Recent Advances in Ga2O3 MOSFET Technologies

M. Higashiwaki, M. Wong, T. Kamimura, Y. Nakata, Chia-Hung Lin, R. Lingaparthi, A. Takeyama, T. Makino, T. Ohshima, N. Hatta, K. Yagi, K. Goto, K. Sasaki, Shinya Watanabe, A. Kuramata, S. Yamakoshi, K. Konishi, H. Murakami, Y. Kumagai
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引用次数: 1

Abstract

Historically, the exploration of III-V compound semiconductors has begun with small bandgap materials and proceeded to large bandgap ones in recent years, that is, from GaAs-based compounds to GaN-based ones. We consider that gallium oxide (Ga2O3) is no exception in following this history and is poised to become the next mainstream of compound semiconductor research due to its attractive material properties based on an extremely large bandgap of about 4.5 eV [1]. This bandgap energy is not only much larger than those of representative wide bandgap semiconductors such as GaN and SiC but also unique among single-crystal semiconductors. Furthermore, Ga2O3 has another important advantage for commercialization over the other wide bandgap materials in that large-size, high-quality bulk single crystals can be synthesized by melt growth methods, thus allowing native substrates to be produced at a relatively low cost [2]. Recently, these two features have drawn much attention to Ga2O3, resulting in a rapid expansion of the Ga2O3 community.
Ga2O3 MOSFET技术的最新进展
从历史上看,III-V化合物半导体的探索是从小带隙材料开始的,近年来又向大带隙材料发展,即从gaas基化合物到gan基化合物。我们认为氧化镓(Ga2O3)也不例外地遵循了这一历史,并且由于其基于约4.5 eV的极大带隙的有吸引力的材料特性,它有望成为化合物半导体研究的下一个主流[1]。这种带隙能量不仅比典型的GaN和SiC等宽带隙半导体大得多,而且在单晶半导体中也是独一无二的。此外,与其他宽禁带材料相比,Ga2O3在商业化方面还有另一个重要优势,即可以通过熔体生长方法合成大尺寸、高质量的块状单晶,从而可以以相对较低的成本生产原生衬底[2]。最近,这两个特性引起了人们对Ga2O3的关注,导致Ga2O3社区迅速扩大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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