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Electrical Performance of Electronic Packaging最新文献

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A new flip-chip mounting technique for high temperature operation 一种用于高温操作的倒装芯片安装新技术
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634047
A. Basu, T. Itoh
{"title":"A new flip-chip mounting technique for high temperature operation","authors":"A. Basu, T. Itoh","doi":"10.1109/EPEP.1997.634047","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634047","url":null,"abstract":"A new method is described for mounting microwave semiconductor devices on a circuit board in a flip-chip configuration, which overcomes the limitations on the maximum temperature of operation encountered in conventional bonding techniques such as soldering. This method uses electro-deposited copper to form the contacts, and temperature limitation comes only from the device itself.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121209057","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Accurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors 准确地去除测试板对背板连接器高频特性的影响
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634065
S. Sercu, L. Martens
{"title":"Accurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors","authors":"S. Sercu, L. Martens","doi":"10.1109/EPEP.1997.634065","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634065","url":null,"abstract":"This paper investigates the determination of the intrinsic high-frequency characteristics of a multi-pin backplane connector. The intrinsic characteristics are the characteristics (S-parameters) of the connector without the presence of a component board or a backplane on which it must be mounted. The connector model, which is independent of the connector via holes, can be used in system simulations with arbitrary component boards and backplanes.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"86 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125389252","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Simulation and performance of passive microwave and millimeter wave coplanar waveguide circuit devices with flip chip packaging 倒装封装无源微波与毫米波共面波导器件的仿真与性能
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634071
P. Petre, M. Matloubian, R. T. Kihm, S. Gedney
{"title":"Simulation and performance of passive microwave and millimeter wave coplanar waveguide circuit devices with flip chip packaging","authors":"P. Petre, M. Matloubian, R. T. Kihm, S. Gedney","doi":"10.1109/EPEP.1997.634071","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634071","url":null,"abstract":"This paper presents a descriptive study of the design and modeling of grounded coplanar waveguide (GCPW) and finite ground coplanar waveguide (FGCPW) circuits for microwave and millimeter wave applications. It is demonstrated that FGCPWs have a number of advantages over GCPW and microstrip, including that it easily accommodates flip chip packaging. It is also demonstrated that full-wave electromagnetic analysis tools can be used effectively to reduce the design cycle time of practical microwave circuit devices.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"129 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122052035","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Adjacent line coupling for long off chip interconnects 用于长片外互连的相邻线耦合
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634057
H. Harrer, D. Kaller, E. Klink
{"title":"Adjacent line coupling for long off chip interconnects","authors":"H. Harrer, D. Kaller, E. Klink","doi":"10.1109/EPEP.1997.634057","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634057","url":null,"abstract":"The paper describes the coupling effects from adjacent lines for different types of material. The impact of high frequency effects will be shown for long board lines, which reduces the coupling noise. A typical off chip net structure of an S/390 computer system is examined and the attenuation effect is discussed for frequency dependent model parameters of the R, L and G values. Also the importance of the signal to power ratio for via structures and connectors will be demonstrated for several examples. Multiple cycle impacts are shown if reflections of the active signals coincide with the subsequent cycle. Finally, a comparison of the timing impact is given for thinfilm, standard ceramic, glass ceramic and FR4 board lines.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"241 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133550688","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Validity ranges of crosstalk models 相声模型的有效范围
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634054
Weimin Shi, J. Fang
{"title":"Validity ranges of crosstalk models","authors":"Weimin Shi, J. Fang","doi":"10.1109/EPEP.1997.634054","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634054","url":null,"abstract":"Crosstalk models, used for the estimation of near and far end crosstalk voltages between two parallel transmission lines, are evaluated. The quantitative validity ranges, in terms of transmission line length and coupling coefficient, of crosstalk models are presented. It is shown that the accuracy of the commonly used crosstalk models deteriorates as the increase of coupling coefficient and line length. A new crosstalk model with improved accuracy is proposed and evaluated.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125167585","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A new technique for the extraction of SPICE-type equivalent circuits from measured or computed S-parameters of microstrip components and discontinuities 从测量或计算的微带元件和不连续点的s参数中提取spice型等效电路的新技术
