On Optimizing Wafer-Probe Testing for Product Quality Using Die-Yield Prediction

We propose a new adaptive testing procedure that uses spatial defect clustering information to optimize test lengths during wafer-probe testing. For the same average test lengths, our approach shows better than a factor-of-two improvement in average defect levels. It further allows the separation of high-quality dies with defect levels more than an order of magnitude better than the average for the production run. Our proposal is orthogonal to all other approaches for improving defect quality and can be combined with them.