2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)最新文献_第2页

Novel Control Flow Checking Implementations for Automotive Software 汽车软件控制流检测的新方法

2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Pub Date : 2023-07-03 DOI: 10.1109/SMACD58065.2023.10192166

Francesco Cosimi, J. Sini, Antonio Arena, M. Violante

{"title":"Novel Control Flow Checking Implementations for Automotive Software","authors":"Francesco Cosimi, J. Sini, Antonio Arena, M. Violante","doi":"10.1109/SMACD58065.2023.10192166","DOIUrl":"https://doi.org/10.1109/SMACD58065.2023.10192166","url":null,"abstract":"Safety-critical applications shall be implemented on highly dependable systems, and a part of their reliability is based on checking if the software is executed correctly. Various techniques are available for this purpose, like Control Flow Checking (CFC). Many CFC algorithms can be found in the literature, but their detection performances are assessed in theoretical scenarios, when implemented in Assembly language. The international standard on functional safety for automotive applications is ISO26262. It mandates to develop using high-level programming languages and the computation of the Diagnostic Coverage (DC). The DC measures the effectiveness of the chosen hardening method, in order to detect various Failure Modes (FMs). This paper discusses two alternative solutions, one software-only, and the other involving customized hardware, for these concerns: (i) address the FMs affecting the computation units described by Table 30 of part 11 of the ISO26262 (ii) guarantee the Freedom From Interference between the hardening method and the monitored entity.","PeriodicalId":239306,"journal":{"name":"2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130445927","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Power Losses Analysis of SiC MOSFETs in DC-DC Converters with High-Ripple-Current Inductors 高纹波电流电感DC-DC变换器中SiC mosfet的功率损耗分析

2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Pub Date : 2023-07-03 DOI: 10.1109/SMACD58065.2023.10192180

N. Femia, Hamidreza Jafarian, G. D. Capua

引用次数: 0

Single-Inductor Dual-Output DC-DC Converter with Multiple Flying Capacitors 带有多个飞行电容的单电感双输出DC-DC变换器

2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Pub Date : 2023-07-03 DOI: 10.1109/SMACD58065.2023.10192121

Hale Yilmaz, Kemal Ozanoglu, Pier Cavallini, M. Yazgi

引用次数: 0

Framework to Simulate and Analyse the Electromagnetic Emission of Integrated Circuits under Electromagnetic Interference 电磁干扰下集成电路电磁发射仿真分析框架

2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Pub Date : 2023-07-03 DOI: 10.1109/SMACD58065.2023.10192236

Dominik Zupan, Daniel Kircher, N. Czepl, B. Deutschmann

{"title":"Framework to Simulate and Analyse the Electromagnetic Emission of Integrated Circuits under Electromagnetic Interference","authors":"Dominik Zupan, Daniel Kircher, N. Czepl, B. Deutschmann","doi":"10.1109/SMACD58065.2023.10192236","DOIUrl":"https://doi.org/10.1109/SMACD58065.2023.10192236","url":null,"abstract":"Ensuring the safe operation of electronic systems requires them to comply with electromagnetic compatibility (EMC) regulations. We can achieve this by conducting various EMC tests, including checking electromagnetic emission limits and immunity to interference signals, both on integrated circuit (IC) and on system level. However, these tests are typically performed separately, without considering the potential impact of one test on another. In this paper we present a framework to address this issue by simulation and subsequent post-processing. We focus on the impact of radio frequency (RF) disturbances on the electromagnetic emission of an IC, and propose a framework based on LTspice and Python, that implements the direct power injection (DPI) characterisation method and the 150 Ohm method. Within this paper we demonstrate the usability of this framework and how the resulting plot can support circuit designers in developing EMC compliant circuits. To do so, we utilise a test circuit, where the electromagnetic emission is significantly altered by an RF disturbance.","PeriodicalId":239306,"journal":{"name":"2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124931317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Long-Term Aging Impacts on Spatial On-Chip Power Density and Temperature 长期老化对空间片上功率密度和温度的影响

