss), diamond is an esccllcnt candidate matcrial for micromechanical application. One of the important considerations in the fabrication of diamond MERlS is fine patterning. Direct patterning of diamond is difficult due to its extreme resistance to chemical attack. An alternative approach is to grow a prepattemcd film through selective nucleation. However, nucleation selectivity (<IO5) reported in previous were not high enough to realize patterning in mixon scale. The authors have developed a i x w l sc!cctia dcposition method in which a high sclectivity (5x lo6) was achieved and perfcct diamond patterns with narrowest width I . 8 p i were obtained at the first tinic[\"I. ~n tlie present paper, we rcport tlie rcccnt dcvclopmcnt in the fabrication of diamond micromotor structure bascd on this patterning proccss as well as boron-doping technique.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115640143","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
High aspect ratio microstructures on porous anodic aluminum oxide 多孔阳极氧化铝的高纵横比微观结构
Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472536
Songsheng Tan, M. L. Reed, Hongtao Han, R. Boudreau
{"title":"High aspect ratio microstructures on porous anodic aluminum oxide","authors":"Songsheng Tan, M. L. Reed, Hongtao Han, R. Boudreau","doi":"10.1109/MEMSYS.1995.472536","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472536","url":null,"abstract":"Various technologies have been developed to fabricate high aspect ratio microstructures on planar surfaces. In this work, we present a technology which exploits the highly ordered pore structure of anodic aluminum oxide. Using this technology, we have fabricated 120pm high microstructures with vertical side walls; we estimate millimeter high structures with aspect ratios exceeding 1000: 1 could be achieved.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115483919","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
Microchemistry: manipulation, fabrication, and spectroscopy in small domains 微化学:小领域的操作、制造和光谱学
Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472563
H. Masuhara
{"title":"Microchemistry: manipulation, fabrication, and spectroscopy in small domains","authors":"H. Masuhara","doi":"10.1109/MEMSYS.1995.472563","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472563","url":null,"abstract":"Laser has superior properties such as coherency, monochromaticity, focusability, and short pulse, hence their utilization have opened new chemical research areas on methodologies, instrumentations, reaction dynamics, and designing chemical reactions. One representative example of such laser chemistry is state-to-state chemistry. This is based on high resolution spectroscopy due to monochromaticity of laser. Reactions can be initiated from particular electronic, vibrational, as well as rotational energy levels of reactants and led to products with specific energy levels. Reaction path can be elucidated in detail for isolated molecules and clusters in gas phase. Multiphoton absorption, vibrational energy re-distribution, and photodecomposition are practical subjects in the laser chemistry. High-time resolution in spectroscopy was attained only by introducing pulse lasers. Now fs laser is available, and studies on primary photoprocesses such as electron transfer, proton transfer, energy transfer, isomerization, dissociation, and so forth have constituted an important field called chemistry of ultrafast phenomena. This is another laser chemistry. The third laser chemistry is considerd to be microchemistry which is based on focusability and spatial characteristics of laser beam. It is now possible to choose materials as well as reagents, to transfer them to a certain point, and to induce chemical reaction in small dimension by exerting optical pressure with focused laser beam. Combining this laser manipulation method with spectroscopic and fabrication methodologies, we have demonstrated new aspects of micromanipulation and microfabrication, and furthermore elucidated new chemical phenomena characteristic of pm-sized small volumes. Although the reactions occurring in pm dimension have been considered to be similar to those of the bulk, analysis of chemical dynamics have provided new insights. These advances are summarized and the importance of microchemistry is described in this article. 2. Laser micromanipulation","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"58 6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116520572","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Vertical comb array microactuators 垂直梳子阵列微致动器
Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472556
A. Selvakumar, K. Najafi, W. Juan, S. Pang
