Probing Self-Heating in RRAM Devices by Sub-100 nm Spatially Resolved Thermometry

S. Deshmukh, M. Muñoz-Rojo, E. Yalon, S. Vaziri, E. Pop
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引用次数: 6

Abstract

Resistive memory (RRAM) is a promising technology for high density, non-volatile data storage. Metal-oxide RRAM involves forming and breaking conductive filaments (CF) in an oxide like Hf02 as the mechanism of data storage. CFs are sub-50 nm in diameter [1], causing sharp temperature gradients within the RRAM oxide. However, imaging individual CFs in RRAM devices is challenging due to their nanoscale size and the presence of the top electrode (TE). While previous works have performed electrical [2] or optical averaging [3] of CF temperature, evaluating the heating of a single CF within RRAM has remained an open problem.
亚100nm空间分辨测温法探测RRAM器件的自热
电阻式存储器(RRAM)是一种很有前途的高密度、非易失性数据存储技术。金属氧化物RRAM涉及在像Hf02这样的氧化物中形成和破坏导电丝(CF)作为数据存储机制。CFs的直径在50nm以下[1],在RRAM氧化物中引起尖锐的温度梯度。然而,由于其纳米级尺寸和顶部电极(TE)的存在,在RRAM器件中对单个cf进行成像具有挑战性。虽然以前的工作已经对CF温度进行了电[2]或光学平均[3],但评估RRAM内单个CF的加热仍然是一个悬而未决的问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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