Proceedings IEEE Micro Electro Mechanical Systems. 1995最新文献

{"title":"A differential pressure liquid flow sensor for flow regulation and dosing systems","authors":"M. Boillat, A. Van der Wiel, A. Hoogerwerf, N. D. de Rooij","doi":"10.1109/MEMSYS.1995.472596","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472596","url":null,"abstract":"A liquid flow sensor based on the measurement of the pressure difference across a flow restriction integrated between two silicon pressure sensors is presented. Depending on the channel size, the FS flow measurement ranges from 50 pl/hr up to 20 ml/hr, with a non-linearity better than 1 %FS. This device is used in a system consisting of a silicon micro-pump and an electronic controller to achieve a high precision flow rate. The fast response of the sensor, < 2 ms, allows for minute dosing with a resolution of 0.1 pl. Introduction Silicon fluid handling systems have been built in the past years for use in chemical analysis and medical applications. These systems generally lack a consistent liquid delivery over an extcnded period of time, typically tens of hours. Thus, they require frequent rccalibration to ensure the accuracy needed. However, their capability of delivering minute quantity of liquid makes them very attractive for such applications. The addition of a sensor that measure the actual flow in such systems allows for improved consistency and accuracy. This paper presents the design, fabrication and the characterization of such a sensor. Sensor description The sensors have been fabricated starting from piezoresistive low pressure sensor wafers devcloped at ASCOM. The addition of a restriction channel between two adjacent pressure sensor die forms the flow sensor device, as depicted in figure 1. The risk of unstability and degradation of the sensor is rcduced because only the backside of the sensors is exposed to the liquid. ~104 in Flow out Figure 1. Device cross section (principle) 0-7803-2503-6","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133461832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A novel approach to assembly and interconnection for micro electro mechanical systems","authors":"T. Suga, N. Hosoda","doi":"10.1109/MEMSYS.1995.472589","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472589","url":null,"abstract":"The current microfabrication technology for micro electro mechanical systems is based on surface micromachining techniques for basic processing steps of silicon-LSI technology. It is, however, clear that fabrication of real intelligent microsystems requires not only substantial progresses in the micromachining technology but also the ability to integrate and assemble microcomponents to get a requisite three-dimensional structure. Because no mechanical joining method, however, is available for micrometer or nanometer-scale components, and physical and chemical interactions between the contact surfaces of the components become more important and dominant than the mechanical interaction as the size of the components decreases, bonding and interconnection become a key technology for further development of micro electro mechanical systems[l]. The main drawback of the conventional bonding methods, such as microsoldering, diffusion bonding as well as fusion bonding of Si wafer, is their high process temperatures which exclude the use of less heatresisting components or preprocessed devices. The reaction between the bonded pair in elevated temperatures may change the structures of the bonded materials themselves. In addition, the elastic and thermal dissimilarity of the bonded pair producesvery high thermal stresses, which may lead to debonding or interface failure.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124833874","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Fabrication of a single crystalline silicon capacitive lateral accelerometer using micromachining based on single step plasma etching","authors":"X. Li, P. French, P. Sarro, R. Wolffenbuttel","doi":"10.1109/MEMSYS.1995.472592","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472592","url":null,"abstract":"Silicon capacitive accelerometers are superior to their piezoresistive counterparts due to their high sensitivity and low temperature coefficient, especially for downscaled microsensors [ 11. Several processes have been developed for the fabrication of such devices, such as surface micromachining [2]; bulk micromachining using wet etching [ 3 ] or using plasma etching (SCREAM) [4]. Surface micromachining suffers from limited structural film thickness (< 2 pm), which limits the mass and sidewall capacitance value and, therefore, the sensitivity of the device. Bulk micromachining using wet etching depends on crystal orientation and usually results in tapered sidewalls, thus limiting the minimum lateral dimensions. Therefore, it is desirable to micromachine bulk silicon with directional plasma etching so as to achieve superior mechanical properties, small lateral dimensions and large vertical dimensions. Although the SCREAM process does fulfil these requirements, it is a rather complicated process involving several film deposition and etching steps. Furthermore, the resulting surface non-planarity make it very difficult to integrate on-chip circuits. In this paper, the fabrication of a single-crystalline capacitive lateral accelerometer using the SIMPLE (SIlicon Micromachining by single step PLasma Etching) technique is described. This technique uses .a CI,-based plasma chemistry which etches por lightly n-doped silicon anisotropically but heavily n-doped silicon isotropically [5] . In such a way free-standing single crystalline silicon microstructures can be patterned and released from the substrate in a single step plasma etching. It will be demonstrated that the technique is compatible with the fabrication of on-chip electronic circuits.