{"title":"Vertical comb array microactuators","authors":"A. Selvakumar, K. Najafi, W. Juan, S. Pang","doi":"10.1109/MEMSYS.1995.472556","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472556","url":null,"abstract":"A vertical actuator fabricated using a trench-refilled-with-polysilicon (TRiPs) process technology and employing an array of vertical oriented comb electrodes is presented. This actuator structure provides a linear drive to deflection characteristic and a large throw capability which are key features in many sensors, actuators and micromechanisms. The actuation principle and relevant theory is developed, including FastCap simulations for theoretical verification. Design simplifications have been suggested that enable one to use parallel plate analytical expressions which match simulation results with /spl sim/5.6% error. Several actuators were designed and fabricated using the 7-mask TRiPs technology with calculated drive voltages as low as 45 V producing 10 /spl mu/m of deflection. The actuators employed a mechanical structure that was 18 /spl mu/m tall using a polysilicon layer 1.5 /spl mu/m thick and occupying a total area of 750 /spl mu/m by 750 /spl mu/m. The actuators were successfully tested electrostatically and several microns of deflection were observed.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125802013","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 74
3D coupled electro-mechanics for MEMS: applications of CoSolve-EM MEMS三维耦合电力学:CoSolve-EM的应用
Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472542
J. Gilbert, R. Legtenberg, S. Senturia
{"title":"3D coupled electro-mechanics for MEMS: applications of CoSolve-EM","authors":"J. Gilbert, R. Legtenberg, S. Senturia","doi":"10.1109/MEMSYS.1995.472542","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472542","url":null,"abstract":"Micro-electro-mechanical systems (MEMS) are often designed on scales at which electrostatic forces are capable of moving or deforming the parts of the system. In this regime accurate prediction of device behavior may require 3D coupled simulations between the electrostatic and mechanical domains. We have recently developed CoSolve-EM, a coupled solver for 3D quasi-static electro-mechanics. In this paper, we demonstrate the application of CoSolve-EM to five classes of electro-mechanical problems that are often intractable to other techniques. These classes are: devices with electrostatic pull-in instabilities, devices in which precise deformations are required, devices driven by multiple conductors, capacitive sensors that make use of surface contact, and actuators that make use of surface contact.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128700095","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 105
3D structures with piezoresistive sensors in standard CMOS 三维结构与压阻传感器在标准CMOS
Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472608
E. Hoffman, B. Warneke, E. Kruglick, J. Weigold, K. Pister
{"title":"3D structures with piezoresistive sensors in standard CMOS","authors":"E. Hoffman, B. Warneke, E. Kruglick, J. Weigold, K. Pister","doi":"10.1109/MEMSYS.1995.472608","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472608","url":null,"abstract":"Aluminum hinges and polysilicon piezoresistors have been fabricated in a standard commercial CMOS process with one maskless post-processing step. The hinges and piezoresistors are formed using the metal interconnect and transistor gate layers in the CMOS process. Xenon difluoride is shown to be a simple and effective alternative to standard bulk etchants for this process, because of its extreme selectivity and gentle gas phase etch. Preliminary results from a piezoresistive accelerometer are given.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130827985","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 52
Development of a microphotocantilever for near-field scanning optical microscopy 近场扫描光学显微镜用微光悬臂梁的研制
Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472538
S. Akamine, H. Kuwano, K. Fukuzawa, Hirofumi Yamada
{"title":"Development of a microphotocantilever for near-field scanning optical microscopy","authors":"S. Akamine, H. Kuwano, K. Fukuzawa, Hirofumi Yamada","doi":"10.1109/MEMSYS.1995.472538","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472538","url":null,"abstract":"A new type of near-field scanning optical microscopy (NSOM) using a microcantilever with a photo diode on its tip is described. The photo-sensitive cantilever, c alled a microphotocantil ever, was fabricated using micromachining techniques and its use demonstrated. Fine NSOM images below 20 nm are obtained. Atomic force microscopy (AFM) c an be done simultaneously to NSOM using t he microphotocantilever. Well correlated NSOM and AFM images are obtained in the near-field optical mode.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128926742","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
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