1991, Proceedings. International Test Conference最新文献_第5页

Built-in self-test of the VLSI content addressable filestore VLSI内容可寻址文件存储的内置自检

1991, Proceedings. International Test Conference Pub Date : 1991-10-26 DOI: 10.1109/TEST.1991.519492

R. Illman, Terry Bird, G. Catlow, S. Clarke, Len Theobald, G. Willetts

引用次数: 9

A WORKSTATION ENVIRONMENT FOR BOUNDARY SCAN INTERCONNECT TESTING 用于边界扫描互连测试的工作站环境

1991, Proceedings. International Test Conference Pub Date : 1991-10-26 DOI: 10.1109/TEST.1991.519779

T. Moore

引用次数: 1

AN INTELLIGENT APPROACH TO AUTOMATIC TEST EQUIPMENT 一种智能化的自动测试设备

1991, Proceedings. International Test Conference Pub Date : 1991-10-26 DOI: 10.1109/TEST.1991.519702

W. Simpson, J. Sheppard

引用次数: 6

IS BURN-IN BURNED OUT? 倦怠倦怠已经耗尽了吗?

1991, Proceedings. International Test Conference Pub Date : 1991-10-26 DOI: 10.1109/TEST.1991.519790

Charles C. Packard

引用次数: 1

DSP CALIBRATION FOR ACCURATE TIME WAVEFORM RECONSTRUCTION DSP校准精确的时间波形重建

1991, Proceedings. International Test Conference Pub Date : 1991-10-26 DOI: 10.1109/TEST.1991.519765

Eric Rosenfeld, Bradford Sumner

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引用次数: 3

Formalizing Signature Analysis for Control Flow Checking of Pipelined RISC Microprocessors 面向流水线RISC微处理器控制流检测的形式化特征分析

1991, Proceedings. International Test Conference Pub Date : 1991-10-26 DOI: 10.1109/TEST.1991.519759

X. Delord, G. Saucier

引用次数: 20

TESTABILITY FEATURES OF THE 68HC16Z1 68hc16z1的可测试性特点

1991, Proceedings. International Test Conference Pub Date : 1991-10-26 DOI: 10.1109/TEST.1991.519502

J. Lyon, Michael E. Gladden, E. Hartung, Eric Hoang, K. Raghunathan

引用次数: 2

Languages to Support Boundary-Scan Test 支持边界扫描测试的语言

1991, Proceedings. International Test Conference Pub Date : 1991-10-26 DOI: 10.1109/TEST.1991.519780

C. Maunder

{"title":"Languages to Support Boundary-Scan Test","authors":"C. Maunder","doi":"10.1109/TEST.1991.519780","DOIUrl":"https://doi.org/10.1109/TEST.1991.519780","url":null,"abstract":"ion From Detail Traditionally, test data interchange has occurred at a very low level -involving detailed binary data and signal timings. Where boundary-scan is extensively used, interchange can occur at an abstracted level -provided that the target test system can comprehend the transmitted data. For example, where all testing is to be achieved through the 1149.1 interface, interchange may be at the level of instructions and associated data values, with the method of application being implied from a statement that the circuit complies with the standard. A key advantage of boundary-scan-based testing is that test data can be used both in the factory and later in life -for example, during field fault diagnosis or in depot repair. Whereas a test system designed for use in a factory environment may offer high-throughput, support for fault diagnosis, and other 'top-end features, testers intended for field use may be based on off-the-shelf notebook PCs, possibly with plug-in modules that support boundary-scan test access. This latter type of 'tester' may be limited to low-throughput go-nogo testing. The objective for future test data interchange standards should be to allow the same basic test programme to be used both in the factory and in the field To use an analogy with microprocessor software, test data interchange is moving from 'microcode' to 'assembler'.","PeriodicalId":272630,"journal":{"name":"1991, Proceedings. International Test Conference","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130947704","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Built-in self-test for high-speed data-path circuitry 内置自检高速数据路径电路

1991, Proceedings. International Test Conference Pub Date : 1991-10-26 DOI: 10.1109/TEST.1991.519493

C. Stroud

引用次数: 12

On Optimizing Wafer-Probe Testing for Product Quality Using Die-Yield Prediction 利用模具良率预测优化晶圆探头测试产品质量

1991, Proceedings. International Test Conference Pub Date : 1991-10-26 DOI: 10.1109/TEST.1991.519514

A. Singh, C. M. Krishna

引用次数: 13