Soaram Kim, Sean Gorman, Yongchang Dong, A. Rao, G. Koley
{"title":"Self-powered Flexible Strain Sensor with Graphene/P(VDF-TrFE) Heterojunction","authors":"Soaram Kim, Sean Gorman, Yongchang Dong, A. Rao, G. Koley","doi":"10.1109/DRC.2018.8442195","DOIUrl":"https://doi.org/10.1109/DRC.2018.8442195","url":null,"abstract":"The world of wearable technology is making use of strain sensors in human monitoring, and the use of data can range from improving the lifestyle to improving safety in the workplace, i.e. smart monitoring systems, wearable biomedical health care, and real-time gait analysis [1]–[3]. Long-term stability, fast response time, self-powered operation, low cost and simplicity of the fabrication process are the preferred attributes in piezoresistive based strain sensors. In this work, we have simply fabricated a self-powered flexible strain sensor with graphene/P(VDF - TrFE) heterojunction on polyethylene terephthalate (PET) substrate. The graphene/P(VDF - TrFE) heterojunction makes the sensor a good candidate for a piezoresistive based strain sensor due to the unique properties of graphene such as high carrier mobility, mechanical strength flexibility, and tunable Fermi level based on surface charge.","PeriodicalId":269641,"journal":{"name":"2018 76th Device Research Conference (DRC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127760740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Deshmukh, M. Muñoz-Rojo, E. Yalon, S. Vaziri, E. Pop
{"title":"Probing Self-Heating in RRAM Devices by Sub-100 nm Spatially Resolved Thermometry","authors":"S. Deshmukh, M. Muñoz-Rojo, E. Yalon, S. Vaziri, E. Pop","doi":"10.1109/DRC.2018.8442187","DOIUrl":"https://doi.org/10.1109/DRC.2018.8442187","url":null,"abstract":"Resistive memory (RRAM) is a promising technology for high density, non-volatile data storage. Metal-oxide RRAM involves forming and breaking conductive filaments (CF) in an oxide like Hf02 as the mechanism of data storage. CFs are sub-50 nm in diameter [1], causing sharp temperature gradients within the RRAM oxide. However, imaging individual CFs in RRAM devices is challenging due to their nanoscale size and the presence of the top electrode (TE). While previous works have performed electrical [2] or optical averaging [3] of CF temperature, evaluating the heating of a single CF within RRAM has remained an open problem.","PeriodicalId":269641,"journal":{"name":"2018 76th Device Research Conference (DRC)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127762933","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Time Response of Polarization Switching in Ge Hafnium Zirconium Oxide Nanowire Ferroelectric Field-effect Transistors","authors":"Sami Alghamdi, W. Chung, M. Si, P. Ye","doi":"10.1109/DRC.2018.8442218","DOIUrl":"https://doi.org/10.1109/DRC.2018.8442218","url":null,"abstract":"Negative-capacitance field-effect transistors (NC-FETs) or ferroelectric field-effect transistors (Fe-FETs), realized by replacing high-k dielectric in metal-oxide-semiconductor field-effect transistors (MOSFETs) with a ferroelectric insulator, have been extensively studied recently for potential digital logic or non-volatile memory applications. Steep-slope NC-FETs have attracted a lot of attention to break the Boltzmann limit of subthreshold swing (SS) in a MOSFET. Hysteresis-free sub-60 mV/dec NC-FETs at room temperature have been demonstrated very recently by static DC measurements1-3. However, one of the major concerns in NC-FETs is its operating speed, which might be limited by the slow polarization reversal in ferroelectric films due to heavy atom re-positioning4,5. A Fe-FET is a proper structure to study the ferroelectric switching speed due to the very pronounced counterclockwise hysteresis loop in its transfer curve, and it is used as a detector to measure the switch speed of the ferroelectric gate.","PeriodicalId":269641,"journal":{"name":"2018 76th Device Research Conference (DRC)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132338944","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Higashiwaki, M. Wong, T. Kamimura, Y. Nakata, Chia-Hung Lin, R. Lingaparthi, A. Takeyama, T. Makino, T. Ohshima, N. Hatta, K. Yagi, K. Goto, K. Sasaki, Shinya Watanabe, A. Kuramata, S. Yamakoshi, K. Konishi, H. Murakami, Y. Kumagai