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634041
P. Werner, Raj Mittra
{"title":"A new technique for the extraction of SPICE-type equivalent circuits from measured or computed S-parameters of microstrip components and discontinuities","authors":"P. Werner, Raj Mittra","doi":"10.1109/EPEP.1997.634041","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634041","url":null,"abstract":"This paper introduces a new technique based on the application of the Genetic Algorithm (GA) for extracting the equivalent circuits for measured or computed S-parameters that can be inserted into SPICE simulations. The GA is a robust optimization tool that is shown to yield excellent result for the sample test case of a right angle bend in a microstrip line.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125693846","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Packaging and interconnect design and analysis using FDTD 利用FDTD进行封装和互连设计与分析
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634045
M. Piket-May, K. Thomas, R. Gravrok
{"title":"Packaging and interconnect design and analysis using FDTD","authors":"M. Piket-May, K. Thomas, R. Gravrok","doi":"10.1109/EPEP.1997.634045","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634045","url":null,"abstract":"This paper presents information about the development of a versatile FDTD solver and explores design issues relevant to the packaging and interconnect design engineers. The EM analysis development is called \"LC\". It consists of a GUI interface with the ability to auto-mesh a graphically defined user geometry. A number of different excitations are possible, and the outputs can yield not only field data, but also voltages, currents, impedances, inductances, capacitances and fluxes. Further, both time and frequency-domain data are available on output. It also allows for 2-D visual simulations of the full 3-D problem being simulated during time-stepping. This is very useful in identifying problem areas with a particular design. Another very important and relevant feature of the LC tool is an interface to SPICE which will analyze a circuit based on FDTD field values linked to SPICE at each time step. The SPICE interface also generates output voltages and/or currents that modify the FDTD field values which are then used during the next FDTD time-step. Essentially LC is an integrated EM model editor, simulator, and analysis tool. It is composed of 100,000 lines of C and Fortran, uses OSF/Motif, and is portable to all commercial Unix platforms. Its companion batch simulator, FDTD, and plotting program, LCPlot, are also included in the executable distribution.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"556 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123066420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effects of heat spreader on electrical characteristics of tape-BGA packages 散热片对胶带- bga封装电特性的影响
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634060
H. Hasan, A. Cangellaris, R. Kaw, W. Pinello
{"title":"Effects of heat spreader on electrical characteristics of tape-BGA packages","authors":"H. Hasan, A. Cangellaris, R. Kaw, W. Pinello","doi":"10.1109/EPEP.1997.634060","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634060","url":null,"abstract":"Heat spreader is an integral part of a high speed integrated circuit (IC) package. It affects electrical characteristics of interconnects and the radiation behavior of a given package. This paper investigates these effects using several tools developed at the University of Arizona.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116937462","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Ultra low loss millimeter wave MCM interconnects 超低损耗毫米波MCM互连
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634073
A. Pham, J. Laskar, V. Krishnamurthy, H. Cole, T. Sitnik-Nieters
{"title":"Ultra low loss millimeter wave MCM interconnects","authors":"A. Pham, J. Laskar, V. Krishnamurthy, H. Cole, T. Sitnik-Nieters","doi":"10.1109/EPEP.1997.634073","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634073","url":null,"abstract":"We present the design and development of ultra low loss and high density organic interconnect packaging technology at millimeter wave frequencies. Various microstrip passive components have been designed and characterized to demonstrate that the high density organic interconnect approach is suitable for W-band (75 GHz-110 GHz) packaging. The loss of the organic interconnects has been found to be comparable with that of microstrip lines on alumina substrates at W-band frequencies.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114588161","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Simulation vs calculation of crosstalk 相声的仿真与计算
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634055
K. Mcclellan, T. S. Wailes, P. Franzon
{"title":"Simulation vs calculation of crosstalk","authors":"K. Mcclellan, T. S. Wailes, P. Franzon","doi":"10.1109/EPEP.1997.634055","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634055","url":null,"abstract":"A crosstalk model for high speed MCMs that is shown to be accurate is compared to simulating a design. Results are presented that show that even though the model is accurate, accurate results cannot be obtained without accounting for timing.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117257467","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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