Proceedings IEEE Micro Electro Mechanical Systems. 1995最新文献

{"title":"Performance impact of monolayer coating of polysilicon micromotors","authors":"K. Deng, R. J. Collins, M. Mehregany, C. Sukenik","doi":"10.1109/MEMSYS.1995.472568","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472568","url":null,"abstract":"This paper reports the impact on performance of flange-bearing polysilicon micromotors for different self-assembled monolayer coatings on the surface of released motors. Octadecyltrichlorosilane (OTS) and (3,3,3-trifluoropropyl) trichlorosilane (TFP) are found to be promising as they significantly improve micromotor performance. Micromotors coated with OTS show a stable rotor speed and minimum operating voltage during a nine-month testing period. The experiments on gear ratio as a function of wobble cycles indicate that wear in a bearing without OTS coating is significant and results in changes in the gear ratio from the start of micromotor operation by as much as 40%, while the change of gear ratio is within 4% for near 80 million wobble cycles over a nine-month testing period for motors with OTS coating. For motors coated with TFP, no stiction and no significant change of the gear ratio are observed for the testing duration. However, the study of gear ratio as a function of wobble cycles shows that the rotor speed fluctuates in the beginning and then stabilizes for wobble micromotors coated with TFP. OTS coating is found to decrease the flange frictional force/torque by a factor of about 1.5. This net reduction of the flange friction force/torque comes about from the combined action of increasing the frictional coefficient from 0.36 to 0.55 and decreasing the normal contact force associated with the rotor/flange contact friction from near 0.8 μN to near 0.3 μN","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"124 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127200685","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Micro-optical components for fiber and integrated optics realized by the LIGA technique","authors":"M. Gerner, T. Paatzsch, L. Weber, H. Schift, I. Smaglinski, H. Bauer, M. Abraham, W. Ehrfeld","doi":"10.1109/MEMSYS.1995.472600","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472600","url":null,"abstract":"For a cost effective mass production of high precision micro-optical and micro-mechanical elements and devices for the rapidly growing market of telecommunication micro-systems and sensors, the LIGA technique (German acronym for the process steps lithography, electroforming and moulding) is a very promising fabrication tool [1,2]. The excellent precision and high aspect ratios that are possible make LIGA structures well adapted for applications concerning data transfer via glass fibers in combination with optical packaging and interconnection [3]. Fiber grooves with additional fixing elements have been realized, allowing exact alignment of the fiber and positioning of the fiber-end face. Furthermore, various micro-mechanical elements have been fabricated which can adjust fibers in ribbon connectors to achieve high coupling efficiency [4]. Transparent polymeric materials have been used for injection moulding or embossing to realize microoptical structures that form a complete \"micro-optical bench\" with lenses, mirrors, beam splitters and prisms. Here, a light beam may be guided, its intensity profile may be altered or it may pass additional elements placed in the beam path [SI. The \"side-wall surfaces\" obtained by LIGA show a roughness below 50nm (rms) and, therefore, are suitable for optical purpose in the visible and IR. Recently, it has been shown that replication technologies like embossing, casting or injection moulding are a very powerful tool to realize polymer waveguides [6-lo]. By replication it is possible to integrate waveguides, passive fiber alignment structures and micro-optical components onto a substrate by a single fabrication step. Another remarkable advantage compared with conventional planar techniques is that the realization of new types of three-dimensional structures (e.g. in the field of fiberchip-coupling) can be accomplished. X-ray lithography, conventional photoresist lithography or laser-micromachining followed by electroplating have been used to fabricate metal mould inserts which subsequently served for the replication of waveguide patterns by hot embossing into polymer substrates. These waveguide-'grooves' have been filled with a second material with higher index of refraction. Ysplitters, straight and curved waveguides for single and multimode operation have been realized. In a similar way, micro-cuvettes can be filled with substances showing nonlinear-optical properties or may also be used as flow channels in optical sensor devices. Also a modularly designed micro-chemical analysis system with micro-cuvettes and a micro-optical bench, allowing the measurement o f continuous flow liquid probes, is under development. All of these products are subject to the same requirements. These are: structure dimensions from some microns (waveguide) to some hundred microns (fiber