{"title":"Recent Advances in Ga2O3 MOSFET Technologies","authors":"M. Higashiwaki, M. Wong, T. Kamimura, Y. Nakata, Chia-Hung Lin, R. Lingaparthi, A. Takeyama, T. Makino, T. Ohshima, N. Hatta, K. Yagi, K. Goto, K. Sasaki, Shinya Watanabe, A. Kuramata, S. Yamakoshi, K. Konishi, H. Murakami, Y. Kumagai","doi":"10.1109/DRC.2018.8442156","DOIUrl":"https://doi.org/10.1109/DRC.2018.8442156","url":null,"abstract":"Historically, the exploration of III-V compound semiconductors has begun with small bandgap materials and proceeded to large bandgap ones in recent years, that is, from GaAs-based compounds to GaN-based ones. We consider that gallium oxide (Ga2O3) is no exception in following this history and is poised to become the next mainstream of compound semiconductor research due to its attractive material properties based on an extremely large bandgap of about 4.5 eV [1]. This bandgap energy is not only much larger than those of representative wide bandgap semiconductors such as GaN and SiC but also unique among single-crystal semiconductors. Furthermore, Ga2O3 has another important advantage for commercialization over the other wide bandgap materials in that large-size, high-quality bulk single crystals can be synthesized by melt growth methods, thus allowing native substrates to be produced at a relatively low cost [2]. Recently, these two features have drawn much attention to Ga2O3, resulting in a rapid expansion of the Ga2O3 community.","PeriodicalId":269641,"journal":{"name":"2018 76th Device Research Conference (DRC)","volume":"162 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134131276","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"CMOS Technology with Integrated Carbon-Nanotube Contact Plugs","authors":"C. Prawoto, Suwen Li, M. Chan","doi":"10.1109/DRC.2018.8442155","DOIUrl":"https://doi.org/10.1109/DRC.2018.8442155","url":null,"abstract":"Although CMOS compatible CNT process in interconnect technology has been proposed [1], integration to a working active device has yet to be demonstrated. CNT synthesis in existing works employ the use of Ti-based substrate using Ni catalyst [2]. Nevertheless, the use of CNTs as MOSFET contact plugs in advanced technology node require the synthesis of CNTs on nickel silicided (NiSi) source and drain region [3]. Thus, in this paper, a CMOS compatible integration process of CNT contact plug to a MOSFET is proposed. The challenge of growing CNT from NiSi substrate is addressed using interfacial layer using Ni based catalyst. The performance of CNT vias integrated with a MOSFET is evaluated in terms of via resistance and IV characteristics.","PeriodicalId":269641,"journal":{"name":"2018 76th Device Research Conference (DRC)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121154105","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
H. Xue, T. Razzak, Seongmo Hwang, A. Coleman, S. Bajaj, Yuewei Zhang, Zane Jamal-Eddin, S. H. Sohel, Asif Khan, S. Rajan, W. Lu
{"title":"All MOCVD grown 250 nm gate length Al0.70Ga0.30N MESFETs","authors":"H. Xue, T. Razzak, Seongmo Hwang, A. Coleman, S. Bajaj, Yuewei Zhang, Zane Jamal-Eddin, S. H. Sohel, Asif Khan, S. Rajan, W. Lu","doi":"10.1109/DRC.2018.8442167","DOIUrl":"https://doi.org/10.1109/DRC.2018.8442167","url":null,"abstract":"High Al-composition AlGaN materials, by virtue of their ultra-wide band gap, are promising candidates for realizing high power density mm-wave transistors. However, low electron affinity in these materials make it very difficult to make ohmic contacts for Al-composition above 65%. On the other hand, to achieve high cutoff frequency, it is critical to scale the transistors. In this work, we report the first ever DC and small-signal RF performance of a scaled MOCVD-grown $mathrm{UWBG} mathrm{A}10. 