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127530119","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"High-voltage photovoltaic micro-devices fabricated by a new laser-processing","authors":"T. Sakakibara, H. Izu, T. Kura, W. Shinohara, H. Iwata, S. Kiyama, S. Tsuda","doi":"10.1109/MEMSYS.1995.472533","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472533","url":null,"abstract":"Photovoltaic micro-devices that can generate more than 200 volts with an area of 1 cm2 have been developed to directly drive microactuators like such as piezoelectric or electrostatic actuators. The microdevices consist of 285 micro cells (unit cell size : about 0.5 mm X2.0 mm) interconnected threedimensionally. They generate an open circuit voltage (VJ of 207 volts, short circuit current (Is,) of 36.6,~ A, maximum output power (F\",,) of 4.65mW and fill factor (F.F.) of 0.615 under AM (Air Mass) 1.5 and 100mW/cmz illumination. Each micro cell has an a-Si triple stack structure and generates a V,, of 2.3 volts and a short circuit current density (J,J of 6.5 mA/cm2. The series connection used for the micro cells is precisely processed by a focused lascr beam, thereby significantly reducing the area needed for connection on the devices. To evaluate the potential of the devices to be used as a microactuator's power source, it was necessary to investigate whether a piezoelectric polymer could be directly driven by their electrical output. This capability was confirmed.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116775830","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"An electrochemical micro actuator","authors":"M. Hamberg, C. Neagu, J. Gardeniers, D. J. Ijntema, M. Elwenspoek","doi":"10.1109/MEMSYS.1995.472545","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472545","url":null,"abstract":"In this paper an investigation of the feasibility of a new electrochemical micro actuator is presented. The actuator is fabricated using silicon micro-machining techniques. A gas pressure is generated by electrolysis of an aqueous electrolyte solution. The build up pressure is used to change the deflection of a membrane. The actuator has three states: the electrolysis state, in which the pressure is built up; the passive state, in which the circuit is open and the pressure is maintained; and the pressure reduction state, in which the electrodes are short-circuited in order to reduce the pressure. The advantage of this type of actuation is a low energy consumption. The power is required during pressure build up and to change the states.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130173064","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Piezoelectric lead-zirconate-titanate actuator films for microelectromechanical systems applications","authors":"M. Mescher, T. Abe, B. Brunett, H. Metla, T. E. Schlesinger, M. L. Reed","doi":"10.1109/MEMSYS.1995.472537","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472537","url":null,"abstract":"Piezoelectric actuators are particularly advantageous for MEMS because of their high stored energy density compared to electrostatic and thermal actuators. Lead-zirconate-titanate PbZr,Til -,03 (PZT) films would be very useful as microactuators due to their superior piezoelectric properties. We have previously reported stoichiometric, perovskite-structured thin films of PZT, suitable for microactuator applications, fabricated with composite target magnetron sputtering. These films are under investigation for several applications, including a natural gas flowmeter, and wavelength tunable electro-optic devices. In this work, we describe two experimental results regarding the processing of these films: (1) a decrease in anneal time from 18 hours to 5 s using rapid thermal annealing, and (2) sputter deposition of piezoelectric films of PZT on GaAs substrates.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"1998 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128245931","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Tunable IR filters using flexible metallic microstructures","authors":"T. Ohnstein, J. Zook, James A. Cox, B. Speldrich, T. Wagener, H. Guckel, T. Christenson, E. T. Klein, I. Glasgow","doi":"10.1109/MEMSYS.1995.472585","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472585","url":null,"abstract":"Revolutionary advances in infrared (IR) imaging and sensing technology would be possible if focal plane tunable filters with high transmission, wide acceptance angles, and wide tunability were available. Tunable high-pass transmission filters are ideally suited for enhancing the capability of optical detectors and imaging systems. Most optical detectors have a characteristic low-energy cutoff, set by the energy bandgap or photoemission threshold of the detector material. A tunable high-pass frequency filter would allow variation of the long-wavelength cutoff over the useful wavelength range of the detector material. The decrease in detector output as the filter cutoff wavelength is decreased would provide direct measurement of the spectral content of the radiation causing the detector response. Thus, conventional broadband detectors and imagers could be programmed to give spectral information as well as total intensity information.