ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems最新文献_第3页

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application 智能计算应用中异构集成的扇出MCM解决方案研究

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2020-10-27 DOI: 10.1115/ipack2020-2528

C. Hung, Yu-Po Wang, Steven Chen, Katch Wan

{"title":"Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application","authors":"C. Hung, Yu-Po Wang, Steven Chen, Katch Wan","doi":"10.1115/ipack2020-2528","DOIUrl":"https://doi.org/10.1115/ipack2020-2528","url":null,"abstract":"\u0000 In recent years, semiconductor products have developed rapidly, from desktop computers with basic computing to Internet-connected smartphones, to emerging intelligent and perceived smart system products, such as mass-produced of smart home appliances, smart watches, and under development of smart glasses. The product trend is toward high performance, multi-functional integration, thinner profile and lower cost features. These requirements are interrelated with wafer technology and assembly process development. The advanced wafer technology, such as 5nm / 3nm, will provide higher performance. However, as Moore’s Law is approaching the physical limit, the industry has turned to the development of advanced packaging solution technologies to break through this bottleneck. At present, the industry’s forward-looking packaging platform includes 2.5 D, 3D, Fan-out and SiP modules, etc., which technologies can integrate chiplet, chip stack, passive components as heterogeneous integrated packaging solutions.\u0000 Fan-Out MCM Platform has integrative characteristics for homogeneous / heterogeneous wafers and passives, lower cost and lower profile advantage than 2.5D, also provided comparable performance to 2.5D by proper RDL / Substrate layout design. In addition, in order to meet the high-performance characteristics of products, toward developing multi-layer RDL layers (more than 3 layers). This article will plan a series of multi-RDL layers sample tests, RDL sample build of line width/line space of 1/1um and introduce the related process challenge, microstructure data.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"5 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114582058","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints SAC305焊点蠕变试验中Anand参数的测定

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2020-10-27 DOI: 10.1115/ipack2020-2690

M. A. Haq, M. A. Hoque, J. Suhling, P. Lall

{"title":"Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints","authors":"M. A. Haq, M. A. Hoque, J. Suhling, P. Lall","doi":"10.1115/ipack2020-2690","DOIUrl":"https://doi.org/10.1115/ipack2020-2690","url":null,"abstract":"\u0000 Solder Joints are among the most vulnerable components within electronic packages, and solder joint fatigue is regarded to be one of the major methods of electronic package failure. The prediction of solder joint reliability is thus of great importance and most finite element packages utilize the Anand Viscoplastic Model to model the mechanical behavior of the solder joint material. In this work, 3 × 3 arrays of SAC305 solder joints of roughly 750 μm in diameter were reflowed in between two FR-4 printed circuit boards to create a sandwich structural sample. These samples were then subjected to creep testing in shear at various temperatures (T = 25, 50, 75, 100 °C) and stress levels (τ = 5, 10, and 15 MPa). A set of specially designed fixtures was used to grip the solder joint specimens. The nine Anand model constants were then extracted from the creep data. The Anand model predicted creep response curves were then compared with the experimental creep measurements to determine the accuracy of the model. The Anand model predictions were found to match the measured data very well over a wide range of temperatures and stress levels.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128529622","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates 柔性安装和动态折叠对不同方向、折叠速度、充电深度和c -倍率下锂离子电池性能下降的影响

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2020-10-27 DOI: 10.1115/ipack2020-2661

P. Lall, Ved Soni, Scott Miller

{"title":"Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates","authors":"P. Lall, Ved Soni, Scott Miller","doi":"10.1115/ipack2020-2661","DOIUrl":"https://doi.org/10.1115/ipack2020-2661","url":null,"abstract":"\u0000 The growing need for wearable devices, fitness accessories and biomedical equipment has led to the upsurge in research and development of thin flexible battery research and development. Wearable equipment and other asset monitoring applications require versatile installation of power sources on non-planar surfaces. For power sources in wearable electronics, perseverance towards repetitive mechanical stresses induced by human body motion is necessary along with the usual desirable characteristics such as high capacity, high C-rate capability and good life cycle stability. Prior studies which document the reliability of power sources subject to static and dynamic folding are scarce and at times fail to follow definitive test protocols which limit their application to real-life battery use scenarios. Particularly, the use of manual mechanical stressing of the power sources instead of a mechanical test setup is a key shortcoming in existing literature. Data is lacking on battery life cycling and in-situ mechanical stressing of the power sources including their impact of performance and reliability. Present study aims to overcome these deficiencies by testing a commercial Li-ion power source under static as well as dynamic folding. Furthermore, the fold-orientation and its fold-speed are varied to evaluate the effect of different mechanical stress topologies on the power source. Finally, a regression model was developed to capture the effect of these use parameters on battery capacity degradation.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122179586","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers 一套集成跨介质换热器(iCMHXs)用于台式计算机液冷的实验研究

