An environmental comparison of solder and conductive adhesives for SMT interconnect

Abstract

The results of a comparative study of traditional tin-lead solder and the alternatives, namely lead free solders and conductive adhesives are presented. The comparison is made in light of impending European legislation for product "ecodesign" and "ecoproduction", which may later by embodied in legislation. Conductive adhesives appear to present opportunities from an environmental viewpoint.<>