alignment), accuracy of the micro structures in the sub-micron range, mass production of such micro-optical products,","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127076929","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A quantitative analysis of Scratch Drive Actuator using buckling motion","authors":"T. Akiyama, H. Fujita","doi":"10.1109/MEMSYS.1995.472603","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472603","url":null,"abstract":"This paper presents a surface micromachined polysilicon actuator which employs an electrostatic driven Scratch Drive Actuator (SDA) to generate a force that can move an extemal object. The micro actuator consists of the SDA, a link frame and a buckling beam. Using this structure, generated forces of the SDA as a function of applied pulse peak voltages were measured. A typical generated force was 63 pN at +112 V pulse peak voltage. Indirect and direct methods of obtaining physical work from the micro actuator are presented. The actuator could lift 1 mg weight up at a height of about 100 pm from the wafer surface by the direct method. The total energy of this work was 1 nJ.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"363 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125818645","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Groove depth uniformization in [110] Si anisotropic etching by ultrasonic wave and application to accelerometer fabrication","authors":"K. Ohwada, Y. Negoro, Y. Konaka, T. Oguchi","doi":"10.1109/MEMSYS.1995.472546","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472546","url":null,"abstract":"We studied the use of ultrasonic waves to obtain uniform groove depth in (1 10) Si anisotropic etching. Using dynashock type ultrasonic waves, whose frequency is switched between 3 frequencies at very short intervals, grooves with uniform depth could be successfully formed with widths of 1-20 ~m independently of pattern width and pattern spacing. This technology was applied to the fabrication of an accelerometer with comb-type narrow gap electrodes. Comb electrodes with a minimum gap of 3.0 ~m and a height of 58 ~m could be formed uniformly, although they had different pattem widths and pattern spacings. The capacitance of this device has a high sensitivity to acceleration of 39 pF/g. By combining it with an output CV converter and amplifiers, we produced a sensor with good full-scale linearity of 0.63% over the acceleration range of -2 to +2 g.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121503455","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A self-diagnostic airbag accelerometer with skew-symmetric proof-mass","authors":"J. Ko, Gyu Hyun Kim, Young‐Ho Cho, K. Lee, B. Kwak, Kwanhum Park","doi":"10.1109/MEMSYS.1995.472587","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472587","url":null,"abstract":"This paper describes the design, fabrication and testing of a piezoresistive cantilever-beam microaccelerometer for automobile airbag applications. Fabricated devices show a resonant frequency of 2.07kHz, a sensitivity of 65pVIglV with a nonlinearity of 4% over f50g ranges. Flat amplitude response and frequency-proportional phase response indicate that 70% of critical damping level has been accurately achieved in the fabricatcd devices. Novel aspects of this work include: a skewsymmetric proof-mass design for self-diagnostic capability and zero transverse sensitivity; a multi-step anisotropic etching process for beam thickness control and fillet-rounding formation; the use of UV-curing paste for silicon-to-glass bonding. It is shown that the new aspects of this work are used to yield a simple, practical and effective mean for improving the performance, reliability, robusmess, process simplicity as well as the reproducibility of the accelerometers.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124380478","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"System design for cooperative control of arrayed microactuators","authors":"S. Konishi, H. Fujita","doi":"10.1109/MEMSYS.1995.472601","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472601","url":null,"abstract":"A system design is presented with the aim of controlling many microactuators as autonomous distributed micromachines (ADM). ADM consist of many micro cells which are smart enough to control their own motions and to cooperate with each other. A conveyance system in a plane is selected as an example of ADM. We have developed a practical design of ADM composed of many micro cells integrated with actuators, sensors and circuits which can be fabricated by IC-compatible micromachining. The behavior of the system is examined by simulation on a computer model. Fluidic micro actuator array for a conveyor has also been fabricated","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127633002","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Vibration mode investigation of a resonant silicon tube structure for use as a fluid density sensor","authors":"P. Enoksson, G. Stemme, E. Stemme","doi":"10.1109/MEMSYS.1995.472540","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472540","url":null,"abstract":"We