{"title":"物理链路表征的应力抖动分析","authors":"N. Radhakrishnan, B. Achkir, J. Fan, J. Drewniak","doi":"10.1109/ISEMC.2010.5711339","DOIUrl":null,"url":null,"abstract":"A link-path analysis approach is introduced in this paper based on the frequency-domain S-parameters of the link path. Different jitter components are also modelled and can be injected into the analysis to characterize the link responses to different types of jitter input. Stressed link path analysis can be very useful in practical engineering designs in terms of link path optimization, device selection and qualification, etc.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"676 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Stressed jitter analysis for physical link characterization\",\"authors\":\"N. Radhakrishnan, B. Achkir, J. Fan, J. Drewniak\",\"doi\":\"10.1109/ISEMC.2010.5711339\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A link-path analysis approach is introduced in this paper based on the frequency-domain S-parameters of the link path. Different jitter components are also modelled and can be injected into the analysis to characterize the link responses to different types of jitter input. Stressed link path analysis can be very useful in practical engineering designs in terms of link path optimization, device selection and qualification, etc.\",\"PeriodicalId\":201448,\"journal\":{\"name\":\"2010 IEEE International Symposium on Electromagnetic Compatibility\",\"volume\":\"676 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-07-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE International Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2010.5711339\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2010.5711339","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Stressed jitter analysis for physical link characterization
A link-path analysis approach is introduced in this paper based on the frequency-domain S-parameters of the link path. Different jitter components are also modelled and can be injected into the analysis to characterize the link responses to different types of jitter input. Stressed link path analysis can be very useful in practical engineering designs in terms of link path optimization, device selection and qualification, etc.
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