Theory and Design of Electron Blocking Layers for III-N Based Laser Diodes by Numerical Simulation

K. Mehta, Yuh-Shiuan Liu, Jialin Wang, Hoon Jeong, T. Detchprohm, Young Jae Park, S. Shen, R. Dupuis, P. Yoder
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引用次数: 10

Abstract

Unlike laser diodes made of traditional III-V materials (III-AsP), III-Nitride laser diodes and LEDs suffer from reduced injection efficiency due to greater electron leakage [1]. The overflow of electrons out of the active region into the adjacent p-type quasi-neutral region (QNR) is primarily due to the asymmetry between majority carrier conductivities in p- and n-GaN [2], where the electron conductivity in n-GaN is more than 40 times greater than the hole conductivity in p-GaN [3], [4]. Furthermore, carrier leakage is exacerbated by interfacial spontaneous and piezoelectric polarization charges at III-N heterojunctions. To stem electron leakage, an electron blocking layer (EBL) is typically employed between the last quantum barrier (QB) and p-type quasi-neutral region (QNR), and this EBL is typically a thin layer of wide bandgap material.
基于数值模拟的III-N基激光二极管电子阻挡层理论与设计
与传统III-V材料(III-AsP)制造的激光二极管不同,iii -氮化物激光二极管和led由于电子泄漏较大,导致注入效率降低[1]。电子从有源区溢出到邻近的p型准中性区(QNR)主要是由于p- gan和n-GaN中的多数载流子电导率不对称[2],其中n-GaN中的电子电导率比p- gan中的空穴电导率高40多倍[3],[4]。此外,在III-N异质结处,界面自发电荷和压电极化电荷加剧了载流子泄漏。为了防止电子泄漏,通常在最后一个量子势垒(QB)和p型准中性区(QNR)之间使用电子阻挡层(EBL),该EBL通常是一层薄的宽带隙材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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