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Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium最新文献

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Development of chip model library for the computer-aided analysis of electronic packages 电子封装计算机辅助分析芯片模型库的开发
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI: 10.1109/IEMT.1993.398172
S.N. Pratapneni, C. Wolff, P. Hsu, J. Rozenblit, J. Prince
{"title":"Development of chip model library for the computer-aided analysis of electronic packages","authors":"S.N. Pratapneni, C. Wolff, P. Hsu, J. Rozenblit, J. Prince","doi":"10.1109/IEMT.1993.398172","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398172","url":null,"abstract":"The development of a chip model library for the complete design and simulation of multichip assemblies is discussed. The simulation of the driver/receiver part of the chips mounted in multichip modules (MCMs) can be done using a variety of models at varying levels of complexity. A hierarchy is used to organize the models for use with an intelligent model selection tool. Model selection is based on the tradeoff between accuracy and speed. The four models considered are device, table-based equation-based and simple RC models. The basic RC model, a physical model, considers transistor on-resistance and load capacitance as a complete representation of the driver circuit. The table lookup approach stores a detailed transfer function of device operation or circuit operation in a table using a device level circuit simulator. Equation-based models simplify the physical device equations based on the switching behavior of a particular circuit. An integral environment with this group of models is developed with an object-oriented approach. Each of the model templates is treated as an object and it can be repeated as required.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124048397","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Yield improvement in SMT production by integrated process monitoring and testing 通过集成工艺监控和测试提高SMT生产良率
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI: 10.1109/IEMT.1993.398198
K. Feldmann, J. Sturm
{"title":"Yield improvement in SMT production by integrated process monitoring and testing","authors":"K. Feldmann, J. Sturm","doi":"10.1109/IEMT.1993.398198","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398198","url":null,"abstract":"Almost 30-50% of fabrication costs in electronics production are caused by testing and repair operations. A strategy for yield improvement requires strong dedication to causal relationships and specification of process and product quality. Critical process parameters and their causal effects on product quality must be analyzed. Once critical process parameters are addressed, control strategies can be developed to assure high first pass yields. An overview of ongoing work that has been performed to establish a surface mount technology (SMT) production line with closed loop quality control via direct process monitoring capabilities and integrated inspection operations is given. For different inspection tasks, 3-D laser and X-ray inspection is applied. Process parameter as well as test and inspection results are gathered online. Thus, interrelationships between process steps beginning from material inspection, solder paste application, components placement, reflow soldering and final inspection can be analyzed.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127073293","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
An integrated database system for effective correlation analysis to improve LSI manufacturing yield 一个集成数据库系统，用于有效的相关分析，以提高LSI制造成品率
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI: 10.1109/IEMT.1993.398217
K. Kubota, T. Okubo, H. Takeuchi
{"title":"An integrated database system for effective correlation analysis to improve LSI manufacturing yield","authors":"K. Kubota, T. Okubo, H. Takeuchi","doi":"10.1109/IEMT.1993.398217","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398217","url":null,"abstract":"An integrated relational database (DB) system consisting of process, PMTEG (Process Monitoring Test Element Group), and LSI testing DBs is implemented on a high speed DB machine for effective correlation analysis. For saving DB machine disk area, only the process data necessary for correlation analyses are temporarily stored in the DB on the DB machine. The body of the process data is stored in a distributed DB on the EWSs used to control the LSI manufacturing line equipment. A correlation analysis program, which has a user-friendly window-type man-machine interface, has been developed for the integrated DB. The program retrieves data at high speed with parallel access to the DB. The total performance of the correlation analyses is improved over ten times compared with the old system that included stand-alone DBs and a PC-based correlation analysis program.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126754379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Wire bonding: Present and future trends 线键合:现在和未来的趋势
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI: 10.1109/IEMT.1993.398223
A. S. Chen, L. Nguyen, T.S. Burke, J. Belani
{"title":"Wire bonding: Present and future trends","authors":"A. S. Chen, L. Nguyen, T.S. Burke, J. Belani","doi":"10.1109/IEMT.1993.398223","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398223","url":null,"abstract":"Gold wire thermosonic bonding remains the primary means of electrically connecting the silicon chip to the outside world. To keep up with the increasing interconnect density required by the ever shrinking die and with the need for package compactness, both wire and wire bonder manufacturers have made many improvements in technology. If the miniaturization trend continues at the current rate, the physical and process limits will ultimately be reached. The other possible technologies such as gold wedge bonding, tape automated bonding (TAB), and flip-chip offer some potential attractive interconnection solutions. These techniques also have their own inherent disadvantages. Until such drawbacks are resolved, the capabilities of thermosonic bonding will continue to be pushed as far as possible.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121712829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Effect of molding compound/polyimide interfacial chemistry on TSOP delamination 模塑复合材料/聚酰亚胺界面化学对TSOP分层的影响
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI: 10.1109/IEMT.1993.398218
D. Hagen, E. Prack, Ziep Tran