2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Pub Date : 2023-07-03 DOI: 10.1109/SMACD58065.2023.10192234

Sachin Sachdeva, Jinwei Zhang, H. Amrouch, S. Tan

{"title":"Long-Term Aging Impacts on Spatial On-Chip Power Density and Temperature","authors":"Sachin Sachdeva, Jinwei Zhang, H. Amrouch, S. Tan","doi":"10.1109/SMACD58065.2023.10192234","DOIUrl":"https://doi.org/10.1109/SMACD58065.2023.10192234","url":null,"abstract":"Long-term reliability, such as bias temperature instability (BTI) and hot-carrier injection (HCI), electromigration, etc., significantly impact the chip’s performance and lifetime. The existing approaches mainly focus on performance, such as delay and timing impacts, or only consider the BTI impacts on threshold voltage (VT ). However, the impact of BTI on power, specifically on the spatial power density and resulting thermal profile of a functional unit design, has not been thoroughly investigated. In this study, we evaluate the impact of BTI on both the spatial power density and temperature profiles of VLSI chips by considering its effects on multiple parameters of CMOS devices. Our findings show that BTI aging can lead to significant benefits in terms of on-chip temperature and the reduction of hot spots, especially at high operating temperatures, due to the decrease in power density. In this study, we focus on the impact of BTI aging on widely used circuits, such as dot product and dual-port synchronous RAM using a 45nm technology node. To account for the worst-case impact of BTI degradation, we utilized degradation-aware cell libraries that incorporate the maximum ΔVT of 63mV, i.e., is equivalent to 10 years of operation at Vdd=1.2V and T=130 °C. Our results indicate that after 10 years of operation, there is a significant impact on maximum power density for both the dot product and RAM circuits, with a reduction of around 5% and 7%, respectively. Similarly, there are noticeable maximum temperature changes, with a decrease of about 10% for the dot product and 6% for the RAM circuits.","PeriodicalId":239306,"journal":{"name":"2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125060446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Modeling the Avalanche Breakdown of the FMMT417 NPN BJT in the TINA Environment TINA环境下FMMT417 NPN BJT雪崩击穿建模

2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Pub Date : 2023-07-03 DOI: 10.1109/SMACD58065.2023.10192129

Mert Yetkin, M. B. Yelten

引用次数: 0

Strategies for parameter extraction of the time constant distribution of time-dependent variability models for nanometer-scale devices 纳米器件时变率模型时间常数分布参数提取策略

2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Pub Date : 2023-07-03 DOI: 10.1109/SMACD58065.2023.10192206

F. Fernández, E. Roca, P. Saraza-Canflanca, J. Martín-Martínez, R. Rodríguez, M. Nafría, R. Castro-López

引用次数: 0

Time based architecture for high-side current sensor with integrated shunt resistor 集成分流电阻的高侧电流传感器基于时间的结构

2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Pub Date : 2023-07-03 DOI: 10.1109/SMACD58065.2023.10192119

Francesco Borgioli, Roberto Pio Baorda, Paolo Angelini

引用次数: 0

Exploitation of Subharmonic Injection Locking for Solving Combinatorial Optimization Problems with Coupled Oscillators using VO2 based devices 利用基于VO2的器件求解耦合振荡器组合优化问题的次谐波注入锁

2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Pub Date : 2023-07-03 DOI: 10.1109/SMACD58065.2023.10192227

J. Núñez, M. Avedillo, M. Jiménèz

引用次数: 0

A Test Module for Aging Characterization of Digital Circuits 数字电路老化特性测试模块

2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Pub Date : 2023-07-03 DOI: 10.1109/SMACD58065.2023.10192112

Jose M. Gata-Romero, A. Santana-Andreo, E. Roca, R. Castro-López, F. Fernández

引用次数: 0