Proceedings IEEE Micro Electro Mechanical Systems. 1995最新文献_第2页

Self-aligned machining and assembly of high aspect ratio microparts into silicon 高纵横比微部件自对准加工和组装成硅

Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472571

H. H. Langen, T. Masuzawa, M. Fujino

{"title":"Self-aligned machining and assembly of high aspect ratio microparts into silicon","authors":"H. H. Langen, T. Masuzawa, M. Fujino","doi":"10.1109/MEMSYS.1995.472571","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472571","url":null,"abstract":"A new technology is presented in this paper for the selfaligned machining and assembly of 3D microparts and their tools using a WEDG unit and a mini work table consisting of a metal plate or a silicon and metal plate combination. Machining and assembly was carried out in a modular way on a single, newly developed prototype of low-cost and the following fabrication examples are given: micropipe-macrocylinder combination, a simple microrotor module which is inserted and guided into a silicon substrate and some mechanical parts of a skeleton of a possible 3D electromagnetic micromotor (permalloy stator fabricated through a silicon block into a permalloy substrate and a permalloy rotor disk with shaft). The following machining techniques were used: wire electrodischarge grinding (WEDG) [ 11, micro electrodischarge machining (micro-EDM), reverse micro-EDM (RMEDM) and micro ultrasonic machining (microUSM). Ultrasonic vibration was also applied for the self-aligned assembly of (micro)parts. The WEDG/micro-USM processing combination is a novel development, it features the self-aligned \"throughwafer\" machining. With a metal plate connected at the wafer's backside, self-aligned machining and assembly was carried out on the silicon substrate indirectly. Examples (electromagnetic micro motor, etc) are given of 3D MEMS that could be fabricated in the future when these techniques are successfully combined with MEMS fabrication techniques.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124562584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Perforated silicon dices with integrated nerve guidance channels for interfacing peripheral nerves 带集成神经引导通道的穿孔硅器件，用于连接周围神经

Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472594

J. Meyer, H. Beutel, E. Valderrama, E. Cabruja, P. Aebischer, G. Soldani, P. Dario

{"title":"Perforated silicon dices with integrated nerve guidance channels for interfacing peripheral nerves","authors":"J. Meyer, H. Beutel, E. Valderrama, E. Cabruja, P. Aebischer, G. Soldani, P. Dario","doi":"10.1109/MEMSYS.1995.472594","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472594","url":null,"abstract":"It has been shown previously that peripheral nerve axons are regenerating through microvias in silicon devices. A major challenge is the design of a biocompatible integrated neural connector allowing simultaneous, multi-site recordings or stimulation of axons in nerve bundles and to establish a reliable mechanical and electrical connection. This paper describes on-going research in the framework of an European project aimed to develop an implantable neural microsystem comprising various designs of perforated dices, multiple electrodes with on-chip integrated preprocessing circuitry, functional guidance channels for support and fixation of regenerating axons, and interconnection assemblies for bi-directional nervous signal transmission. Special emphasis is given on a light-weight design of the device and on the biocompatible integration and packaging of the chip. In this paper, we report about the microfabrication of the perforated dices, their incorporation into biocompatible guidance channels, and about in vitro and in vivo biocompatibility testing of materials applied.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124828298","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 15

Fabrication of 45/spl deg/ optical mirrors on 45/spl度光学反射镜的制造

Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472572

C. Strundman, L. Rosengren, Y. Backlund

引用次数: 2

Deformable mirror display with continuous reflecting surface micromachined in silicon 具有连续反射表面的可变形镜面显示器，由硅微机械加工而成

Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472553

G. Vdovin, S. Middelhoek, L. Sarro

引用次数: 23

Optical tactile sensor using surface-emitting laser 使用表面发射激光器的光学触觉传感器

Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472575

E. Yamamoto, S. Hashimoto, M. Ito, I. Komazaki, K. Yanagisawa

{"title":"Optical tactile sensor using surface-emitting laser","authors":"E. Yamamoto, S. Hashimoto, M. Ito, I. Komazaki, K. Yanagisawa","doi":"10.1109/MEMSYS.1995.472575","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472575","url":null,"abstract":"There exists a growing demand for an ultra small tactile sensor used in future industrial and medical systems, such as a miniature robot for inspection and repair in an extremely small space and an endoscopelcatheter used in the minimum invasive, laparoscopic surgical system for diagnosis and treatment. An optical sensor has a high sensitivity and a large Electromagnetic Interference (EMI) tolerance, which is necessary and important in a practical use combined with any other electrical apparatus. However, a miniaturization and a product cost reduction of an optical sensor is very difficult because a conventional high sensitive optical sensor consists of a laser and many precisely assembled optical components such as a lens for a beam shaping, an optical isolator to prevent a lasing wavelength instability induced by an optical feedback, an optical beam splitter to construct an interferometric optical path. Recently, some optical pressure sensor using an optical fiber is developed[l],[2]. These sensor consists of a small sensing element and a rather large optical interferometer which is spatially separated from the sensing element. Although sensing tips of these fiber-optic sensors are rather small, they have a serious drawback that the change of fiber bending shape strongly affects on a sensor output to induce sensing error. A surface-emitting laser (SEL) has two advantages compared to a conventional edgeemitting laser for the sensing use. One is a lasing wavelength stability against an optical feedback. The other is a design flexibility for a divergence angle of radiation beam. Consequently, an optical sensor with SEL can realize a miniaturized sensor which does not needs any optical components such as lenses and an optical isolator. This paper describes a feasibility study for an optical tactile sensor using SEL as a light source. 2. Principle of Operation","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131431834","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Electrostatic curved electrode actuators 静电弯曲电极致动器

Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472557

R. Legtenberg, E. Berenschot, M. Elwenspoek, J. Fluitman

{"title":"Electrostatic curved electrode actuators","authors":"R. Legtenberg, E. Berenschot, M. Elwenspoek, J. Fluitman","doi":"10.1109/MEMSYS.1995.472557","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472557","url":null,"abstract":"This paper presents the design and performance of an electrostatic actuator consisting of a laterally compliant cantilever beam and a fixed curved electrode, both suspended above a ground plane. A theoretical description of the static behavior of the cantilever as it is pulled into contact with the rigid fixed-electrode structure is given. Two models are presented: a simplified semi-analytical model based on energy methods, and fully three-dimensional (3-D) coupled electromechanical numerical simulations using CoSolve-EM. The two models are in qualitative agreement with each other, and predict stable actuator behavior when the beam deflection becomes constrained by the curved electrode geometry before electrostatic pull-in can occur. The pull-in behavior depends on the shape of the curved electrode. Test devices have been fabricated by polysilicon surface micromachining techniques. Experimental results confirm the basic theoretical results. Stable behavior with relatively large displacements and forces can be generated by these curved electrode actuators. Depending on the design, or as a result of geometrical imperfections, regions of unstable (pull-in) deflection behavior are also observed.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134428803","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 266

Fabrication of monolithic microchannels for IC chip cooling 集成电路芯片冷却用单片微通道的制备

Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472569

Youngcheol Joo, Kiet Dieu, C. Kim

引用次数: 33

Chemical analysis in nanoscale needs, possibilities, techniques and outlooks 纳米级化学分析的需求、可能性、技术和前景

Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472586

J. Roeraade

引用次数: 0

"Spatial forming"-a three dimensional printing process “空间成形”——三维打印过程

Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472579

C. S. Taylor, Paul Cherkas, Hilary J. Hampton, J. Frantzen, B. Shah, W. Tiffany, L. Nanis, P. Booker, Amr Salahieh, R. Hansen

{"title":"\"Spatial forming\"-a three dimensional printing process","authors":"C. S. Taylor, Paul Cherkas, Hilary J. Hampton, J. Frantzen, B. Shah, W. Tiffany, L. Nanis, P. Booker, Amr Salahieh, R. Hansen","doi":"10.1109/MEMSYS.1995.472579","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472579","url":null,"abstract":"A three-dimensional printing process which we call “spatial forming” has been conceived and demonstrated as a method of manufacturing parts for cardiac catheter systems.’ This work extends the range. of particulate forming techniques into the niicrostructure area; brings to bear on the manufacture of three-dimensional structures the high production capabilities of offset lithography; and allows us to visualize a complete process for the volume production of objects and assemblies of a geometric complexity hitherto found only in nature. This process combines several technologies to generate solid metallic microstructures from fine powder. Cross section data from computer solid niodcls are used for patterning of a chrome mask which images a lithographic printing plate like those used in the publishing industry. A custom built offset printin9 press prints “negative” material (the space around the parts) on a ceramic substrate in multiple registered layers of ceramic pigmented organic ink averaging 0.5 pm thick; each layer is cured with L5’ light. Periodically an ink heavily loaded with finely powdered metal is knifed onto the substrate, filling the non-image voids with “positive” part material. This material is also UV cured, the surface planarized, and the entire printing process repeated in proper register until the desired thickness (e.g. -SO0 pm) is reached. The semi-finished parts are then debinderized to remove organic ink components, and sintered in controlled atmosphere futnaces in processe.s similar to those used in the metal injection molding industr).. The negative material crumbles away and the finished paits separate from the substrate.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"255 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116169387","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 18

DEEMO: a new technology for the fabrication of microstructures DEEMO:制造微结构的新技术

Proceedings IEEE Micro Electro Mechanical Systems. 1995 Pub Date : 1995-01-29 DOI: 10.1109/MEMSYS.1995.472573

J. Elders, H. Jansen, M. Elwenspoek, W. Ehrfeld

引用次数: 49