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2010 IEEE International Symposium on Electromagnetic Compatibility最新文献

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An improved technique to discover compromising electromagnetic emanations 一种改进的发现有害电磁辐射的技术
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711257
Martin Vuagnoux, S. Pasini
{"title":"An improved technique to discover compromising electromagnetic emanations","authors":"Martin Vuagnoux, S. Pasini","doi":"10.1109/ISEMC.2010.5711257","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711257","url":null,"abstract":"The techniques generally used to detect compromising emanations are based on a wide-band receiver tuned on a specific frequency or a spectral analyzer with a limited bandwidth. However, these methods may not be optimal since a significant amount of information is lost during the signal acquisition. In this paper, we propose a straightforward but efficient approach which acquires raw signal directly from the antenna and processes the entire captured electromagnetic spectrum thanks to the computation of short time Fourier transforms. We applied this approach to detect potential compromising electromagnetic emanations radiated by modern keyboard. Since keyboards are often used to transmit confidential data such as passwords, these emanations could remotely reveal sensitive information such as keystrokes. Thanks to this method, we detected four different kinds of compromising electromagnetic emanations generated by wired and wireless keyboards. These emissions lead to a full or a partial recovery of the keystrokes. We implemented these side-channel attacks and our best practical attack fully recovered 95% of the keystrokes of a PS/2 keyboard at a distance up to 20 meters, even through walls.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131885725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 58
Investigation on electromagnetic responses of double objects illuminated by a high-power EMP using hybrid TDIE-TDPO method 用混合TDIE-TDPO方法研究大功率电磁脉冲照射双目标的电磁响应
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711279
Ming-da Zhu, Xi-Lang Zhou, W. Yin
{"title":"Investigation on electromagnetic responses of double objects illuminated by a high-power EMP using hybrid TDIE-TDPO method","authors":"Ming-da Zhu, Xi-Lang Zhou, W. Yin","doi":"10.1109/ISEMC.2010.5711279","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711279","url":null,"abstract":"An efficient and stable hybrid method, based on time-domain integral equation (TDIE) and time-domain physical optics (TDPO), is proposed for investigating electromagnetic responses of double 3-D objects illuminated by a high-power EMP. The planar triangular patches are used to model the conductive surface with RWG basis functions implemented, while the temporal basis functions of weighted Laguerre polynomials are also employed. A set of hybrid TDIE-TDPO equations are solved by marching-on-in-order scheme (MOO) for the sake of stability. Under such circumstances, compared with the full TDIE solver, the computational complexity of our developed hybrid TDIE-TDPO method is reduced greatly. Several examples are presented to demonstrate its validity and efficiency. In particular, transient electromagnetic responses of different double 3-D conductive objects, illuminated by a HPEMP, are captured and compared for different pulse waveforms and pulse parameters.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128280525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Analyzing via impedance variations with a stochastic collation method 用随机整理法分析阻抗变化
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711336
Jianxiang Shen, Hanfeng Wang, Ji Chen, J. Fan
{"title":"Analyzing via impedance variations with a stochastic collation method","authors":"Jianxiang Shen, Hanfeng Wang, Ji Chen, J. Fan","doi":"10.1109/ISEMC.2010.5711336","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711336","url":null,"abstract":"In this paper, we describe a systematic approach to optimize and analyze the equivalent characteristic impedance of practical via structures. The procedure consists of (a) optimizing via structures for impedance matching using a Genetic algorithm, and (b) numerically characterize, by stochastic collocation method, the sensitivity of the equivalent characteristic impedance to the manufacturing uncertainties in the various geometrical parameters of a via structure. Such procedure naturally leads to a rigorous methodology for EM design/control in the presence of multiple sources of uncertainty.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128298653","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Statistics use for radiated high frequency failures 用于辐射高频故障的统计
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711262
Emmanuelle Garcia
{"title":"Statistics use for radiated high frequency failures","authors":"Emmanuelle Garcia","doi":"10.1109/ISEMC.2010.5711262","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711262","url":null,"abstract":"After presenting a global process of EMC (ElectroMagnetic Compatibility) physics and risk analysis, this paper deals with the specific failure mode of radiated high frequencies. For realistic complex systems with partial unavailability of the data, peak amplitude frequency and observable spatial localisation sensibility, we detail the advantages of four main types of statistical results. The potential of using statistics in simulation coupled with experimental tests is also highlighted.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"300 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116527092","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Enabling terabit per second switch linecard design through chip/package/PCB co-design 通过芯片/封装/PCB协同设计实现每秒太比特的开关线卡设计
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711342
Q. Chen, Jianmin Zhang, K. Qiu, Darja Padilla, Zhiping Yang, A. Scogna, J. Fan
