2010 IEEE International Symposium on Electromagnetic Compatibility最新文献

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Information leakage of input operation on touch screen monitors caused by electromagnetic noise 电磁噪声导致触摸屏显示器输入操作信息泄露
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711258
H. Sekiguchi
{"title":"Information leakage of input operation on touch screen monitors caused by electromagnetic noise","authors":"H. Sekiguchi","doi":"10.1109/ISEMC.2010.5711258","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711258","url":null,"abstract":"It is known that the display image on a personal computer with a monitor can be reconstructed by receiving the electromagnetic noise. Recently, the concern about information leakage in the display image caused by the electromagnetic noise has increased from the aspect of information security. In the present study, the information leakage of input button key operations on touch screen monitors was investigated experimentally in the reconstructed display image using the received electromagnetic noise. The experimental results revealed that the touched button image on the touch screen monitor can be identified in the reconstructed display image. In addition, the information leakage origin was discussed based on the reconstruction principle of the display image.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116930093","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Development of an on-chip micro shielded-loop probe to evaluate performance of magnetic film to protect a cryptographic LSI from electromagnetic analysis 片上微屏蔽环探针的研制,以评估磁膜保护密码LSI免受电磁分析的性能
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711255
M. Yamaguchi, Hideki Toriduka, Shoichi Kobayashi, T. Sugawara, Naofumi Hommaa, Akashi Satoh, T. Aoki
{"title":"Development of an on-chip micro shielded-loop probe to evaluate performance of magnetic film to protect a cryptographic LSI from electromagnetic analysis","authors":"M. Yamaguchi, Hideki Toriduka, Shoichi Kobayashi, T. Sugawara, Naofumi Hommaa, Akashi Satoh, T. Aoki","doi":"10.1109/ISEMC.2010.5711255","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711255","url":null,"abstract":"Two types of miniature shielded-loop type magnetic probes were used to analyze RF magnetic near field on the ISO/IEC 18033-3 Standard Cryptographic LSI made by 0.13 µm CMOS process with clock frequency of 24 MHz. The 180 × 180 µm2-size on-chip shielded loop probe we developed was applied to scan the magnetic near field on the LSI and clarified that the magnetic filed is strong not only on the targeting cryptographic circuit. Such a detailed map was depicted for the first time for cryptographic LSI. Then the differential electromagnetic analysis (DEMA) was performed with the shielded-loop probe (1000 × 500 µm2, CP-2S, NEC). All the BITEs of 16-BYTEs long secret key are decrypted by using only 1×104 waveform data in case the waveform is measured closely to the cryptographic circuit whereas the error rate does not converge to zero until the waveform number reaches 3×104 if the data were extracted far away from the circuit. As the countermeasure against DEMA, 25µm thick magnetic film (µr=50 at 1MHz, NEC Tokin Co, type E25) was attached on top of bare LSI chip to suppress magnetic field intensity by 6 dB, which can be a good candidate to protect cryptographic LSI from side channel attack.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117179538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
Off-phase crosstalk behaviour and design considerations for high-speed memory buses 高速存储器总线的离相串扰行为和设计考虑
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711319
A. J. Chen, Hao Wang
{"title":"Off-phase crosstalk behaviour and design considerations for high-speed memory buses","authors":"A. J. Chen, Hao Wang","doi":"10.1109/ISEMC.2010.5711319","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711319","url":null,"abstract":"The interconnect margins shrink rapidly at higher speed due to reduced bit width and increased noise level. Crosstalk impact remains the biggest concern for the single-ended memory busses such as DDR3 and GDDR5 interconnect. The phase relationship of the xtalk coupling plays an important role on interconnect performance. This paper outlines several types of off-phase crosstalk and their impact to system margin. It also provides the methodology to analyse their effects and design considerations to mitigate their impact.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114415991","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Simulated characteristics of optical electric field probe 光电场探头的仿真特性
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711294
T. Ikenaga, H. Ota, K. Arai
{"title":"Simulated characteristics of optical electric field probe","authors":"T. Ikenaga, H. Ota, K. Arai","doi":"10.1109/ISEMC.2010.5711294","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711294","url":null,"abstract":"To perform electric near-field measurements with high accuracy in the gigahertz frequency range, we are developing an optical electric field probe by employing an electrooptic crystal and a laser beam for signal transmission. In this paper, we report the results of a FDTD (Finite Difference Time Domain) simulation of the invasiveness of probes when measuring the electric field distribution above a microstrip line (MSL). The purpose is to verify the measurement accuracy and clarify the design guidelines for optical electric field probes.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114576268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
EMI shielding effects of carbon nanotube cellulose nanocomposite 碳纳米管纤维素纳米复合材料的电磁干扰屏蔽效应
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711271
P. Moilanen, Marko Luukkainen, Jari O. Jekkonen, Veijo Kangas
{"title":"EMI shielding effects of carbon nanotube cellulose nanocomposite","authors":"P. Moilanen, Marko Luukkainen, Jari O. Jekkonen, Veijo Kangas","doi":"10.1109/ISEMC.2010.5711271","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711271","url":null,"abstract":"Electromagnetic interference shielding is an important aspect of modern communication and computer technology. Carbon nanotube cellulose nanocomposite (CNTCNC) provides a novel material as an alternative to traditional metal-based shields for EMI shielding. Stratified structures containing CNTCNC layers combined with existing commercial lossy materials (like ferrite sheets) form effective EMI shields without lowering the signal integrity performance. Significant improvement in shielding effectiveness in stacked CNTCNC layers is noteworthy. CNTCNC is essentially like paper when it comes to flexibility and hence it can be easily conformed to the mechanical structure of the device in need of shielding.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115608567","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Skin-effect modeling of carbon nanotube bundles: The high-frequency effective impedance 碳纳米管束的表皮效应建模:高频有效阻抗