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123967366","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Linear microvibromotor for positioning optical components","authors":"M. Daneman, Norman C. Tien, Olav Solgaard, A. Pisano, Kam Y. Lau, Richard S. Muller","doi":"10.1109/MEMSYS.1995.472554","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472554","url":null,"abstract":"We report an electrostatically driven linear microvibromotor fabricated using surface-micromachining technology. This device is developed for use in actuated micro-optical systems on silicon. Its submicron positioning resolution and a travel range of over 350 /spl mu/m are excellent properties for this application. Vibromotor precision and velocity are characterized, and various drive methods are discussed. A simulation of the vibromotor dynamics is presented to explore optimization and control issues for this device.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134136986","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Active catheter with multi-link structure based on silicon micromachining","authors":"G. Lim, K. Minami, M. Sugihara, M. Uchiyama, M. Esashi","doi":"10.1109/MEMSYS.1995.472543","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472543","url":null,"abstract":"Wc dcvclopcd a new prototype active catheter with multi-link structure based on silicon micromachining. Many links are connected with joints made of Shape Memory Alloy (SMA) actuators. The active catheter can be used for medical purposes as an interventional therapy. As this has multi-link structure, it can bend actively on demand and conform to the shape of narrow blood vessels. The outer diameter of the fabricated active cathctcr is 2.8\". Micro coil of SMA is used as the actuator for the joint. Two heating methods, direct heating and indirect heating of SMA was examined. Indirect heating by surrounding nickel thin film heater is compatible with built-in circuit for driving the SMA actuator. We used silicon batch process for the fabrication of the link to minimize assembly work. UV (Ultra Violet) curing resin was used to fix the actuator and to make electrical contact. Bending motions, bending angle, force, and frequency response of the active catheter were measured.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115873165","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Steering mechanism and swimming experiment of micro mobile robot in water","authors":"T. Fukuda, A. Kawamoto, F. Arai, H. Matsuura","doi":"10.1109/MEMSYS.1995.472605","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472605","url":null,"abstract":"Recently many micro robots have been proposed for various purposes due to the advances of the precise process technology, and further progress in t h s field is expected.'11[21 One of the features that a micro robot has is a good possible advantage to work in a very small space. For instance in terms of medical technology a common application is to perform a delicate surgical operation supported by using micro machines thus avoiding unnecessary incisions. For an industrial application the use of micro robots is also proposed to maintain factory pipelines. As well as the medical case, the use of micro robots can help to avoid dismantling and reassembling. Micro robots can restrict their work to affected part or the breakdown spot and do not give unnecessary influence on their surroundings. Mother machine is the kind of robot that transports such micro robots and micro modules for accurate local work and operation in a very small Following the concept, we have aimed to develop a micro mobile robot. \"A Study on In-Pipe Inspection Robot\", a former research report is an advancement in this field.['] However this robot has two problems yet to be solved. 1) The robot may scratch the inside of the pipes because the propulsion mechanism involves physical contact with the inside of the pipes to move forward. 2) It is dependent on the condition of the inside surface of the pipes if the robot can move or not. As usual pipes are filled with some fluid. Fluid gives an even environment irrespective of the shape or the condition of pipes. Therefore, adopting the principle of movement which utilizes the fluid force, the robot can maneuver as far as the space is filled with some viscous fluid.Ls1 \"Mechanism and Swimming Experiment of Micro Mobile Robot in Water,[6\" our recent research report describes such a robot. The robot devised in the former research uses fins for propulsion.[61 The mechanism and principle proved effective both theoretically and experimentally. In addition, we examined the downsizing considering the Reynolds number, and we obtained the result that the robot could be minimized down to a few millimeter. The robot, however, has only 1 degree of freedom(D. 0. F.) in its propulsion. Therefore, the robot can not make proper motion when it meets obstacles or it comes to a junction. In t h s paper, we propose a prototype micro mobile robot with a new steering mechanism, which has 2 D. 0. F.. As well as the former 1 D. 0. F. robot, it is important that the simpler the mechanism and structure and the fewer the actuators, the better in terms of minimizing the robot in the future.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130501627","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}