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2020-10-27 DOI: 10.1115/ipack2020-2591

Gargi Kailkhura, R. Mandel, A. Shooshtari, M. Ohadi

{"title":"Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers","authors":"Gargi Kailkhura, R. Mandel, A. Shooshtari, M. Ohadi","doi":"10.1115/ipack2020-2591","DOIUrl":"https://doi.org/10.1115/ipack2020-2591","url":null,"abstract":"\u0000 The present study is an experimental investigation of a set of five additively-manufactured compact, lightweight, low-cost, air-to-water cross-media heat exchangers suitable for liquid cooling applications in desktop computers, among other applications. The heat transfer between the two fluids is facilitated by solid metallic wires arranged in a staggered tube-bank configuration, in direct contact with both fluids separated by polymer walls. Since the liquid flows externally over the wires instead of flowing inside the tubes in conventional tube-bank fin heat exchangers, smaller wires can be used in iCMHXs, resulting in lighter and more efficient units. The additively-manufactured iCMHX units are post-processed using a conformal polyurethane sealant. The units are experimentally studied in two case studies based on their post-processing techniques. The experimental studies include instrumentation calibration as well as uncertainty analysis. The first case study considers three geometrically identical iCMHX units sharing the same post-processing method. The overall iCMHX performances characterized by the thermal and hydrodynamic parameters, such as thermal resistance and pressure drop for both waterside and airside, are compared. Their experimental results are also compared to 2D CFD predictions. To provide probable reasoning behind the differences in the comparisons, a second case study is then carried out by experimentally investigating two iCMHX units but with variable post-processing approaches such as by using a thinned sealant and by using a single layer of sealant.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124784331","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

A Porous Medium Approach for Single-Phase Flow and Heat Transfer Modeling in Manifold Microchannel Heat Exchangers 多孔介质法在流形微通道换热器中单相流动和传热模拟中的应用

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2020-10-27 DOI: 10.1115/ipack2020-2564

Fabio Battaglia, R. Mandel, A. Shooshtari, M. Ohadi

{"title":"A Porous Medium Approach for Single-Phase Flow and Heat Transfer Modeling in Manifold Microchannel Heat Exchangers","authors":"Fabio Battaglia, R. Mandel, A. Shooshtari, M. Ohadi","doi":"10.1115/ipack2020-2564","DOIUrl":"https://doi.org/10.1115/ipack2020-2564","url":null,"abstract":"\u0000 Manifold Microchannels have been proven to enhance thermal management in different fields, such as electronic cooling, dry cooling, and high temperature heat exchangers. Manifold-microchannels use a system of manifolds to divide a microgrooved surface into a system of manifolds, thereby reducing pressure drop and increasing heat transfer by utilizing the developing flow regime. Because of this, design of a manifold-microchannel heat exchanger requires the design of the manifold and microchannel. In some situations, a sequential design approach, where one first designs the microchannel and then the manifold — is sufficient to meet the requirements of the problem statements. The more demanding requirements of contemporary applications require manifold microchannel design to evolve and become more complex. In particular, reducing the volume and pitch of the manifold has become necessary. Reducing the volume of the manifold results in a higher flow maldistribution, and the ability to predict how maldistribution affects heat transfer rate is critical. Similarly, reducing the pitch of the manifold increases the effect of axial conduction in the solid, and understanding the effect on heat transfer is important. To those ends, this work shows a porous medium approach for single-phase flow in manifold microchannel, which allows to predict pressure drop, maldistribution, axial conduction, and heat transfer rate with a much smaller computational demand when compared to a full 3D simulation, while guaranteeing very similar results.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125640793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

High Performance Computing Package With Chip Module on Substrate Solutions 基于基板的高性能计算封装芯片模块解决方案

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2020-10-27 DOI: 10.1115/ipack2020-2547

