Network model for the analysis of radiated emissions from horizontal PCB submodules

M. Friedrich, M. Leone
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引用次数: 7

Abstract

The radiation behaviour of motherboard-subboard structures on printed-circuit boards is investigated. The analysis is based on an equivalent circuit including the connector inductance network and the radiating antenna structure. A special focus is put on the calculation of the mutual and self inductances of the connector pins. For this purpose simple closed-form expressions are developed for the central board region and validated by accurate cavity-model reference results. The final validation of the predicted radiated-emission characteristics by numerical 3D field simulations and by measurement shows a good agreement with respect to engineering purposes.
用于分析水平PCB子模块辐射发射的网络模型
研究了印刷电路板上主板-子板结构的辐射特性。分析基于一个等效电路,包括连接器电感网络和辐射天线结构。特别着重于计算连接器引脚的互感和自感。为此,针对中心板区域开发了简单的封闭表达式,并通过精确的空腔模型参考结果进行了验证。通过三维数值模拟和实测结果验证了预测的辐射发射特性,结果与工程目的吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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