{"title":"Enabling terabit per second switch linecard design through chip/package/PCB co-design","authors":"Q. Chen, Jianmin Zhang, K. Qiu, Darja Padilla, Zhiping Yang, A. Scogna, J. Fan","doi":"10.1109/ISEMC.2010.5711342","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711342","url":null,"abstract":"Widespread use of the Web 2.0 Internet applications such as video streaming and social networking are continuously demanding higher bandwidth network equipment. Electrical designers increasingly face more and more challenges to deliver higher speed products within short development cycle due to design complexity and new multi-GHz signal integrity problems. This paper presents a modeling and simulation methodology through chip/package/PCB (printed circuit board) co-design and co-optimization to enable a terabit per second network switch linecard design. Channel design techniques such as BGA (Ball Grid Array) pin backdrill, via tuning, and low loss interconnects are outlined. Full wave 3D modeling techniques with optimal model segmentation, model cascading and model optimization are discussed. At the end, correlation between lab measurement and simulation in both frequency and time domains are investigated.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"139 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128218280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Design and modeling for chip-to-chip communication at 20 Gbps 20 Gbps的片对片通信设计和建模
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711320
Jianmin Zhang, Q. Chen, K. Qiu, A. Scogna, M. Schauer, G. Romo, J. Drewniak, A. Orlandi
{"title":"Design and modeling for chip-to-chip communication at 20 Gbps","authors":"Jianmin Zhang, Q. Chen, K. Qiu, A. Scogna, M. Schauer, G. Romo, J. Drewniak, A. Orlandi","doi":"10.1109/ISEMC.2010.5711320","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711320","url":null,"abstract":"This paper presents the design of serial chip-to-chip communication at 20 Gbps including modeling and correlation for PCBs (Printed Circuit Boards) with FR4 substrate materials. The entire channel under investigation includes two packages, a 21-layer ceramic and a 12-layer organic, and a 22-layer PCB. A probing station, microprobes and a VNA are used to measure the entire channel S-parameters and the measurement is correlated to the simulation up to 20 GHz. Extended study for the channel with low loss PCB substrate material is simulated. Time-domain eye comparisons for the FR4 channel, low loss channel, and the FR4 channel with equalization are given. A general design rule as well as new technologies for the high-speed channel design at 20 Gbps and beyond are discussed and given in the conclusion.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132936071","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
High speed interconnects of multi-layer PCB analysis by using non-conformal domain decomposition method 用非共形域分解法分析多层PCB的高速互连
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711351
Yang Shao, Z. Peng, Jin-Fa Lee
{"title":"High speed interconnects of multi-layer PCB analysis by using non-conformal domain decomposition method","authors":"Yang Shao, Z. Peng, Jin-Fa Lee","doi":"10.1109/ISEMC.2010.5711351","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711351","url":null,"abstract":"A non-conformal domain decomposition method (DDM) is proposed to investigate signal integrity (SI) of high-speed interconnects on multi-scale, multi-layer printed circuit board (PCB) in this paper. The accuracy and robustness of the proposed method is first demonstrated by analysis of a 4-layer differential pair. Then we studied a 14-layer 16 traces interconnect model to demonstrate the efficiency of the method. Eye diagrams of the two models are studied for time domain SI.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130530096","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Noise mitigation analysis of a π-filter for an automotive control module 汽车控制模块π滤波器的降噪分析
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711343
C. Rostamzadeh, F. Canavero, F. Kashefi
{"title":"Noise mitigation analysis of a π-filter for an automotive control module","authors":"C. Rostamzadeh, F. Canavero, F. Kashefi","doi":"10.1109/ISEMC.2010.5711343","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711343","url":null,"abstract":"Electromagnetic interference (EMI) filters are often used on automotive 13.8 VDC power networks to reduce high-frequency noise from being conducted off the printed circuit boards (PCB) and resulting into EMI problems. The filter performance is difficult to predict and often compromised at high frequencies due to parasitics associated with the filter itself, or the PCB layout. The power line filters with Surface Mount Technology ferrite and Multi Layer Ceramic Capacitors are attractive solutions for mitigation of RF noise in high-density automotive PCBs. A lumped-element SPICE model is introduced for optimized π-filter design, including frequency-dependent ferrite component model. The PCB implementation of EMI filter is outlined for optimum filter performance.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126055872","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Equivalent circuit models for evaluation of bandgap limits for planar electromagnetic bandgap structures 平面电磁带隙结构带隙极限评估的等效电路模型
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711376
F. de Paulis, L. Raimondo, A. Orlandi, Liehui Ren, J. Fan
{"title":"Equivalent circuit models for evaluation of bandgap limits for planar electromagnetic bandgap structures","authors":"F. de Paulis, L. Raimondo, A. Orlandi, Liehui Ren, J. Fan","doi":"10.1109/ISEMC.2010.5711376","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711376","url":null,"abstract":"In this work different physic based equivalent lumped element circuits models representing planar EBG structures are developed. Their results, in terms of evaluation of the lower and upper limits of the bandgap, are compared with a three dimensional simulation considered as reference. Guidelines for the use of these models for their use in planar EBG design are developed.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127772772","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Polarization extraction through the linear component method 通过线性分量法提取偏振
2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711314
J. Nascimento, G. Fontgalland, R. M. Valle
{"title":"Polarization extraction through the linear component method","authors":"J. Nascimento, G. Fontgalland, R. M. Valle","doi":"10.1109/ISEMC.2010.5711314","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711314","url":null,"abstract":"In this article is proposed a measurement technique to the electromagnetic polarization for completely polarized waves, using the linear component method, in order to obtain the magnitude and phase of the radiated electric field by one or many sources. Through these parameters the characteristics of the electromagnetic wave emitted by antennas, including the type and miniaturized RFID, will be defined more precisely.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126473157","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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