模塑复合材料/聚酰亚胺界面化学对TSOP分层的影响

Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI:10.1109/IEMT.1993.398218

D. Hagen, E. Prack, Ziep Tran

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引用次数: 5

摘要

研究了界面化学对塑料包装分层的影响。考察了清洗处理、成型复合材料类型和聚酰亚胺模具涂层类型的影响。分层是通过将具有大模具的TSOP封装置于模拟板安装过程中引起的。应力包括室温下75%相对湿度下的水分饱和，然后是气相回流。材料和工艺的最佳组合检查结果在TSOP包没有分层后，水分饱和和气相回流。

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Effect of molding compound/polyimide interfacial chemistry on TSOP delamination

The effect of interfacial chemistry on plastic package delamination is investigated. The effect of cleaning treatments, molding compound types and polyimide die coating types is examined. Delamination is induced by subjecting a TSOP package with a large die to a simulated board mounting process. Stressing consists of moisture saturation at 75% RH at room temperature followed by vapor phase reflow. The best combination of materials and processes examined results in a TSOP package with no delamination after moisture saturation and vapor phase reflow.<>

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Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium

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