present a new sensor for on-line measurements of fluid density. The sensor consists of a tube system in single crystalline silicon which oscillates in mechanical resonance. The fluid is conveyed into and through two identical, serially and planarly arranged tube loops. A change in the density of the fluid in the tube changes the resonance frequency due to the change in the mass of the vibrating tube system. The sensor is fabricated using double-sided silicon KOH-etching and silicon fusion bonding. The silicon tube system (without the frame) is 8.6 by 17.7 mm with a thickness of 1 mm. The tubes have an inner diameter of approximately 0.8 mm and an outer diameter of approximately 1 mm. The micromachining process results in a total tube length of 61 mm and a sample volume of 0.035 ml. Fluid density measurements are presented and the vibration modes investigated.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121942731","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A computationally practical approach to simulating complex surface-micromachined structures with fabrication non-idealities","authors":"H. Yie, S. Bart, Jacob K. White, S. Senturia","doi":"10.1109/MEMSYS.1995.472541","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472541","url":null,"abstract":"The objective of this work was to develop methods which would allow the electromechanical analysis of a Microelectromechanical System (MEMS) structure with the level of complexity of a practical, high-volume manufacturable sensor while avoiding computationally impractical models. Two methods were developed. One was a simple analysis method in which the ideal structure was assumed. This allowed prediction of the stability and the effects of structure misalignment on a surface-micromachined ac,:elerometer. However, the simple method is limited bccause the actual structure has fabrication induced non-idealities, such as warpage, which can cause the simple method to be significantly in error. The second method discarded the ideal structure assumption and analyzed the non-ideal structure via a self-consistent analysis. This method is based on the calculation of an intermediate look-up table from which the electrostatic forces are obtained directly from the position of the moving mass, greatly reducing computation time and memory requirements in comparison to a standard self-consistent electromechanical analysis scheme. Using this lumped-model self-consistent scheme, we analyzed an Analog Devices, Inc. ADXL50 accelerometer including fabrication non-idealities (warpage, overetching, residual stress, etc.). For this structure the lumped-model self-consistent analysis method reduced the required number of electrostatic analysis discretization panels by a factor of about 100. Computation times were typically 5-7 hours instead of a predicted time of more than a month for a standard self-consistent electromechanical analysis scheme. Further, memory requirements for the standard method would have significant,ly exceeded practical limitations. The electromechanical resonant frequency was measured for several ADXL50 accelerometers and compared to t,he simulat,ion results showing good agreement.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"402 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132038394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Low temperature SDB and interface behaviours","authors":"J. Jiao, D. Lu, B. Xiong, Weiyuan Wang","doi":"10.1109/MEMSYS.1995.472564","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472564","url":null,"abstract":"In this paper, the realization and quality evaluation of low temperature silicon direct bonding(LTSDB) have been described. Through HREM and SIMS methods, the bonding interface characteristics were investigated. The interface structure, such as dislocations and randomly distribution of Si02, were observed in HREM images. The SIhlS results showed the distribution near the bonding interface and other properties of Si-H atomic groups. We proposed a new two-step LTSDB mechanism.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130877832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Integrated flux concentrator improves CMOS magnetotransistors","authors":"M. Schneider, R. Castagnetti, M. Allen, H. Baltes","doi":"10.1109/MEMSYS.1995.472606","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472606","url":null,"abstract":"A magnetic microsystem based on CMOS technology merged with electroplating as a post-processing step is reported. The system makes use of a lateral dualcollector magnetotransistor with suppressed-sidewallinjection (SSIMT) and a highly permeable and soft magnetic microstructure of permalloy. This structure increases the magnetic flux density in the sensitive SSIMT region. It is deposited on top of the sensor chip using a CMOS compatible electroplating technique [ 11. The system sensitivity is increased by at least one order of magnitude over the conventional SSIMT.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124246694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}