2010 IEEE International Symposium on Electromagnetic Compatibility最新文献_第5页

Validating the FSV Method using reverberation chamber measurements 利用混响室测量验证FSV方法

2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711370

G. Hankins, D. Lewis

引用次数: 2

Dependence of the time- and frequency-domain response of BCI injection probes on the common- mode characteristic impedance of the cable bundle BCI注入探头时域和频域响应与电缆束共模特性阻抗的关系

2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711296

J. Mclean, R. Sutton

{"title":"Dependence of the time- and frequency-domain response of BCI injection probes on the common- mode characteristic impedance of the cable bundle","authors":"J. Mclean, R. Sutton","doi":"10.1109/ISEMC.2010.5711296","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711296","url":null,"abstract":"The common-mode characteristic impedance of a typical cable bundle has been suggested to be approximately 150 Ohms. However, standard test fixtures for BCI probes employ 50 Ohm coaxial ports. Here a representative injection probe (transformer) intended for bulk current injection applications is characterized experimentally in the frequency domain using a 2-port vector network analyzer and a standard (50 Ohm) test fixture as described in the IEC 61000-4-6 standard. The full 3-port scattering representation of the probe in the test fixture is then de-embedded and renormalized such that the coaxial ports of the test fixture are changed to 150 Ohms. The time-domain step response of the representative transformer is then computed from renormalized frequency-domain scattering matrix. It is seen that changing the impedance level from 50 Ohms to 150 Ohms significantly alters both the frequency and time domain performance of the transformer. Thus, the standard test fixture does not accurately predict the frequency- and time-domain performance of a typical BCI transformer. It is shown that the dependence of performance on port impedance can, to some extent, be anticipated by examining the equivalent network for the transformer.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132361836","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

A two-layer board intellectual property to reduce electromagnetic radiation 采用两层板的知识产权，减少电磁辐射

2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711285

N. Chen, Hongchin Lin

引用次数: 1

Far-end crosstalk reduction in adjacent PCB traces employing High/Low-Z configurations 采用高/低z配置减少相邻PCB走线的远端串扰

2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711374

M. Almalkawi, Z. Khan, V. Devabhaktuni, C. Bunting

引用次数: 8

Antenna co-site performance analysis for complex systems using Feature Selective Validation 基于特征选择验证的复杂系统天线共站性能分析

2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711365

I. Kasperovich, A. Drozd, C. E. Carroll, Adrienne A. Croneiser

引用次数: 0

Estimating radiated emissions from printed circuit boards and cables inside EMC chambers 电磁兼容室内印刷电路板和电缆的辐射发射估算

2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711243

Garrett McCormick, Z. Khan, V. Devabhaktuni, Mansoor Alam, A. Wood

{"title":"Estimating radiated emissions from printed circuit boards and cables inside EMC chambers","authors":"Garrett McCormick, Z. Khan, V. Devabhaktuni, Mansoor Alam, A. Wood","doi":"10.1109/ISEMC.2010.5711243","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711243","url":null,"abstract":"This paper presents a new approach to modelling radiated emissions from electronic systems inside EMC compliance chambers. The proposed approach exploits the fact that manufacturers prefer reusing circuits/layouts in new products with minor geometrical modifications to the existing designs. The available data from previous EMC testing, therefore, may contain certain features/patterns that may be extracted and employed to predict EMC performance of similar products. Motivated by this observation, the proposed method develops accurate models for radiated emissions inside the EMC testing environment. Specifically, radiated emissions from various geometrical configurations of a PCB-cable structure are employed to develop artificial neural network models. These developed models are tested to predict radiated emissions from a given PCB-cable structure configuration. Results show that very accurate estimates of the radiated emissions can be made using the developed models without requiring the time-consuming simulations and expensive prototype testing in the compliance chambers.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132084003","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Stressed jitter analysis for physical link characterization 物理链路表征的应力抖动分析

2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711339

N. Radhakrishnan, B. Achkir, J. Fan, J. Drewniak

引用次数: 2

Measurement of RF current waveform of a source driver chip used in a liquid crystal-TV display panel 液晶电视显示面板用源驱动芯片射频电流波形的测量

2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711327

Shoichi Kobayashi, H. Torizuka, S. Dhungana, M. Yamaguchi

{"title":"Measurement of RF current waveform of a source driver chip used in a liquid crystal-TV display panel","authors":"Shoichi Kobayashi, H. Torizuka, S. Dhungana, M. Yamaguchi","doi":"10.1109/ISEMC.2010.5711327","DOIUrl":"https://doi.org/10.1109/ISEMC.2010.5711327","url":null,"abstract":"Instantaneous RF current waveform of the power line for a source driver chip used in a typical colour active matrix type liquid crystal-TV display panel has been evaluated for the first time based on magnetic near field measurement. A 16-inch panel set was opened to bare the 10 parallelly-connected source driver chips. Each chip is with 2.7 mm × 12.0 mm in size, and drives 207 liquid crystal cells with nominally 100 pF for each at 16 Vmax with common voltage level of 8 V, which corresponds to the maximum charge of 0.17 µC. A shielded-loop probe (CP-2S, window size: 0.2 mm × 1.0 mm) was used to measure the induced voltage waveform. The analogue power line was identified as the major source of RF magnetic field noise. Then RF current waveform was calculated based on the Faraday's low, using the size and geometry of measurement system. It is known the cells are fully charged when all the panel cells display “white.” The measured corresponding peak current was 130 mA with rise time of less than 10 ns at the turned-off of clock pulse, followed by a triangular-like decrease for 1.7 µs. The corresponding electric charge was 0.14 µC, which is closely to the maximum possible charge of 0.17 µC. The spectrum of RF current has significant intensity even around 1 GHz.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122702671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

New radiated immunity/susceptibility test method using rotating FM-EM field 旋转FM-EM场辐射免疫敏度试验新方法

2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711269

K. Murano, M. Tayarani, F. Xiao, Y. Kami

引用次数: 1

Systematic analysis of the signal integrity performance of surface integrated waveguide structures (SIWs) 表面集成波导结构信号完整性性能的系统分析

2010 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2010-07-25 DOI: 10.1109/ISEMC.2010.5711379

A. Scogna, A. Orlandi

引用次数: 6