{"title":"准确地去除测试板对背板连接器高频特性的影响","authors":"S. Sercu, L. Martens","doi":"10.1109/EPEP.1997.634065","DOIUrl":null,"url":null,"abstract":"This paper investigates the determination of the intrinsic high-frequency characteristics of a multi-pin backplane connector. The intrinsic characteristics are the characteristics (S-parameters) of the connector without the presence of a component board or a backplane on which it must be mounted. The connector model, which is independent of the connector via holes, can be used in system simulations with arbitrary component boards and backplanes.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"86 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Accurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors\",\"authors\":\"S. Sercu, L. Martens\",\"doi\":\"10.1109/EPEP.1997.634065\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper investigates the determination of the intrinsic high-frequency characteristics of a multi-pin backplane connector. The intrinsic characteristics are the characteristics (S-parameters) of the connector without the presence of a component board or a backplane on which it must be mounted. The connector model, which is independent of the connector via holes, can be used in system simulations with arbitrary component boards and backplanes.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"86 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1997.634065\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634065","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Accurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors
This paper investigates the determination of the intrinsic high-frequency characteristics of a multi-pin backplane connector. The intrinsic characteristics are the characteristics (S-parameters) of the connector without the presence of a component board or a backplane on which it must be mounted. The connector model, which is independent of the connector via holes, can be used in system simulations with arbitrary component boards and backplanes.
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