C. Chen, David Lai, V. Lin, Yu Po Wang

{"title":"High Performance Computing Package With Chip Module on Substrate Solutions","authors":"C. Chen, David Lai, V. Lin, Yu Po Wang","doi":"10.1115/ipack2020-2547","DOIUrl":"https://doi.org/10.1115/ipack2020-2547","url":null,"abstract":"\u0000 With die size increasing and bump pitch decreasing on FCBGA (flip chip ball grid array), warpage is the first challenge that processes of package assembly and SMT (surface mount technology) will have. The main factor is CTE (coefficient of thermal expansion) mismatch between chip and substrate. The larger die size, the more significant elongation difference which could cause warpage. Furthermore, serious warpage can cause manufacture difficulties, such as bump bridge, bump non-wet and underfill (UF) void. As the result, in order to control package warpage, additional force, such as high modulus UF or metal heat sink are usually applied to restrict package deformation. However, the more additional force is applied, the more stress may be transferred to chip and causes chip corner or UF crack where easily cause stress concentration.\u0000 In this paper, large package > 70 * 70 mm is studied for the challenges of on substrate process and reliability, meanwhile simulation is performed for stress prediction. In addition, possible solutions from material and process are discussed and studied.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128765241","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow 撞击气流中垂直翅片和非翅片表面结霜的实验研究

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2020-10-27 DOI: 10.1115/ipack2020-2569

E. Oksuz, A. Saygin, A. Basol, M. Budakli, M. Arik

{"title":"An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow","authors":"E. Oksuz, A. Saygin, A. Basol, M. Budakli, M. Arik","doi":"10.1115/ipack2020-2569","DOIUrl":"https://doi.org/10.1115/ipack2020-2569","url":null,"abstract":"\u0000 Frost formation on evaporators negatively affects the cooling performance of refrigerators. It increases the thermal resistance between the refrigerant and air leading to a reduction in the system cooling capacity. In this study, the effect of frost accumulation over a bare and finned surface on the convective thermal resistances has been experimentally investigated under impinging flow conditions. The surfaces are vertically positioned in a horizontal wind tunnel. The convective resistances have been measured with an in-house developed heat flux measurement system. Finally, the effectiveness of the finned surface was derived from the measurements for dry, condensing flow and as well as for frosting conditions. Under frosting conditions, the effectiveness of the finned surface is measured as 1.4 that is by a factor of 2X lower compared to the effectiveness of the same finned surface operating under dry conditions. It has been observed that the frost accumulation initially takes place at the tip of the fins and leads to a 45% drop in the heat transfer rate when the fin tips are completely covered with frost. Further frost accumulation on the fin base does not result in an additional drop in the heat transfer rate. In this regard, the study emphasizes the importance of the fin tip design for the heat sinks operating under frosting conditions.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128880831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods 扇形圆片翘曲的分析、数值及实验研究

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2020-10-27 DOI: 10.1115/ipack2020-2555

G. Gadhiya, S. Rzepka, T. Otto, S. Kersjes, Felandorio Fernandes

{"title":"The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods","authors":"G. Gadhiya, S. Rzepka, T. Otto, S. Kersjes, Felandorio Fernandes","doi":"10.1115/ipack2020-2555","DOIUrl":"https://doi.org/10.1115/ipack2020-2555","url":null,"abstract":"\u0000 Low-Density Fan-Out (LDFO) (or fan-out wafer-level packaging) technologies are getting significant attention for heterogeneous system integration in many applications. Despite many studies, excessive wafer warpage is still a challenge for many process steps in these technologies. Therefore, the systematic study is carried out to understand the physics of wafer warpage focusing on the interactions between the silicon (Si) and the epoxy molding compound (EMC). The study started with analytical calculations and finite element (FE) analyses of simple mold/Si bilayer wafer bow for the initial benchmarking. The actual 8″ mold/Si wafer warpage measurements are performed using a newly developed measurement system featuring a 3-point support and an in-situ temperature measurement platform. The finite element model is calibrated with respect to measured wafer warpage showing bifurcation behavior by incorporating the cure shrinkage, mold layer thickness variation, perturbation force, gravity and the actual mold material properties measured by dynamic mechanical analysis (DMA) and thermomechanical analysis (TMA). Also, the FE models with and without rigid contact support are validated showing a good match with measured wafer bow for different silicon thicknesses. Next, the study was further widened to realistic 12″ reconstituted wafers using the validated FE analysis approach. Interestingly, these wafers also exhibit the bifurcation effect and the bifurcation region is analyzed for the relevant range of die and overmold thicknesses for two mold materials. A virtual design of experiments (DOE) quantified these influences for different die and mold thicknesses, die occupation rate and mold materials. These studies provide good practical guidance for the optimal LDFO design to avoid excessive warpage.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115456872","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Numerical Analysis of Oil Immersion Cooling of a Server Using Mineral Oil and Al2O3 Nanofluid 矿物油和Al2O3纳米流体对服务器油浸冷却的数值分析

