Adjacent line coupling for long off chip interconnects

H. Harrer, D. Kaller, E. Klink
{"title":"Adjacent line coupling for long off chip interconnects","authors":"H. Harrer, D. Kaller, E. Klink","doi":"10.1109/EPEP.1997.634057","DOIUrl":null,"url":null,"abstract":"The paper describes the coupling effects from adjacent lines for different types of material. The impact of high frequency effects will be shown for long board lines, which reduces the coupling noise. A typical off chip net structure of an S/390 computer system is examined and the attenuation effect is discussed for frequency dependent model parameters of the R, L and G values. Also the importance of the signal to power ratio for via structures and connectors will be demonstrated for several examples. Multiple cycle impacts are shown if reflections of the active signals coincide with the subsequent cycle. Finally, a comparison of the timing impact is given for thinfilm, standard ceramic, glass ceramic and FR4 board lines.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"241 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634057","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The paper describes the coupling effects from adjacent lines for different types of material. The impact of high frequency effects will be shown for long board lines, which reduces the coupling noise. A typical off chip net structure of an S/390 computer system is examined and the attenuation effect is discussed for frequency dependent model parameters of the R, L and G values. Also the importance of the signal to power ratio for via structures and connectors will be demonstrated for several examples. Multiple cycle impacts are shown if reflections of the active signals coincide with the subsequent cycle. Finally, a comparison of the timing impact is given for thinfilm, standard ceramic, glass ceramic and FR4 board lines.
用于长片外互连的相邻线耦合
本文描述了不同类型材料中相邻线的耦合效应。高频效应的影响将显示在长线路板上,这减少了耦合噪声。研究了一种典型的S/390计算机系统的片外网络结构,讨论了R、L和G值的频率相关模型参数的衰减效应。此外,信号功率比对于通孔结构和连接器的重要性将通过几个例子进行演示。如果主动信号的反射与随后的周期重合,则显示多周期影响。最后,对薄膜、标准陶瓷、玻璃陶瓷和FR4板线的时序影响进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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