70mathrm{Ga}0.30mathrm{N}$ MESFET with $mathrm{L}_{mathrm{G}} =250 mathrm{nm}$.","PeriodicalId":269641,"journal":{"name":"2018 76th Device Research Conference (DRC)","volume":"508 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116331097","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The Impact of Substrates on the Performance of Top-Gate p-Ga203 Field-Effect Transistors: Record High Drain Current of 980 mA/mm on Diamond","authors":"J. Noh, M. Si, Hong Zhou, M. Tadjer, P. Ye","doi":"10.1109/DRC.2018.8442276","DOIUrl":"https://doi.org/10.1109/DRC.2018.8442276","url":null,"abstract":"For high power devices, monolithic $beta$ -Ga203 has been identified as an emerging ultra-wide bandgap semiconductor material because it has a large bandgap of 4.8 eV and a high breakdown electric field of 8 MV/cm [1]. $beta$ -Ga203 has also the potential to realize low-cost large-size native bulk substrates by melt-grown methods [2], [3]. However, the output power density and the maximum drain current density of $beta$ -Ga203 devices can be seriously limited due to its low thermal conductivity $(kappa$ of 10–25 W/m·K and self-heating effect (SHE) [4], [5]. If the heat from the channel cannot be well dissipated through the substrate, SHE can lead to significant channel temperature increase, thus degrade the device performance and the long-term reliability [6]. In order to overcome this material constraint, we explored nano-membrane transferring technique and studied $beta$ -Ga203 nano-membrane field-effect transistors (FETs) on different foreign substrates such as sapphire $(kappa=40 mathrm{W}/mathrm{m}cdot mathrm{K})$ and Si02/Si $(kappa=1.5 mathrm{W}/mathrm{m}cdot text{K for} 270 text{nm SiO}_{2})$ and compared the impact of these substrates on the device performance [7]–[9]. In this work, furthermore, we demonstrate the first B-Ga203 Fet on a diamond substrate with an extremely high thermal conductivity of $1,000sim 2,200 mathrm{W}/mathrm{m}cdot mathrm{K}$ [10] and compare with devices on a sapphire or Si02/Si substrate.","PeriodicalId":269641,"journal":{"name":"2018 76th Device Research Conference (DRC)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130827143","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
K. Mehta, Yuh-Shiuan Liu, Jialin Wang, Hoon Jeong, T. Detchprohm, Young Jae Park, S. Shen, R. Dupuis, P. Yoder
{"title":"Theory and Design of Electron Blocking Layers for III-N Based Laser Diodes by Numerical Simulation","authors":"K. Mehta, Yuh-Shiuan Liu, Jialin Wang, Hoon Jeong, T. Detchprohm, Young Jae Park, S. Shen, R. Dupuis, P. Yoder","doi":"10.1109/DRC.2018.8442243","DOIUrl":"https://doi.org/10.1109/DRC.2018.8442243","url":null,"abstract":"Unlike laser diodes made of traditional III-V materials (III-AsP), III-Nitride laser diodes and LEDs suffer from reduced injection efficiency due to greater electron leakage [1]. The overflow of electrons out of the active region into the adjacent p-type quasi-neutral region (QNR) is primarily due to the asymmetry between majority carrier conductivities in p- and n-GaN [2], where the electron conductivity in n-GaN is more than 40 times greater than the hole conductivity in p-GaN [3], [4]. Furthermore, carrier leakage is exacerbated by interfacial spontaneous and piezoelectric polarization charges at III-N heterojunctions. To stem electron leakage, an electron blocking layer (EBL) is typically employed between the last quantum barrier (QB) and p-type quasi-neutral region (QNR), and this EBL is typically a thin layer of wide bandgap material.","PeriodicalId":269641,"journal":{"name":"2018 76th Device Research Conference (DRC)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117064801","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}