SMT互连焊料和导电胶粘剂的环境比较

Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI:10.1109/IEMT.1993.398205

P. Conway

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引用次数: 0

摘要

介绍了传统锡铅焊料与无铅焊料和导电胶粘剂的对比研究结果。比较是根据欧洲即将出台的产品“生态设计”和“生态生产”立法进行的，这些立法可能会在以后的立法中体现出来。从环境的角度来看，导电胶粘剂似乎提供了机会。

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An environmental comparison of solder and conductive adhesives for SMT interconnect

The results of a comparative study of traditional tin-lead solder and the alternatives, namely lead free solders and conductive adhesives are presented. The comparison is made in light of impending European legislation for product "ecodesign" and "ecoproduction", which may later by embodied in legislation. Conductive adhesives appear to present opportunities from an environmental viewpoint.<>

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Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium

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