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711390
M. D'amore, M. S. Sarto, A. D’Aloia
{"title":"Skin-effect modeling of carbon nanotube bundles: The high-frequency effective impedance","authors":"M. D'amore, M. S. Sarto, A. D’Aloia","doi":"10.1109/ISEMC.2010.5711390","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711390","url":null,"abstract":"A bundle of single wall carbon nanotubes (SWCNTs) with circular cross-section is treated as a homogeneous material with a.c. effective conductivity σ(ω), which is evaluated by using the Drude's complex expression. The effective d.c. conductivity of the homogeneous bundle is obtained from the total d.c. resistance. The frequency-domain distribution of current density along radial direction of the bundle is utilized to obtain the expressions of the skin depth and the effective impedance. Applications of the proposed formulation to SWCNT bundles of different configurations are carried out. The obtained results show the saturation behaviour of the effective resistance and inductance above a critical frequency, which depends on the momentum relaxation time of the CNTs.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114688982","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
Assessment of emissions from electrical equipment regarding human exposure — Approaches for application of the generic standard IEC 62311 与人体接触有关的电气设备排放物的评估。通用标准IEC 62311的应用方法
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711362
B. Jaekel, A. Mladenović, M. Perić, D. Vučković, Nenad N. Cvetković, S. Aleksic
{"title":"Assessment of emissions from electrical equipment regarding human exposure — Approaches for application of the generic standard IEC 62311","authors":"B. Jaekel, A. Mladenović, M. Perić, D. Vučković, Nenad N. Cvetković, S. Aleksic","doi":"10.1109/ISEMC.2010.5711362","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711362","url":null,"abstract":"In a lot of countries and regions there are requirements regarding electromagnetic emissions from electrical equipment. Such emissions can be looked at under two aspects: the emissions might interfere with other equipment in the vicinity causing potential malfunction (EMC aspect), or might be considered with regard to human exposure (EMF aspect). Limitation of such emissions related to the EMC aspect is part of EMC activities and is mostly due to the need to protect radio services from being interfered. Applicable limits depend on the type of equipment under concern and of the locations where equipment is intended to be operated. However, more and more such emissions are looked at also under a human exposure point of view within the frame of EMF regulations. As both aspects deal with entirely different objective targets consequently different limits, different measurement procedures and different assessment methods are to be applied. This could mean in practice that basically two kinds of measurements have to be carried out. This paper introduces an approach how to use results obtained by means of EMC measurements for the purpose of EMF assessments. As an example for an assessment the EMC data in the frequency range between 30 MHz and 230 MHz are used as part of an EMF assessment.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127011113","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Network model for the analysis of radiated emissions from horizontal PCB submodules 用于分析水平PCB子模块辐射发射的网络模型
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711350
M. Friedrich, M. Leone
{"title":"Network model for the analysis of radiated emissions from horizontal PCB submodules","authors":"M. Friedrich, M. Leone","doi":"10.1109/ISEMC.2010.5711350","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711350","url":null,"abstract":"The radiation behaviour of motherboard-subboard structures on printed-circuit boards is investigated. The analysis is based on an equivalent circuit including the connector inductance network and the radiating antenna structure. A special focus is put on the calculation of the mutual and self inductances of the connector pins. For this purpose simple closed-form expressions are developed for the central board region and validated by accurate cavity-model reference results. The final validation of the predicted radiated-emission characteristics by numerical 3D field simulations and by measurement shows a good agreement with respect to engineering purposes.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126164949","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Transient perturbation analysis in digital radio 数字无线电中的瞬态扰动分析
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711282
R. Jaúregui, M. Pous, Mireya Fernández, Ferran Silva
{"title":"Transient perturbation analysis in digital radio","authors":"R. Jaúregui, M. Pous, Mireya Fernández, Ferran Silva","doi":"10.1109/ISEMC.2010.5711282","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711282","url":null,"abstract":"This paper presents a new simulation methodology to study the effect of radiated transient disturbances on digital communication systems. The procedure is divided in two stages. In the first one, FDTD numerical simulation is used to determine the transient levels coupled to the antennas. In the second stage, these levels are analyzed by means of a signal processing simulation software to determine the degradation caused in the system. The procedure is applied to a DAB system in car when a radiated interference is generated by a transient in a vehicle cable. The results show that the amplitude of the radiated transient coupled signal is a key parameter, but it is also essential to take into account other parameters such as burst duration and frequency.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"135 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122496637","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Designing shielding boxes made of conductive plastics using a new joining structure 采用新型连接结构设计导电塑料屏蔽盒
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711328
J. Catrysse, F. Vanhee, D. Pissoort, R. Dewitte, D. Hellert
{"title":"Designing shielding boxes made of conductive plastics using a new joining structure","authors":"J. Catrysse, F. Vanhee, D. Pissoort, R. Dewitte, D. Hellert","doi":"10.1109/ISEMC.2010.5711328","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711328","url":null,"abstract":"When designing shielding boxes made of conductive plastics, the problem is how to contact both parts of the box together, and how to fit filters and cable entries in a conductive way to the chassis. A new low-cost joining structure has been developed and characterized, as well as the importance of fixing filters and cable entries.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125040134","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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