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2020-10-27 DOI: 10.1115/ipack2020-2662

Amirreza Niazmand, P. Murthy, S. Saini, Pardeep Shahi, Pratik V. Bansode, D. Agonafer

{"title":"Numerical Analysis of Oil Immersion Cooling of a Server Using Mineral Oil and Al2O3 Nanofluid","authors":"Amirreza Niazmand, P. Murthy, S. Saini, Pardeep Shahi, Pratik V. Bansode, D. Agonafer","doi":"10.1115/ipack2020-2662","DOIUrl":"https://doi.org/10.1115/ipack2020-2662","url":null,"abstract":"\u0000 Increased demand for computer applications has manifested a rise in data generation, resulting in high Power Density and Heat Generation of servers and their components, requiring efficient thermal management. Due to the low heat carrying capacity of air, air cooling is not an efficient method of data center cooling. Hence, the liquid immersion cooling method has emerged as a prominent method, where the server is directly immersed in a dielectric liquid. The thermal conductivity of the dielectric liquids is drastically increased with the introduction of non-metallic nanoparticles of size between 1 to 150 nm, which has proven to be the best method. To maintain the dielectric feature of the liquid, non-metallic nanoparticles can be added.\u0000 Alumina nanoparticles with a mean size of 80 nm and a mass concentration of 0 to 5% with mineral oil are used in the present study. The properties of the mixture were calculated based on the theoretical formula and it was a function of temperature. Heat transfer and effect of the nanoparticle concentration on the junction temperature of the processors using CFD techniques were simulated on an open commute server with two processors in a row. The junction temperature was studied for different flow rates of 0.5, 1, 2, and 3 LPM, at inlet temperatures of 25, 35, and 45 degrees Celsius. The chosen heatsink geometries were: Parallel plate, Pin fin, and Plate fin heatsinks.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115379146","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials 三维结构材料的原子层沉积表面工程

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2020-10-27 DOI: 10.1115/ipack2020-2613

Nhi V. Quach, Q. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-seong Park, Y. Won

{"title":"Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials","authors":"Nhi V. Quach, Q. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-seong Park, Y. Won","doi":"10.1115/ipack2020-2613","DOIUrl":"https://doi.org/10.1115/ipack2020-2613","url":null,"abstract":"\u0000 Atomic layer deposition (ALD) is effective in depositing conformal thin films, which is highly favorable for coating various patterned surfaces. These coatings serve as barrier layers in addition to surface modifications to improve wettability of porous structures, such as meshes and membrane channels. However, it has been challenging to conformally deposit hydrophilic thin films on three-dimensionally (3D) designed, more complicated architectures. To understand the effect of surface modifications on 3D structures’ surface properties, we deposit thin silica films via ALD on hydrophobic porous media, which is nickel inverse opal structures in this case. The silica thin film is used to improve hydrophilicity without modifying the geometries of the microporous structure such as porosity, pore size, and metal type. We study the consequences of applying silica coatings to the 3D structure in comparison to flat surface counterpart. The hydrophilicity effects of ALD coating on porous structures and flat nickel surfaces are approximately the same with a result of decreasing apparent static contact angle of approximately 30°. In relation, the Fowkes method reveals the surface energy of the ALD silica samples increases by a factor of 1.3. Thermal stability of the coating is tested, revealing a relative degradation with increasing thermal cycling, most likely associated with the adsorption species on the thin film surface. The droplet spreading rate is analyzed in addition to droplet volume loss to estimate the liquid penetration rate into the structure, if any. Condensation rate and condensate growth show that despite having lower droplet nucleation in comparison to a flat surface, the droplet area growth on inverse opal regions is larger. These findings showcase potential improvements to 3D microporous structures by employing ALD coating for fluid transport through the porous media.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125543762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0