{"title":"Effect of molding compound/polyimide interfacial chemistry on TSOP delamination","authors":"D. Hagen, E. Prack, Ziep Tran","doi":"10.1109/IEMT.1993.398218","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398218","url":null,"abstract":"The effect of interfacial chemistry on plastic package delamination is investigated. The effect of cleaning treatments, molding compound types and polyimide die coating types is examined. Delamination is induced by subjecting a TSOP package with a large die to a simulated board mounting process. Stressing consists of moisture saturation at 75% RH at room temperature followed by vapor phase reflow. The best combination of materials and processes examined results in a TSOP package with no delamination after moisture saturation and vapor phase reflow.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121944412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
An environmental comparison of solder and conductive adhesives for SMT interconnect SMT互连焊料和导电胶粘剂的环境比较
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI: 10.1109/IEMT.1993.398205
P. Conway
{"title":"An environmental comparison of solder and conductive adhesives for SMT interconnect","authors":"P. Conway","doi":"10.1109/IEMT.1993.398205","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398205","url":null,"abstract":"The results of a comparative study of traditional tin-lead solder and the alternatives, namely lead free solders and conductive adhesives are presented. The comparison is made in light of impending European legislation for product \"ecodesign\" and \"ecoproduction\", which may later by embodied in legislation. Conductive adhesives appear to present opportunities from an environmental viewpoint.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122681614","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Time series modeling as an approach to automatic feedback control of robotic positioning errors 时间序列建模作为机器人定位误差自动反馈控制的方法
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI: 10.1109/IEMT.1993.398167
S. M. Yarling
{"title":"Time series modeling as an approach to automatic feedback control of robotic positioning errors","authors":"S. M. Yarling","doi":"10.1109/IEMT.1993.398167","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398167","url":null,"abstract":"The author attempts to learn from, understand, and apply the use of a time series modeling approach to feedback control for improvement of the positioning capability in an industrial robotic positioning process. The underlying goal is to develop a generic process control methodology for use with various sensor-assisted, computer-controlled, automated industrial processes in the effort to understand, control, and improve their performance. While this quality control methodology may be transferable to different types of sensor-assisted automated equipment, the specific results obtained cannot be directly applied to the control of other similar robotic positioning applications.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"136 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132114064","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Analysis of the cavity geometric effect of liquid-phase epitaxy process 液相外延工艺的腔几何效应分析
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI: 10.1109/IEMT.1993.398215
F. Chao, Way-Seen Wang
{"title":"Analysis of the cavity geometric effect of liquid-phase epitaxy process","authors":"F. Chao, Way-Seen Wang","doi":"10.1109/IEMT.1993.398215","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398215","url":null,"abstract":"The slider-induced convection of the confined melt cavity in liquid phase epitaxy is calculated by the finite element method. The steady state flux distribution within the melt cavity is analyzed, and the relative momentum transfer on the poly-GaAs melt is calculated for several kinds of cavity height and shape. It is found that the amount of momentum tranfer is related to the cavity height and the skew angle of the cavity, which could change initial growth rate in thin layer device manufacturing.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133041609","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Advanced statistical process control for ion implantation 离子注入的先进统计过程控制
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI: 10.1109/IEMT.1993.398196
C. Yarling, S. Chereckdjian, J. Nunes
{"title":"Advanced statistical process control for ion implantation","authors":"C. Yarling, S. Chereckdjian, J. Nunes","doi":"10.1109/IEMT.1993.398196","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398196","url":null,"abstract":"The ability of several advanced statistical process control (SPC) methods to monitor an advanced ion implanation center over a period of six weeks is investigated. Sheet resistance data plotted on Box and Whiskers and Cpk charts are compared to the traditional method of plotting data by X-charts. Conclusions are made about these various methods of SPC and their ability to (1) detect anomalies in the process of ion implantation, (2) track the performance of the ion implanter, and (3) address the reality of qualifying process equipment which uses a large number of recipes each day.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132687292","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Intelligent manufacturing systems 智能制造系统
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI: 10.1109/IEMT.1993.398185
D. Nagy
{"title":"Intelligent manufacturing systems","authors":"D. Nagy","doi":"10.1109/IEMT.1993.398185","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398185","url":null,"abstract":"As manufacturing complexity increases, and as factory yields, equipment reliability and equipment utilization each approach 100%, one must look for alternative improvement programs to help reduce manufacturing costs and assist in managing increasing factory complexity. There are a number of possibilities, such as automating routine decision-making processes involved in manufacturing, resulting in faster or more cost-effective decisions, or capturing and applying manufacturing knowledge to reduce the time necessary to detect, analyze and solve manufacturing problems. Either possibility can result in significant savings in productivity improvement or cost reduction, or in avoidance of significant losses. Such strategic programs are in addition to the current automation programs which help manage factory performance, i.e., physical automation to replace human physical activity, and information automation to replace routine human data gathering or data analyses procedures.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"150 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132730173","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 143
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